Side launch contactless signal conduit structures

1. An air-filled dielectric conduit structure for use with a contactless communications unit (CCU) mounted to a substrate, wherein the CCU is operative to selectively transmit and receive RF signals along a first path, the conduit structure comprising:

a dielectric structure comprising an RF interface region, an external tapered region, an internal tapered region, and an air-filled cavity,

wherein the CCU is capped by the air-filled cavity, and

wherein a combination of the air-filled cavity and internal and external tapered regions redirects RF signals transmitted by the CCU along the first path to the RF interface region via a second path and redirects RF signals received via the RF interface region along the second path to the CCU via the first path.

2. The conduit structure of claim 1 , further comprising a metallized layer that selectively covers external surfaces of the dielectric structure, but not a face of the RF interface, and wherein the metallized layer prevents RF signal penetration through the covered surfaces of the dielectric structure.

3. The conduit structure of claim 1 , wherein a combination of the air-filled cavity, RF interface region, and internal and external tapered regions ensure single mode control of the RF signal.

4. The conduit structure of claim 1 , wherein a combination of the air-filled cavity, RF interface region, and internal and external tapered regions strikes a balance between misalignment tolerance of the RF interface region and mode control of the RF signal.

5. The conduit structure of claim 1 , wherein the RF interface region and the external tapered regions are part of a single integrated structure that define external dimensions of the dielectric structure, and wherein the internal tapered regions and the air cavity are part of the single integrated structure that define internal dimensions of the dielectric structure.

6. The conduit structure of claim 1 , wherein the external tapered regions comprises a first external tapered region and the internal tapered regions comprises a first internal tapered region, wherein the first external and internal tapered regions both mimic a similar shape.

7. The conduit structure of claim 6 , wherein the first internal tapered region is characterized as having a larger taper angle than a taper angle of the first external tapered region.

8. A dielectric insert dielectric conduit structure for use with a contactless communications unit (CCU) mounted to a substrate, wherein the CCU is operative to selectively transmit and receive RF signals along a first path, the conduit structure comprising:

a metallized cover constructed to be mounted to the substrate and to cover the CCU, the metallized cover comprising an opening through which the RF signals travel along a second path; and

a dielectric insert constructed to be secured within the metallized cover and to be positioned adjacent to the CCU, the dielectric insert comprising an RF interface positioned adjacent to the opening, wherein a combination of the metallized cover and the dielectric insert redirects RF signals transmitted by the CCU along the first path to the RF interface region via the second path and redirect RF signal received via the RF interface region along the second path to the CCU via the first path, wherein the metallized cover comprises an interior volume, and wherein the dielectric insert occupies a substantial portion of the interior volume.

9. The conduit structure of claim 8 , wherein the second path is directed at an angle ranging between 10 and 170 degrees relative to the first path.

10. The conduit structure of claim 8 , wherein the second path is directed to an angle ranging between 85 and 95 degrees relative to the first path.

11. The conduit structure of claim 8 , wherein the metallized cover is a plastic structure that is substantially covered by a metal.

12. The conduit structure of claim 8 , wherein the dielectric insert is a plastic structure that functions as a waveguide.

13. The conduit structure of claim 8 , wherein the RF interface region extends beyond a periphery of the metallized cover.

14. A system comprising:

a substrate;

a plurality of contactless communications units (CCUs) mounted to the substrate, wherein the CCUs are operative to selectively transmit and receive RF signals along respective first paths, wherein the RF signals comprise RF radiation; and

a plurality of RF signal redirection structures, each structure mounted over one of the plurality of CCUs and secured to the substrate, wherein each RF signal redirection structure is operative to redirect RF signals from the first path to a second path or redirect RF signals from the second path to the first path for each CCU.

15. The system of claim 14 , wherein the plurality of RF signal redirection structures are air-filled redirection conduit structures.

16. The system of claim 14 , wherein the plurality of RF signal redirection structures are dielectric insertion conduit structures.

17. The system of claim 14 , further comprising a housing, wherein each of the plurality of RF signal redirection structures comprise RF interfacing regions that abut or are integrated within the housing.

18. The system of claim 14 , wherein each of the first paths is commonly aligned along a first direction, and wherein each of the second paths is commonly aligned along a second direction.

19. The system of claim 14 , wherein the plurality of CCUs comprises first, second, third, and fourth CCUs, wherein the first paths associated with the first and second CCUs are commonly aligned along a first direction, and wherein the first paths associated with the third and fourth CCUs are commonly aligned along a second direction, wherein the first and second directions are opposite of each other, and wherein a second path associated with each of the redirecting structures is aligned with a third direction.