Method of processing calibration data in 3D laser scanner systems

1. An apparatus, comprising:

a laser source situated to generate at least one process beam;

a scan system situated to receive the process beam and including one or more scan optics situated to direct the process beam to a position in a laser processing field associated with a target; and

a controller coupled to the laser source and scan system and situated to direct the process beam in the laser processing field based on a set of scan optic actuation corrections;

wherein the set of scan optic actuation corrections are determined from:

(a) a set of scan optic actuation rates associated with a set of initial reference scan optic actuation corrections stored in the controller, and

(b) a set of pattern position errors, wherein the set of pattern position errors corresponds to a difference between:

(i) a set of expected pattern positions, and

(ii) a set of measured pattern positions, wherein the set of measured pattern positions corresponds to process beam positions produced with the set of initial reference scan optic actuation corrections.

2. The apparatus of claim 1 , wherein the controller includes at least one processor and one or more computer-readable storage media including stored instructions that, responsive to execution by the at least one processor, cause the controller:

to compare the set of measured pattern positions to the set of expected pattern positions to determine the set of pattern position errors,

to curve fit the set of pattern position errors to a first function and to curve fit the set of initial reference scan optic actuation corrections to a second function, and

to modify the set of initial reference actuation corrections based on the first function and a derivative function of the second function, wherein the derivative function corresponds to the set of scan optic actuation rates.

3. The apparatus of claim 1 , wherein the set of initial reference scan optic actuation corrections corresponds to an analytical system model that includes laser scanning system dynamics associated with the one or more scan optics.

4. The apparatus of claim 1 , wherein the set of initial reference scan optic actuation corrections corresponds to a set of scan optic corrections obtained based on a previous calibration that determined a prior set of pattern position errors and a prior set of scan optic actuation rates.

5. The apparatus of claim 1 , wherein the one or more scan optics includes a pair of galvanometer scan mirrors and the scan optic actuation corrections correspond to respective mirror-rotation angles that direct the process beam to respective X and Y coordinates in the laser processing field of the laser system.

6. The apparatus of claim 1 , wherein the one or more scan optics includes a translatable Z-axis lens and the scan optic actuation corrections correspond to a Z coordinate position of a focal plane of the process beam in the laser processing field of the laser system.

7. The apparatus of claim 1 , wherein the field includes a plurality of adjacent scan fields and wherein the at least one process beam includes separate process beams that are directed into the respective scan fields with the scan system.

8. The apparatus of claim 1 , wherein the set of scan optic actuation rates corresponds to a spatial derivative function.

9. The apparatus of claim 2 , wherein the first function has a polynomial order of six or greater and the second function has a polynomial order of four or greater.

10. The apparatus of claim 7 , wherein the adjacent scan fields include an overlapping portion wherein an expected position of a first process beam of the separate process beams corresponds to an expected position of a second process beam of the separate process beams in the overlapping portion.

11. The apparatus of claim 1 , wherein the target includes a calibration pattern formed on a surface of the target that includes pattern features produced according to the set of expected pattern positions.

12. The apparatus of claim 11 , further comprising a coordinate measuring machine coupled to the calibration pattern so as to determine the set of measured pattern positions.

13. An apparatus, comprising:

a laser source situated to generate at least one process beam;

a scan system situated to receive the process beam and including one or more scan optics situated to direct the process beam to a position in a laser processing field associated with a target;

a coordinate measurement machine operable to measure actual beam positions of the process beam in the laser processing field; and

a controller coupled to the laser source, to the scan system, and to the coordinate measurement machine, the controller being operable to cause the apparatus to:

generate a first laser pattern by scanning the process beam to a first set of expected pattern positions, the scanning being based on a set of initial reference scan optic actuation corrections,

measure the first laser pattern to determine a set of measured pattern positions;

determine a set of pattern position errors, the pattern position errors corresponding to the differences between the set of measured pattern positions and the first set of expected pattern positions,

determine a set of scan optic actuation rates corresponding to a spatial derivative of a surface function that describes the set of initial reference scan optic actuation corrections, and

modify the initial reference set of scan optic actuation corrections, based on the set of scan optic actuation rates and the set of pattern position errors, to form a modified set of scan optic actuation corrections associated with a reduced scan position error.