Conductive stress-relief washers in microelectronic assemblies
Microelectronic device assembly including a component attached to substrate by at least a screw. The screw applies compressive force against a pad of a thermally and electrically conductive material having sufficiently low modulus to mitigate stress in addition to providing a thermal and electrical path between the component and the substrate. In some embodiments, the screw affixes a printed circuit board hosting one or more integrated circuit components to a motherboard, or passive heat sink. The pad may be deformed to assuage stress applied through the screw during assembly of the device and/or as the device experiences thermal cycling, for example associated with intermittent operation.
1. A microelectronic device assembly, comprising:
a first substrate;
a second substrate including one or more integrated circuit (IC) components electrically coupled to the second substrate;
a screw affixing the second substrate to the first substrate; and
an electrically and thermally conductive pad between a head of the screw and a metal feature on the first or second substrate, wherein the pad is deformed by a force maintained by the screw,
wherein the pad comprises a material having a hardness below 50 Shore C;
wherein the pad comprises a material having a thermal conductivity of at least 1 W/m-K; and
wherein the pad comprises a material having a volume resistivity no more than 1.0×10 4 Ω-cm.
2. The assembly of claim 1 , wherein the pad comprises a material having a hardness below 50 Shore A.
3. The assembly of claim 1 , wherein the pad comprises a material having a thermal conductivity of at least 30 W/m-K.
4. The assembly of claim 1 , wherein the pad comprises a material having a volume resistivity no more than 500 Ω-cm.
5. The assembly of claim 1 , wherein the pad has a thickness no greater than 1 mm and an outer diameter (OD) no more than 2 mm.
6. The assembly of claim 5 , wherein the pad OD is no larger than an OD of the screw head.
7. The assembly of claim 1 , wherein the pad comprises a material having:
a hardness no more than 50 Shore A;
a thermal conductivity of at least 30 W/m-K; and
a volume resistivity no more than 500 Ω-cm.
8. The assembly of claim 1 , wherein the pad comprises a material loaded with a conductive filler.
9. The assembly of claim 1 , wherein the material comprises silicone and the filler comprises at least one of carbon particles, metal particles, or metal-coated particles.
10. The assembly of claim 1 , wherein:
the first substrate comprises a first printed circuit board (PCB) including an edge connector socket and a screw mount, the screw mated to the screw mount, and the screw mount electrically coupled to a ground plane of the first PCB;
the second substrate comprises a second PCB having:
edge connector traces at a first edge of the second PCB mated with the edge connector socket;
one or more sockets or lands coupling the one or more IC components to the edge connector traces; and
a semicircular indent or through hole at a second edge of the second PCB, the screw extending through the indent or hole, wherein the metal feature comprises an electrically conductive trace adjacent to an edge of the indent or through hole and electrically coupled to a ground plane of the second PCB; wherein the pad comprises an annular washer surrounding the screw that is compressed between the screw head and the electrically conductive trace.
11. The assembly of claim 10 , wherein:
the one or more IC components comprise a plurality of non-volatile memory ICs; and
the edge connector and the screw mount are only physical connections between the first and second substrates.
12. The assembly of claim 1 , wherein the first substrate is a metal heat sink and the second substrate is a printed circuit board (PCB).
13. An electronic computing device, comprising:
a mother board including a screw mount electrically coupled to a ground plane of the motherboard, and an edge connector socket;
a solid state drive (SSD) including a plurality of non-volatile memory ICs mounted to a printed circuit board (PCB), the PCB having:
edge connector traces at a first edge of the PCB mated with the edge connector socket, the traces coupled to the memory ICs;
a semicircular indent or through hole at a second edge of the PCB; and
an electrically conductive trace adjacent to an edge of the indent or through hole, and electrically coupled to a ground plane of the PCB;
a screw affixing the PCB to the motherboard, the screw passing through the indent or hole; and
an annular washer surrounding the screw and located between a head of the screw and the electrically conductive trace, wherein:
the ground planes of the PCB and motherboard are electrically coupled through at least the washer;
the PCB is thermally coupled to the motherboard through at least the washer; and the washer is elastically deformed between a head of the screw and the PCB;
wherein the washer comprises a material having a hardness below 50 Shore C;
wherein the washer comprises a material having a thermal conductivity of at least 1 W/m-K; and
wherein the washer comprises a material having a volume resistivity no more than 1.0×10 4 Ω-cm.
14. The device of claim 13 , wherein the washer comprises a material loaded with a conductive filler.
15. The device of claim 14 , wherein:
the loaded material comprises silicone;
the filler comprises at least one of carbon particles, metal particles, or metal-coated particles; and the loaded material has:
a hardness no more than 50 Shore A;
a thermal conductivity of at least 30 W/m-K; and
a volume resistivity no more than 500 Ω-cm.
16. The device of claim 13 , further comprising:
a microprocessor electrically coupled to the motherboard; and
a chassis to which the motherboard is mounted.