Manufacturing method of semiconductor device and semiconductor manufacturing apparatus
View Patent ↗A manufacturing method of a semiconductor device according to the present invention comprises cleaning a semiconductor substrate. A first chemical liquid for forming a water-repellent protection film and a second chemical liquid coating the first chemical liquid are supplied on a surface of the semiconductor substrate. Alternatively, the semiconductor substrate is immersed in the first chemical liquid coated with the second chemical liquid. The semiconductor substrate is then dried.
1. A semiconductor manufacturing apparatus comprising:
a cleaning-liquid supply part supplying a cleaning liquid cleaning a semiconductor substrate to a surface of the semiconductor substrate; and
a chemical-liquid supply part supplying a first chemical liquid for forming a water-repellent protection film and a second chemical liquid coating the first chemical liquid on the surface of the semiconductor substrate without mixing with the first chemical liquid, wherein
the chemical-liquid supply part has a double piping structure comprising a first pipe supplying the first chemical liquid and a second pipe supplying the second chemical liquid, wherein the second pipe is provided to surround an outer circumference of the first pipe.
2. The apparatus of claim 1 , wherein the chemical-liquid supply part simultaneously supplies the first chemical liquid and the second chemical liquid on the surface of the semiconductor substrate.
3. The apparatus of claim 1 , wherein the chemical-liquid supply part simultaneously supplies the first chemical liquid and the second chemical liquid on the surface of the semiconductor substrate.
4. The apparatus of claim 1 , wherein the chemical-liquid supply part supplies the second chemical liquid on the surface of the semiconductor substrate after supplying the first chemical liquid.
5. The apparatus of claim 1 , wherein the chemical-liquid supply part supplies the second chemical liquid on the surface of the semiconductor substrate after supplying the first chemical liquid.
6. The apparatus of claim 1 , wherein the first chemical liquid is a soluble water-repellent agent and the second chemical liquid is an insoluble chemical liquid, or the first chemical liquid is an insoluble water-repellent agent and the second chemical liquid is a soluble chemical liquid.
7. The apparatus of claim 1 , wherein a specific gravity of the second chemical liquid is lower than a specific gravity of the first chemical liquid.
8. The apparatus of claim 1 , wherein a specific gravity of the second chemical liquid is lower than a specific gravity of the first chemical liquid.