Flexible support substrate for transfer of semiconductor devices
An apparatus for transferring a semiconductor die from a wafer tape to a product substrate. The apparatus includes a wafer frame configured to hold the wafer tape and a support frame disposed adjacent to the wafer frame. A flexible support substrate is secured in the support frame and is configured to support the product substrate. The apparatus further includes an actuator configured to position the semiconductor die at a transfer position with respect to the product substrate. An energy-emitting device is configured to direct energy through the flexible support substrate to a portion of the product substrate corresponding to the transfer position at which the semiconductor die is positioned to be affixed to the product substrate.
1. An apparatus for transferring a semiconductor die from a wafer tape to a product substrate, the apparatus comprising:
a wafer frame configured to hold the wafer tape;
a support frame disposed adjacent to the wafer frame;
a flexible support substrate secured in the support frame, the flexible support substrate configured to secure the product substrate;
an actuator configured to position the semiconductor die at a transfer position with respect to the product substrate; and
an energy-emitting device configured to direct energy through the flexible support substrate to a portion of the product substrate corresponding to the transfer position at which the semiconductor die is positioned to be affixed to the product substrate.
2. The apparatus according to claim 1 , further comprising a controller communicatively coupled to the wafer and support frames, the controller including memory having instructions, which when executed, cause:
the wafer frame to be oriented such that the semiconductor die is aligned with the transfer position; and
the support frame to be oriented such that the portion of the product substrate is aligned with the transfer position.
3. The apparatus according to claim 1 , further comprising:
a first sensor positioned to sense a position of the semiconductor die with respect to the transfer position; and
a second sensor positioned to sense a position of the product substrate with respect to the transfer position.
4. The apparatus according to claim 1 , wherein the energy-emitting device is configured to emit energy as light having a preselected wavelength, the wavelength of the light being preselected based at least in part on:
a level of absorption of the preselected wavelength by the flexible support substrate; and
a level of absorption of the preselected wavelength by the product substrate.
5. The apparatus according to claim 1 , wherein the flexible support substrate includes holes, and
wherein the product substrate is securable to the flexible support substrate via the holes aligning with respective protrusions on the product substrate.
6. The apparatus according to claim 1 , wherein the product substrate includes holes, and
wherein the product substrate is securable to the flexible support substrate via the holes aligning with respective protrusions on the flexible support substrate.
7. The apparatus according to claim 1 , wherein the flexible support substrate has a plurality of holes, each respective hole of the plurality of holes aligning with the respective transfer position of a respective semiconductor die.
8. An apparatus to affix a semiconductor die to a product substrate, the apparatus comprising:
a support substrate frame to secure a flexible support substrate, the flexible support substrate having a first side and a second side, the product substrate being securable to the first side of the flexible support substrate;
a die substrate frame to secure a die substrate having the semiconductor die, the die substrate frame being disposed adjacent to the first side of the flexible support substrate;
a die separation device configured to separate the semiconductor die from the die substrate and cause the semiconductor die to contact a circuit trace on the product substrate; and
a fixing element to affix the semiconductor die to the product substrate.
9. The apparatus according to claim 8 , wherein the fixing element affixes the semiconductor die to the circuit trace on the product substrate.
10. The apparatus according to claim 8 , wherein the fixing element includes an energy-emitting device, the fixing element emitting energy at an area of the product substrate at which the semiconductor die is positioned on the product substrate.
11. The apparatus according to claim 8 , wherein the die substrate frame and the support substrate frame are movable independently or simultaneously.
12. The apparatus according to claim 8 , wherein the product substrate includes holes, and
wherein the product substrate is securable to the flexible support substrate via the holes interacting with protrusions on the flexible support substrate.
13. An apparatus for affixing an electronically-actuatable element to a product substrate, the apparatus comprising:
a transfer mechanism to transfer the electrically-actuatable element from a wafer tape to a transfer fixing location on the product substrate;
a flexible support substrate to which the product substrate is couplable during transfer of the electrically-actuatable element; and
a fixing mechanism disposed adjacent the transfer fixing location to affix the electrically-actuatable element to the product substrate upon actuation of the transfer mechanism.
14. The apparatus according to claim 13 , further comprising a sensor configured to determine a position of the electrically-actuatable element relative to the transfer fixing location.
15. The apparatus according to claim 13 , further comprising a sensor configured to determine a position of the product substrate with respect to the transfer fixing location.
16. The apparatus according to claim 13 , further comprising a controller configured to activate the fixing mechanism when the electronically-actuatable element is positioned at the transfer fixing location.
17. The apparatus according to claim 13 , further comprising a controller configured to control movement of the flexible support substrate relative to the transfer mechanism.
18. The apparatus according to claim 13 , wherein the fixing mechanism includes a laser emitting a predefined wavelength of light, the predefined wavelength of light being preselected based at least in part on:
a level of absorption of the predefined wavelength of light by the flexible support substrate; and
a level of absorption of the predefined wavelength of light by the product substrate.
19. The apparatus according to claim 13 , wherein the flexible support substrate includes a plurality of holes, at least one hole of the plurality of holes aligning with the transfer fixing location of the electrically-actuatable element.
20. The apparatus according to claim 13 , wherein the product substrate includes holes, and
wherein the product substrate is securable to the flexible support substrate via the holes interacting with protrusions on the flexible support substrate.