Solar cell having a plurality of sub-cells coupled by cell level interconnection
Methods of fabricating solar cells having a plurality of sub-cells coupled by cell level interconnection, and the resulting solar cells, are described herein. In an example, a solar cell includes a plurality of sub-cells. Each of the plurality of sub-cells includes a singulated and physically separated semiconductor substrate portion. Each of the plurality of sub-cells includes an on-sub-cell metallization structure interconnecting emitter regions of the sub-cell. An inter-sub-cell metallization structure couples adjacent ones of the plurality of sub-cells. The inter-sub-cell metallization structure is different in composition from the on-sub-cell metallization structure.
1. A solar cell, comprising:
a plurality of sub-cells, each of the plurality of sub-cells comprising a singulated and physically separated semiconductor substrate portion, and each of the plurality of sub-cells comprising an on-sub-cell metallization structure interconnecting emitter regions of the sub-cell, the on-sub-cell metallization structure located on a back surface of the plurality of sub-cells; and
an inter-sub-cell metallization structure coupling each of the plurality of sub-cells, wherein the inter-sub-cell metallization structure is different in composition from the on- sub-cell metallization structure and is located on the back surface of the plurality of sub- cells, the inter-sub-cell metallization structure comprising a conductive feature overlying and exposed by a corresponding scribe line between adjacent ones of the plurality of sub- cells, the conductive feature having a longest length along a same direction as a longest length of the scribe line, wherein the scribe line comprises an opening at an end of the scribe line opposite the conductive feature, wherein the conductive feature does not extend into the scribeline between adjacent ones of the plurality of sub-cells, and wherein a solder paste layer comprising aluminum/silicon alloy particles bonds the on-sub-cell metallization structure and conductive feature.
2. The solar cell of claim 1 , wherein the inter-sub-cell metallization structure comprises a plurality of metal ribbons coupling corresponding adjacent ones of the plurality of sub-cells.
3. The solar cell of claim 2 , wherein the plurality of metal ribbons is disposed on the solder paste layer disposed at adjacent outer perimeters of the corresponding adjacent ones of the plurality of sub-cells.
4. The solar cell of claim 2 , wherein each of the plurality of metal ribbons has a thickness approximately in the range of 50-300 microns.
5. The solar cell of claim 2 , wherein each of the ribbons comprises one or more holes along an approximate center of the ribbon.
6. The solar cell of claim 5 , wherein the one or more holes are a stress relief feature in the ribbon.
7. The solar cell of claim 2 , wherein each of the plurality of metal ribbons includes an intervening tab extending between corresponding adjacent ones of the plurality of sub-cells.
8. The solar cell of claim 7 , wherein the intervening tab is a removable intervening tab.
9. The solar cell of claim 1 , wherein the on-sub-cell metallization structure comprises a metal seed layer.
10. The solar cell of claim 9 , wherein the on-sub-cell metallization structure consists only of the metal seed layer.
11. The solar cell of claim 1 , wherein each of the sub-cells has approximately a same voltage characteristic and approximately a same current characteristic.
12. The solar cell of claim 1 , wherein the plurality of sub-cells is a plurality of in-series diodes.
13. A solar cell, comprising:
a plurality of sub-cells, each of the plurality of sub-cells comprising a singulated and physically separated semiconductor substrate portion, and each of the plurality of sub-cells comprising an on-sub-cell metallization structure interconnecting emitter regions of the sub-cell, the on-sub-cell metallization structure located on a back surface of the plurality of sub-cells, and the on-sub-cell metallization comprising a plated metal; and
an inter-sub-cell metallization structure coupling adjacent ones of the plurality of sub-cells, wherein the inter-sub-cell metallization structure comprises a plurality of metal ribbons, the inter-sub-cell metallization structure comprising a conductive feature overlying and exposed by a corresponding scribe line between adjacent ones of the plurality of sub-cells, the conductive feature having a longest length along a same direction as a longest length of the scribe line, wherein the scribe line comprises an opening at an end of the scribe line opposite the conductive feature, wherein the conductive feature does not extend into the scribeline between adjacent ones of the plurality of sub-cells, and wherein a solder paste layer comprising aluminum/silicon alloy particles bonds the on-sub-cell metallization structure and conductive feature.
14. The solar cell of claim 13 , wherein each of the plurality of metal ribbons has a thickness approximately in the range of 50-300 microns.
15. The solar cell of claim 13 , wherein each of the ribbons comprises one or more holes along an approximate center of the ribbon.
16. The solar cell of claim 15 , wherein the one or more holes are a stress relief feature in the ribbon.
17. The solar cell of claim 13 , wherein each of the plurality of metal ribbons includes an intervening tab extending between corresponding adjacent ones of the plurality of sub-cells.
18. The solar cell of claim 17 , wherein the intervening tab is a removable intervening tab.
19. The solar cell of claim 13 , wherein the plated metal comprises a copper layer.
20. The solar cell of claim 13 , wherein the plurality of metal ribbons comprises aluminum foil.