Display device and method for manufacturing the same
A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
1. A method for manufacturing a semiconductor device, the method comprising the steps of:
preparing a processed member, the processed member comprising:
an organic resin layer over a substrate; and
an element layer comprising a transistor over the organic resin layer;
irradiating the organic resin layer with a linear beam through the substrate by using a first apparatus, the first apparatus comprising:
a laser oscillator configured to emit a laser light;
an optical device configured to extend the laser light; and
a lens configured to condense the laser light into the linear beam; and
separating the organic resin layer from the substrate by using a separation apparatus after irradiating the organic resin layer with the linear beam,
wherein the separation apparatus comprises a roller, and
wherein the organic resin layer and the element layer are rolled up by the roller at the step of separating the organic resin layer from the substrate.
2. The method for manufacturing a semiconductor device according to claim 1 ,
wherein the element layer comprises a light-emitting element, and
wherein the light-emitting element comprises an EL layer.
3. The method for manufacturing a semiconductor device according to claim 1 ,
wherein the first apparatus comprises a plurality of laser oscillators.
4. The method for manufacturing a semiconductor device according to claim 1 ,
wherein the step of separating the organic resin layer from the substrate starts at a side portion of the processed member.
5. The method for manufacturing a semiconductor device according to claim 1 ,
wherein the separation apparatus comprises a liquid supplying unit, and
wherein the liquid supplying unit supplies a liquid to a separation surface at the step of separating the organic resin layer from the substrate.
6. A method for manufacturing a semiconductor device, the method comprising the steps of:
preparing a processed member, the processed member comprising:
an organic resin layer over a substrate; and
an element layer comprising a transistor over the organic resin layer;
irradiating the organic resin layer with a linear beam through the substrate by using a first apparatus, the first apparatus comprising:
a laser oscillator configured to emit a laser light;
an optical device configured to extend the laser light; and
a lens configured to condense the laser light into the linear beam; and
separating the organic resin layer from the substrate by using a separation apparatus after irradiating the organic resin layer with the linear beam,
wherein the separation apparatus comprises an adsorbing mechanism, and
wherein the processed member is adsorbed on the adsorbing mechanism at the step of separating the organic resin layer from the substrate.
7. The method for manufacturing a semiconductor device according to claim 6 ,
wherein the element layer comprises a light-emitting element, and
wherein the light-emitting element comprises an EL layer.
8. The method for manufacturing a semiconductor device according to claim 6 ,
wherein the first apparatus comprises a plurality of laser oscillators.
9. The method for manufacturing a semiconductor device according to claim 6 ,
wherein the step of separating the organic resin layer from the substrate starts at a side portion of the processed member.
10. The method for manufacturing a semiconductor device according to claim 6 ,
wherein the separation apparatus comprises a liquid supplying unit, and
wherein the liquid supplying unit supplies a liquid to a separation surface at the step of separating the organic resin layer from the substrate.
11. A method for manufacturing a semiconductor device, the method comprising the steps of:
preparing a processed member, the processed member comprising:
an organic resin layer over a substrate; and
an element layer comprising a transistor over the organic resin layer;
irradiating the organic resin layer with a linear beam through the substrate by using a first apparatus, the first apparatus comprising:
a laser oscillator configured to emit a laser light;
an optical device configured to extend the laser light; and
a lens configured to condense the laser light into the linear beam;
separating the organic resin layer from the substrate by using a separation apparatus comprising a first roller after irradiating the organic resin layer with the linear beam; and
bonding a flexible substrate and the organic resin layer by using a second roller after separating the organic resin layer from the substrate,
wherein the organic resin layer and the element layer are rolled up by the first roller at the step of separating the organic resin layer from the substrate.
12. The method for manufacturing a semiconductor device according to claim 11 ,
wherein the element layer comprises a light-emitting element, and
wherein the light-emitting element comprises an EL layer.
13. The method for manufacturing a semiconductor device according to claim 11 ,
wherein the first apparatus comprises a plurality of laser oscillators.
14. The method for manufacturing a semiconductor device according to claim 11 ,
wherein the step of separating the organic resin layer from the substrate starts at a side portion of the processed member.
15. The method for manufacturing a semiconductor device according to claim 11 ,
wherein the separation apparatus comprises a liquid supplying unit, and
wherein the liquid supplying unit supplies a liquid to a separation surface at the step of separating the organic resin layer from the substrate.
16. A method for manufacturing a semiconductor device, the method comprising the steps of:
preparing a processed member, the processed member comprising:
an organic resin layer over a substrate; and
an element layer comprising a transistor over the organic resin layer;
irradiating the organic resin layer with a linear beam through the substrate by using a first apparatus, the first apparatus comprising:
a laser oscillator configured to emit a laser light;
an optical device configured to extend the laser light; and
a lens configured to condense the laser light into the linear beam;
separating the organic resin layer from the substrate by using a separation apparatus after irradiating the organic resin layer with the linear beam; and
bonding a flexible substrate and the organic resin layer after separating the organic resin layer from the substrate,
wherein the separation apparatus comprises an adsorbing mechanism, and
wherein the processed member is adsorbed on the adsorbing mechanism at the step of separating the organic resin layer from the substrate.
17. The method for manufacturing a semiconductor device according to claim 16 ,
wherein the element layer comprises a light-emitting element, and
wherein the light-emitting element comprises an EL layer.
18. The method for manufacturing a semiconductor device according to claim 16 ,
wherein the first apparatus comprises a plurality of laser oscillators.
19. The method for manufacturing a semiconductor device according to claim 16 ,
wherein the step of separating the organic resin layer from the substrate starts at a side portion of the processed member.
20. The method for manufacturing a semiconductor device according to claim 16 ,
wherein the separation apparatus comprises a liquid supplying unit, and
wherein the liquid supplying unit supplies a liquid to a separation surface at the step of separating the organic resin layer from the substrate.