Multichannel RF feedthroughs
Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.
1. A multichannel RF feedthrough comprising:
a housing defining an interior;
an internal portion including an internal top surface of the RF feedthrough on which first and second sets of traces are formed, each set of traces configured as an electrical communication channel to carry electrical data signals;
an external portion located external to the interior defined by the housing, the external portion including a bottom surface of the RF feedthrough on which the first set of traces is formed and an external top surface of the RF feedthrough on which the second set of traces is formed; and
a set of vias defined in the RF feedthrough, the set of vias connecting the first set of traces between the internal top surface and the bottom surface,
wherein the internal top surface is coplanar with the external top surface.
2. The multichannel RF feedthrough as recited in claim 1 , further comprising a ground shield positioned between the external top surface and the bottom surface.
3. The multichannel RF feedthrough as recited in claim 1 , further comprising a second set of vias defined in the RF feedthrough, the second set of vias connecting the second set of traces between the internal top surface and the external top surface, wherein the internal top surface is not coplanar with the external top surface, and the internal top surface is positioned about half-way between the external top surface and the bottom surface.
4. The multichannel RF feedthrough as recited in claim 3 , wherein the set of vias and the second set of vias have a balanced distribution.
5. The multichannel RF feedthrough as recited in claim 1 , wherein spacing between traces is greater on the external top surface and the bottom surface than on the internal top surface.
6. An optical subassembly (OSA) comprising:
a housing defining an interior;
an optical transducer positioned within the interior of the housing;
an optical port defined by the housing through which optical data signals can pass between the optical transducer and an optical fiber; and
a multichannel RF feedthrough formed in the housing, the multichannel RF feedthrough including:
an internal portion including an internal top surface of the RF feedthrough on which first and second sets of traces are formed, each set of traces configured as an electrical communication channel to carry electrical data signals to or from the optical transducer;
an external portion located external to the interior defined by the housing, the external portion including a bottom surface of the RF feedthrough on which the first set of traces is formed and an external top surface of the RF feedthrough on which the second set of traces is formed; and
a set of vias defined in the RF feedthrough, the set of vias connecting the first set of traces between the internal top surface and the bottom surface,
wherein the internal top surface is coplanar with the external top surface.
7. The OSA as recited in claim 6 , wherein the multichannel RF feedthrough further includes a ground shield positioned between the external top surface and the bottom surface, the ground shield being electrically grounded to ground traces in the first and second sets of traces.
8. The OSA as recited in claim 6 , wherein the internal top surface is not coplanar with the external top surface.
9. The OSA as recited in claim 8 , wherein the internal top surface is positioned about half-way between the external top surface and the bottom surface.
10. The OSA as recited in claim 9 , wherein the multichannel RF feedthrough further includes a second set of vias connecting the second set of traces between the internal top surface and the external top surface, and wherein the set of vias and the second set of vias have a balanced distribution.
11. The OSA as recited in claim 10 , wherein the length of each via in the set of vias and the second set of vias is about 0.5 mm.
12. The OSA as recited in claim 6 , wherein the distance between the external top surface and the bottom surface is about 1 mm.
13. The OSA as recited in claim 6 , wherein spacing between traces is greater on the external top surface and the bottom surface than on the internal top surface.