Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board
A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes simultaneously extruding a plurality of materials according to the structure of the Z-directed component to form an extruded object and forming the Z-directed component from the extruded object. In one embodiment, the extruded object is divided into individual Z-directed components. In one embodiment, the timing of extrusion between predetermined sections of one of the materials is varied in order to stagger the sections in the extruded object.
1. A method for manufacturing a plurality of Z-directed components each for insertion into a respective mounting hole in a printed circuit board, comprising:
simultaneously extruding a plurality of materials in the cross-sectional shape of a Z-directed component to form an extruded object with the plurality of materials arranged relative to each other in operative positions of the plurality of materials for electrical function of the Z-directed component;
dividing the extruded object into a plurality of segments; and
curing each of the plurality of segments to form a plurality of individual Z-directed components each insertable into a respective mounting hole in a printed circuit board.
2. The method of claim 1 , wherein said extruding the plurality of materials in the cross-sectional shape of the Z-directed component includes extruding the plurality of materials in a lengthwise direction of the Z-directed component.
3. The method of claim 2 , wherein the plurality of materials extend lengthwise through substantially the entire extruded object.
4. The method of claim 1 , wherein said extruding the plurality of materials in the cross-sectional shape of the Z-directed component includes forcing the plurality of materials through a chamber of an extrusion die to form the extruded object, a portion of the chamber including a barrier that separates different materials from each other and defines the positions of the materials relative to each other.
5. The method of claim 4 , wherein a diameter of the chamber and a thickness of the barrier narrow in a downstream direction of extrusion.
6. The method of claim 1 , wherein one of the plurality of extruded materials is a conductive material that forms a conductive channel in each of the plurality of individual Z-directed components.
7. The method of claim 6 , further comprising applying a conductive trace to one of a top surface and a bottom surface of at least one of the plurality of individual Z-directed components that connects with the conductive channel of said Z-directed component to provide an interconnection between the conductive channel of said Z-directed component and a trace on the printed circuit board.
8. The method of claim 6 , wherein the extruded conductive material extends to a side surface of each of the plurality of individual Z-directed components to provide an interconnection between the conductive channel of each Z-directed component and a respective trace on the printed circuit board.
9. The method of claim 6 , further comprising applying a layer of insulator on one of a top surface and a bottom surface of at least one of the plurality of individual Z-directed components to protect a portion of the extruded conductive material that is exposed at the respective top or bottom surface of said Z-directed component.
10. The method of claim 6 , further comprising twisting the extruded object while forcing the extruded object through the chamber to cause the conductive channel to spiral in at least one of the plurality of individual Z-directed components.
11. The method of claim 1 , further comprising compressing at least one of the plurality of individual Z-directed components with a plug that includes a recess formed in an end thereof having a tapered rim around a periphery of the recess to form a corresponding taper in one of a top surface and a bottom surface of said Z-directed component.