Chassis external wall cooling system
An external chassis wall liquid cooling system includes a chassis defining a chassis housing. A chassis wall is located on the chassis and includes a first surface that is located adjacent the chassis housing and a second surface that is located opposite the chassis wall from the first surface and that provides an outer surface of the chassis. A liquid cooling channel is defined by the chassis wall and extends through the chassis wall between the first surface and the second surface. A liquid is located in the liquid cooling channel, and a pump is coupled to the liquid cooling channel and configured to move the liquid through the liquid cooling channel. A fan system in the chassis housing may move air past heat producing components to transfer heat produced by those heat producing components, and the liquid may further dissipate that heat out of the chassis.
1. A liquid cooling system, comprising:
a chassis wall that is provided on a chassis and that includes:
a first surface that is located adjacent at least a portion of a chassis space that is defined by the chassis;
a second surface that is located opposite the chassis wall from the first surface and that provides at least a portion of an external surface of the chassis;
a plurality of heat transfer members that extend from the chassis wall to provide at least a portion of the external surface;
a serpentine cooling channel that is routed within the chassis wall between the first surface and the second surface and configured to couple to an adjacent cooling channel of an adjacent chassis wall that extends from the chassis wall, wherein the serpentine cooling channel is configured to channel a coolant through at least a portion of the chassis wall; and
a liquid moving system that is located within the chassis wall between the first surface and the second surface, that is coupled to the serpentine cooling channel, and that is configured to move the coolant through the serpentine cooling channel.
2. The liquid cooling system of claim 1 , wherein the chassis wall is integrated into the chassis such that the first surface on the chassis wall defines the at least the portion of the chassis space.
3. The liquid cooling system of claim 1 , wherein the chassis wall is coupled to the chassis and engages an outer surface of the chassis such that the first surface is located opposite at least a portion of the chassis from the chassis space.
4. The liquid cooling system of claim 1 , further comprising:
at least one cooling conduit that is coupled to the serpentine cooling channel and that extends through the chassis space, wherein the at least one cooling conduit is configured to move the coolant adjacent at least one component in the chassis space.
5. The liquid cooling system of claim 1 , wherein the liquid moving system includes:
a liquid reservoir that is coupled to the serpentine cooling channel and houses the coolant; and
a pump that is coupled to the reservoir and configured to circulate the coolant between the liquid reservoir and the serpentine cooling channel.
6. An information handling system (IHS), comprising:
a chassis that defines a chassis space;
a processing system that is located in the chassis space;
a memory system that is located in the chassis space and that is coupled to the processing system;
a chassis wall that is provided on the chassis and that includes:
a first surface that is located adjacent at least a portion of the chassis space;
a second surface that is located opposite the chassis wall from the first surface and that provides at least a portion of an external surface of the chassis;
a plurality of heat transfer members that extend from the chassis wall to provide at least a portion of the external surface, wherein each of the plurality of heat transfer members defines a coolant cavity; and
a cooling channel that is defined by the chassis wall between the first surface and the plurality of heat transfer members and configured to couple to an adjacent cooling channel of an adjacent chassis wall that extends from the chassis wall, wherein the cooling channel is configured to channel a coolant through at least a portion of the chassis wall and through the coolant cavity defined by each of the plurality of heat transfer members; and
a liquid moving system that is located within the chassis wall between the first surface and the second surface, that is coupled to the cooling channel, and that is configured to move the coolant through the cooling channel.
7. The IHS of claim 6 , wherein the chassis wall is integrated into the chassis such that the first surface on the chassis wall defines the at least the portion of the chassis space.
8. The IHS of claim 6 , wherein the chassis wall is coupled to the chassis and engages an outer surface of the chassis such that the first surface is located opposite at least a portion of the chassis from the chassis space.
9. The IHS of claim 6 , further comprising:
at least one cooling conduit that is coupled to the cooling channel and that extends through the chassis space and adjacent the processing system.
10. The IHS of claim 6 , wherein the liquid moving system includes:
a liquid reservoir that is coupled to the cooling channel and that houses the coolant; and
a pump that is coupled to the reservoir and configured to circulate the coolant between the liquid reservoir and the serpentine cooling channel.
11. The IHS of claim 6 , wherein the chassis space is free of a fan system.
12. A method for providing liquid cooling using an external chassis wall, comprising:
operating at least one heat producing component that is located in a chassis, wherein a chassis wall is provided on the chassis and includes:
a first surface that is located adjacent at least a portion of a chassis space defined by the chassis; and
a second surface that is located opposite the chassis wall from the first surface and that provides at least a portion of an external surface of the chassis;
a plurality of heat transfer members that extend from the chassis wall to provide at least a portion of the external surface; and
moving a coolant through a serpentine coolant channel that is routed within the chassis wall between the first surface and the second surface and that is configured to couple to an adjacent cooling channel of an adjacent chassis wall that extends from the chassis wall, wherein the coolant is moved by a liquid moving system that is located within the chassis wall between the first surface and the second surface and that is coupled to the serpentine cooling channel; and
transferring heat produced by the operation of the least one heat producing component out of the chassis using the coolant.
13. The method of claim 12 , wherein the chassis wall is integrated into the chassis such that the first surface on the chassis wall defines at least a portion of the chassis space defined by the chassis.
14. The method of claim 12 , wherein the chassis wall is coupled to the chassis and engages an outer surface of the chassis such that the first surface is located opposite at least a portion of the chassis from the chassis space that is defined by the chassis.
15. The method of claim 12 , further comprising:
moving the coolant through at least one cooling conduit that is coupled to the serpentine cooling channel and that extends through the chassis and adjacent the at least one heat producing component.
16. The method of claim 12 , further comprising:
transferring the heat produced by the operation of the at least one heat producing component out of the chassis using the plurality of heat transfer members that extend from the chassis wall to provide the at least a portion of the external surface.
17. The method of claim 12 , further comprising:
moving, by a pump included in the liquid moving system, the coolant from a liquid reservoir included in the liquid moving system and into the serpentine cooling channel.
18. The method of claim 12 , wherein the chassis is free of a fan system.