Fabrication of thin-film encapsulation layer for light emitting device
View Patent ↗An ink jet process is used to deposit a material layer to a desired thickness. Layout data is converted to per-cell grayscale values, each representing ink volume to be locally delivered. The grayscale values are used to generate a halftone pattern to deliver variable ink volume (and thickness) to the substrate. The halftoning provides for a relatively continuous layer (e.g., without unintended gaps or holes) while providing for variable volume and, thus, contributes to variable ink/material buildup to achieve desired thickness. The ink is jetted as liquid or aerosol that suspends material used to form the material layer, for example, an organic material used to form an encapsulation layer for a flat panel device. The deposited layer is then cured or otherwise finished to complete the process.
1. A method of fabricating a thin film encapsulation layer for an electronic device having light emitting elements, the thin film encapsulation layer to have a desired thickness, the method comprising:
receiving a substrate, the light emitting elements formed on the substrate;
printing droplets of an organic material using an ink jet printer onto the substrate, in a manner so as to form a liquid coat over the light emitting elements;
controlling a volume of the liquid printed per unit area of the substrate in dependence on the desired thickness by varying at least one of a droplet area density or a size of the droplets; and
processing the liquid coat once deposited to form the thin film encapsulation layer;
wherein the method is embodied as a method of producing the thin film encapsulation layer for each substrate of a series of substrates and wherein each substrate in the series comprises an active region, an exposed region and a buffer region between the active region and the exposed region, and wherein further
the printing, the controlling and the processing are performed for each substrate in the series,
the method further comprises utilizing a common set of one or more scan patterns and nozzle firing patterns to control printing for each of the respective substrates,
the method comprises forming the thin film encapsulation layer in the active region of each substrate in the series to receive the thin film encapsulation layer to have a uniform thickness corresponding to the desired thickness, not forming thin film encapsulation layer at all over the exposed region, and forming the thin film encapsulation layer within the buffer region so as to provide for a transition between the desired thickness of the think film encapsulation layer in the active region and the exposed region,
forming the thin film encapsulation layer in the active region comprises printing the droplets according to a first value of the volume per unit area of the substrate to obtain the desired thickness, and
forming the thin film encapsulation layer within the buffer region comprises performing at least one of (a) scaling the desired thickness according to a predetermined criterion, to obtain a scaled thickness, and forming the thin film encapsulation layer within the buffer region according to the scaled thickness by printing the droplets according to a second value of the volume per unit area of the substrate, wherein the second value relative to the first value corresponds to a ratio of the scaled thickness to the desired thickness, or (b) changing a proportional dependence of the volume per unit area relative to the desired thickness, as a function of distance from the exposed region, to obtain the second value of the volume per unit area of the substrate, and forming the thin film encapsulation layer by printing the liquid within the buffer region according to the second value of the volume per unit area.
2. The method of claim 1 , wherein the controlling comprises varying an electronic drive signal supplied to nozzles of a printhead of the ink jet printer, to cause the ink jet printer to vary the size of the droplets in the buffer region relative to the active region, so as to deposit the second value of the volume of the liquid per unit area in the buffer region.
3. The method of claim 1 , wherein the controlling comprises varying the droplet area density provided by droplets ejected from nozzles of a printhead of the ink jet printer, to cause the ink jet printer to vary a number of the droplets per unit area in the buffer region relative to the active region, so as to deposit the second value of the volume of the liquid per unit area in the buffer region.
4. The method of claim 3 , wherein varying the droplet area density comprises causing the ink jet printer to deposit the droplets at fewer nodes of a print grid so as to reduce a spatial frequency at which droplets are deposited in the buffer region relative to the active region.
5. The method of claim 3 , wherein varying the droplet area density comprises varying time-dependent frequency of a trigger signal supplied in common to the nozzles of the ink jet printer, so as to vary spatial frequency of the deposition of the droplets in the buffer region relative to the active region.
6. The method of claim 3 , wherein varying the droplet area density comprises varying time-dependent frequency of a trigger signal supplied to a first one the nozzles of the ink jet printer relative to a second one of the nozzles of the ink jet printer, so as to vary spatial frequency of droplets provided by the first one in the buffer region relative to spatial frequency of droplets provided by the second one in the buffer region.
7. The method of claim 1 , wherein:
the second value of the volume per unit area is to be selected according to a calibration process performed on a test substrate, the calibration process to measure deviation between a lip of a deposited layer and the uniform thickness; and
the second value of the volume per unit area is selected so as to reduce the deviation.
