Electronic device with laterally extending thermally conductive body and related methods
View Patent ↗An electronic device may include a circuit board, an IC carried by the circuit board, and an RF shield above the IC. The circuit board may include a dielectric layer, and a thermally conductive body in the dielectric layer. The thermally conductive body may have a first heat transfer surface coupled to the IC. The thermally conductive body may extend laterally within the dielectric layer and outward past the RF shield and defining a second heat transfer surface. The electronic device may include a heat sink coupled to the second heat transfer surface.
1. An electronic device comprising:
a circuit board;
an integrated circuit (IC) carried by said circuit board;
a radio frequency (RF) shield above said IC;
said circuit board comprising a dielectric layer, and a thermally conductive body in said dielectric layer, said thermally conductive body having a first heat transfer surface coupled to the IC;
said thermally conductive body extending laterally within said dielectric layer and outward past said RF shield and defining a second heat transfer surface; and
a heat sink coupled to said second heat transfer surface and separate from said RF shield.
2. The electronic device of claim 1 wherein said first and second heat transfer surfaces are coplanar.
3. The electronic device of claim 1 wherein said circuit board comprises a top surface adjacent said IC, and a bottom surface opposite the top surface; and further comprising an additional IC carried by said bottom surface.
4. The electronic device of claim 3 wherein said thermally conductive body extends only partially through the dielectric layer and is not exposed on the bottom surface.
5. The electronic device of claim 1 wherein said heat sink comprises a base adjacent said second heat transfer surface, and an arm extending transversely to said base and over said RF shield.
6. The electronic device of claim 1 wherein said thermally conductive body has flanged peripheral edges.
7. The electronic device of claim 1 wherein said thermally conductive body is coupled to an electrical reference voltage for said IC.
8. The electronic device of claim 1 wherein said thermally conductive body comprises copper.
9. The electronic device of claim 1 wherein said circuit board comprises a thermal dam adjacent said IC.
10. The electronic device of claim 1 further comprising a thermal adhesive layer between said second heat transfer surface and said heat sink.
11. A method for making an electronic device comprising:
positioning an integrated circuit (IC) on a circuit board and beneath a radio frequency (RF) shield;
the circuit board comprising a dielectric layer, and a thermally conductive body in the dielectric layer, the thermally conductive body having a first heat transfer surface coupled to the IC, and the thermally conductive body extending laterally within the dielectric layer and outward past the RF shield and defining a second heat transfer surface; and
coupling a heat sink to the second heat transfer surface, the heat sink being separate from the RF shield.
12. The method of claim 11 wherein the first and second heat transfer surfaces are coplanar.
13. The method of claim 11 wherein the circuit board comprises a top surface adjacent the IC, and a bottom surface opposite the top surface; and further comprising an additional IC carried by the bottom surface.
14. The method of claim 13 wherein the thermally conductive body extends only partially through the dielectric layer and is not exposed on the bottom surface.
15. The method of claim 11 wherein the heat sink comprises a base adjacent the second heat transfer surface, and an arm extending transversely to the base and over the RF shield.
16. The method of claim 11 wherein the thermally conductive body has flanged peripheral edges.