Glass substrate molding method
A glass substrate molding method includes: preparing a rotatable or wheelable molding die having a die surface and contacting the die surface with one of a pair of principal surfaces of a glass substrate made of a glass material containing an alkali metal oxide, the die having conductivity; keeping the one of principal surfaces contacted with the die surface at a temperature over 100° C. and equal to or lower than Tg+50° C.; applying direct-current voltage to the substrate to be higher voltage on the contacted one of principal surfaces than voltage on an opposite surface of the contacted one of principal surfaces; and rotating or wheeling the die and simultaneously moving the die or the substrate in a direction parallel to the contacted one of principal surfaces in conformity with rotation or wheeling speed of the die, to mold the contacted one of principal surfaces of the substrate.
1. A glass substrate molding method, comprising:
preparing a rotatable or wheelable molding die having a die surface and contacting the die surface with one of a pair of principal surfaces of a glass substrate made of a glass material containing an alkali metal oxide, the molding die having conductivity at least on the die surface;
keeping the one of the pair of principal surfaces of the glass substrate contacted with the die surface at a temperature over 100° C. and equal to or lower than Tg+50° C., where Tg indicates a glass transition temperature of the glass material;
applying a direct-current voltage to the glass substrate so as to be higher voltage on the contacted one of the pair of principal surfaces than voltage on an opposite surface of the contacted one of the pair of principal surfaces; and
rotating or wheeling the molding die and simultaneously moving the molding die or the glass substrate in a direction parallel to the contacted one of the pair of principal surfaces of the glass substrate in conformity with a rotation speed or a wheeling speed of the molding die, to mold the contacted one of the pair of principal surfaces of the glass substrate.
2. The glass substrate molding method according to claim 1 ,
wherein the molding die has a die surface with a fine pattern of a concave-convex shape.
3. The glass substrate molding method according to claim 1 ,
wherein the applying the direct-current voltage generates no corona discharge between the die surface and the one of the pair of principal surfaces.
4. The glass substrate molding method according to claim 1 , further comprising
etching the contacted one of the pair of principal surfaces after molding the contacted one of the pair of principal surfaces of the glass substrate.
5. The glass substrate molding method according to claim 1 ,
wherein the glass substrate is made of a glass material containing more than 15 mass % in total of an alkali metal oxide and an alkaline earth metal oxide.
6. The glass substrate molding method according to claim 1 ,
wherein, in the molding, the die surface of the molding die together with the contacted one of the pair of principal surfaces of the glass substrate is kept at a temperature over 100° C. and equal to or lower than Tg+50° C.
7. The glass substrate molding method according to claim 1 ,
wherein the direct-current voltage is in a range of 1 to 1000 V.
8. The glass substrate molding method according to claim 1 ,
wherein, in the molding, a pressure of 0.1 MPa to 10 MPa is applied to the contacted one of the pair of principal surfaces of the glass substrate.
9. The glass substrate molding method according to claim 1 ,
wherein the molding is carried out in an atmosphere of mainly air or nitrogen.
10. The glass substrate molding method according to claim 1 ,
wherein the direct-current voltage is applied to the glass substrate disposed on a conductive base so as to be a positive electrode on the die surface of the molding die and to be ground or a negative electrode on the base.
11. A glass substrate molding method, comprising:
preparing a rotatable or wheelable molding die having a die surface and contacting the die surface with one of a pair of principal surfaces of a glass substrate made of a glass material containing an alkali metal oxide, the molding die having conductivity at least on the die surface;
keeping the one of the pair of principal surfaces of the glass substrate contacted with the die surface at a temperature over 100° C. and equal to or lower than Tg+50° C., where Tg indicates a glass transition temperature of the glass material;
applying a direct-current voltage to the glass substrate so as to be positive on the contacted one of the pair of principal surfaces and to be ground or negative on an opposite surface of the contacted one of the pair of principal surfaces; and
rotating or wheeling the molding die and simultaneously moving the molding die or the glass substrate in a direction parallel to the contacted one of the pair of principal surfaces of the glass substrate in conformity with a rotation speed or a wheeling speed of the molding die, to mold the contacted one of the pair of principal surfaces of the glass substrate.
12. The glass substrate molding method according to claim 11 ,
wherein the molding die has a die surface with a fine pattern of a concave-convex shape.
13. The glass substrate molding method according to claim 11 ,
wherein the applying the direct-current voltage generates no corona discharge between the die surface and the one of the pair of principal surfaces.
14. The glass substrate molding method according to claim 11 , further comprising
etching the contacted one of the pair of principal surfaces after molding the contacted one of the pair of principal surfaces of the glass substrate.
15. The glass substrate molding method according to claim 11 ,
wherein the glass substrate is made of a glass material containing more than 15 mass % in total of an alkali metal oxide and an alkaline earth metal oxide.
16. The glass substrate molding method according to claim 11 ,
wherein, in the molding, the die surface of the molding die together with the contacted one of the pair of principal surfaces of the glass substrate is kept at a temperature over 100° C. and equal to or lower than Tg+50° C.
17. The glass substrate molding method according to claim 11 ,
wherein the direct-current voltage is in a range of 1 to 1000 V.
18. The glass substrate molding method according to claim 11 ,
wherein, in the molding, a pressure of 0.1 MPa to 10 MPa is applied to the contacted one of the pair of principal surfaces of the glass substrate.
19. The glass substrate molding method according to claim 11 ,
wherein the molding is carried out in an atmosphere of mainly air or nitrogen.
20. The glass substrate molding method according to claim 11 ,
wherein the direct-current voltage is applied to the glass substrate disposed on a conductive base so as to be a positive electrode on the die surface of the molding die and to be ground or a negative electrode on the base.