8. The method of claim 1 , wherein the second value of the volume per unit area of the substrate is selected so as to reduce deviation between a lip of the thin film encapsulation layer and the uniform thickness.
9. The method of claim 8 , wherein the organic material comprises a monomer and wherein processing the liquid coat comprises exposing the liquid coat to ultraviolet radiation to convert the monomer to a polymer.
10. A method of fabricating a thin film encapsulation layer for an electronic device having light emitting elements, the thin film encapsulation layer to have a desired thickness, the method comprising:
receiving a substrate into a gas enclosure, the light emitting elements formed on the substrate;
within the gas enclosure, printing droplets of an organic material using an ink jet printer onto the substrate, in a manner so as to form a liquid coat over the light emitting elements;
controlling a volume of the liquid printed per unit area of the substrate in dependence on the desired thickness by varying at least one of a droplet area density or a size of the droplets; and
processing the liquid coat once deposited to form the thin film encapsulation layer;
wherein the method is embodied as a method of producing the thin film encapsulation layer for each substrate of a series of substrates and wherein each substrate in the series comprises an active region, an exposed region and a buffer region between the active region and the exposed region, and wherein further
the printing, the controlling and the processing are performed for each substrate in the series,
the method further comprises utilizing a common set of one or more scan patterns and nozzle firing patterns to control printing for each of the respective substrates,
the method comprises forming the thin film encapsulation layer in the active region of each substrate in the series to receive the thin film encapsulation layer to have a uniform thickness corresponding to the desired thickness, not forming thin film encapsulation layer at all over the exposed region, and forming the thin film encapsulation layer within the buffer region so as to provide for a transition between the desired thickness of the encapsulation layer in the active region and the exposed region,
forming the thin film encapsulation layer in the active region comprises printing the droplets according to a first value of the volume per unit area of the substrate, to obtain the desired thickness, and
forming the thin film encapsulation layer within the buffer region comprises performing at least one of (a) scaling the desired thickness according to a predetermined criterion, to obtain a scaled thickness, and forming the thin film encapsulation layer within the buffer region according to the scaled thickness by printing the droplets according to a second value of the volume per unit area of the substrate, wherein the second value relative to the first value corresponds to a ratio of the scaled thickness to the desired thickness, or (b) changing a proportional dependence of the volume per unit area relative to the desired thickness, as a function of distance from the exposed region, to obtain the second value of the volume per unit area of the substrate, and forming the thin film encapsulation layer by printing the liquid within the buffer region according to the second value of the volume per unit area.
11. The method of claim 10 , wherein the gas enclosure encloses at least one of nitrogen gas or a Noble gas.
12. The method of claim 10 , wherein the controlling comprises varying an electronic drive signal supplied to nozzles of a printhead of the ink jet printer to cause the ink jet printer to vary the size of the droplets in the buffer region relative to the active region, so as to deposit the second value of the volume per unit area in the buffer region.
13. The method of claim 10 , wherein the controlling comprises varying the droplet area density provided by nozzles of a printhead of the ink jet printer, to cause the ink jet printer to vary a number of droplets deposited in the buffer region relative to the active region, so as to deposit the second value of the volume per unit area in the buffer region.
14. The method of claim 13 , wherein varying the droplet area density comprises causing the ink jet printer to deposit the droplets at fewer nodes of a print grid so as to reduce a spatial frequency at which droplets are deposited in the buffer region relative to the active region.
15. The method of claim 13 , wherein varying the droplet area density comprises varying time-dependent frequency of a trigger signal supplied in common to the nozzles of the ink jet printer, so as to vary spatial frequency of the deposition of the droplets in the buffer region relative to the active region.
16. The method of claim 13 , wherein varying the droplet area density comprises varying time-dependent frequency of a trigger signal supplied to a first one the nozzles of the ink jet printer relative to a second one of the nozzles of the ink jet printer, so as to vary spatial frequency of droplets provided by the first one in the buffer region relative to spatial frequency of droplets provided by the second one in the buffer region.
17. The method of claim 10 , wherein:
the second value of the volume per unit area is to be selected according to a calibration process performed on a test substrate, the calibration process to measure deviation between a lip of a deposited layer and the uniform thickness; and
the second value of the volume per unit area is selected so as to reduce the deviation.
18. The method of claim 10 , wherein the second value of the volume per unit area of the substrate is selected so as to reduce deviation between a lip of the thin film encapsulation layer and the uniform thickness.
19. The method of claim 18 , wherein the organic material comprises a monomer and wherein processing the liquid coat comprises exposing the liquid coat to ultraviolet radiation to convert the monomer to a polymer.