IP Library Granted Patent US 10,076,065
Granted Patent B2
US 10,076,065 · App. 15/398,173 · Granted Sep 11, 2018

Liquid cooling system with a displacement appendage for an information handling system

Inventors: Chin-An Huang (Taipei, TW); Austin M. Shelnutt (Leander, TX); Chia-Chuan Yu (New Taipei, TW)
Assignee: DELL PRODUCTS, LP
H05K7/20809F28F27/00H05K7/20336F28F2265/14
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Quick Facts
Patent No.
US 10,076,065
App. No.
15/398,173
Granted
Sep 11, 2018
Kind
B2
Abstract

A liquid cooling system for a server includes a heat pipe and a displacement appendage fluidly coupled to the heat pipe. The displacement appendage includes a displacement element which is compressible under pressure.

Claims (34)

1. A liquid cooling system for a server, comprising:

a heat pipe;

a displacement appendage fluidly coupled to the heat pipe, the displacement appendage including a displacement element that is compressible under a pressure;

a liquid coupling fluidly coupled to the heat pipe and configured to receive cooling liquid; and

a check valve coupled to the heat pipe, wherein the displacement appendage is positioned between the check valve and the liquid coupling.

2. The liquid cooling system of claim 1 , further comprising:

an encapsulation forming a portion of the displacement appendage, wherein the encapsulation defines an encapsulation chamber, the encapsulation chamber encompassing the displacement element.

3. The liquid cooling system of claim 2 , wherein the encapsulation chamber is in fluid communication with the heat pipe.

4. The liquid cooling system of claim 3 , wherein a portion of the displacement appendage is extruded from the heat pipe.

5. The liquid cooling system of claim 2 , wherein the displacement element is an elastically compressible displacement element.

6. The liquid cooling system of claim 2 , further comprising:

a coupling providing a fluid coupling fluidly coupling the encapsulation chamber to the heat pipe, wherein a size of the fluid coupling is smaller than a size of the displacement element.

7. A server comprising:

a plurality of processing elements;

a liquid cooling system including a heat pipe fluidly coupled to a liquid coupling for receiving cooling fluid to absorb heat generated by the processing elements;

a displacement appendage appended to the heat pipe and fluidly coupled to the heat pipe, the displacement appendage including a displacement element that is compressible under a pressure; and

an encapsulation forming a portion of the displacement appendage, wherein the encapsulation defines an encapsulation chamber, the encapsulation chamber encompassing the displacement element and wherein:

the encapsulation chamber is in fluid communication with the heat pipe; and

a portion of the displacement appendage is extruded from the heat pipe.

8. The server of claim 7 , wherein the displacement element is an elastically compressible displacement element.

9. The server of claim 8 , wherein the liquid coupling couples to a server rack.

10. The server of claim 7 , further comprising:

a coupling providing a fluid coupling fluidly coupling the encapsulation chamber to the heat pipe, wherein a size of the fluid coupling is smaller than a size of the displacement element.

11. The server of claim 7 , further comprising a check valve, the check valve coupled to the heat pipe, wherein the displacement appendage is positioned between the check valve and the liquid coupling.

12. A liquid cooling system for a server, comprising:

a heat pipe;

a first liquid coupling coupled to the heat pipe and configured to receive cooling liquid from a server rack;

a second liquid coupling coupled to the heat pipe and configured to provide cooling liquid to the server rack;

a heat exchanger coupled to the heat pipe between the first liquid coupling and the second liquid coupling; and

a displacement appendage appended to the heat pipe and fluidly coupled to the heat pipe, the displacement appendage including a displacement element and an encapsulation defining an encapsulation chamber encompassing the displacement element, wherein the displacement element is compressible under a pressure.

13. The liquid cooling system of claim 12 , wherein the encapsulation chamber is in fluid communication with the heat pipe.

14. The liquid cooling system of claim 12 , further comprising:

a coupling providing a fluid coupling fluidly coupling the encapsulation chamber to the heat pipe, wherein a size of the fluid coupling is smaller than a size of the displacement element.

15. The liquid cooling system of claim 14 , further comprising a check valve, the check valve coupled to the heat pipe, wherein the displacement appendage is positioned between the check valve and the first liquid coupling.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (041829/0873) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.)
Reel/Frame 059803/0724 →
RELEASE OF SECURITY INTEREST AT REEL 041808 FRAME 0516 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL INTERNATIONAL, L.L.C.; DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; MOZY, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058297/0573 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY INTEREST (NOTES) Recorded Feb 28, 2017
From: DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; MOZY, INC.; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 041829/0873 →
PATENT SECURITY INTEREST (CREDIT) Recorded Feb 24, 2017
From: DELL INTERNATIONAL, L.L.C.; DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; MOZY, INC.; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 041808/0516 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2017
From: HUANG, CHIN-AN; SHELNUTT, AUSTIN M.; YU, CHIA-CHUAN
To: DELL PRODUCTS, LP
Reel/Frame 041144/0278 →
Continuity (1)
Related Publication 20180192553A1 · Jul 5, 2018