SYSTEMS AND METHODS FOR MONOLITHICALLY ISLED SOLAR PHOTOVOLTAIC CELLS AND MODULES
According to one aspect of the disclosed subject matter, a monolithically isled solar cell is provided. The solar cell comprises a semiconductor layer having a light receiving frontside and a backside opposite the frontside and attached to an electrically insulating backplane. A trench isolation pattern partitions the semiconductor layer into electrically isolated isles on the electrically insulating backplane. A first metal layer having base and emitter electrodes is positioned on the semiconductor layer backside. A patterned second metal layer providing cell interconnection and connected to the first metal layer by via plugs is positioned on the backplane.
1 . A monolithic photovoltaic module structure, comprising:
(a) a plurality of monolithically-isled (or monolithically-tiled) solar cells, each of said solar cells comprising:
(i) a semiconductor layer with a background doping, comprising a sunlight-receiving frontside and a backside opposite said sunlight-receiving frontside;
(ii) a patterned first metal layer (M1) disposed on said semiconductor layer backside;
(b) an electrically insulating continuous backplane support layer attached to said semiconductor layer backsides of said plurality of monolithically-isled (or monolithically-tiled) solar cells, said solar cells positioned on and attached to said continuous backplane support layer according to a desired closely-spaced cell array pattern;
(c) a trench isolation pattern partitioning said semiconductor layer in each of said plurality of monolithically-isled (or monolithically-tiled) solar cells into a plurality of solar cell semiconductor regions on said electrically insulating continuous backplane support layer;
(d) a patterned second metal layer (M2) disposed on said electrically insulating continuous backplane support layer attached to said semiconductor layer backsides of said plurality of monolithically-isled (or monolithically-tiled) solar cells;
(e) a plurality of electrically conductive via plugs formed through said electrically insulating continuous backplane support layer interconnecting select portions of said patterned second-level metal layer to select portions of said patterned first-level metal layer in each of said plurality of monolithically-isled (or monolithically-tiled) solar cells;
(f) said patterned first-level metal layer, said patterned second-level metal layer, and said plurality of electrically conductive via plugs designed to complete the electrical metallization and interconnections within each of said monolithically-isled (or monolithically-tiled) solar cells, and among said plurality of monolithically-isled (or monolithically-tiled) solar cells based on a desired electrical interconnection arrangement comprising one or a combination of series, parallel, and hybrid parallel-series interconnections;
(g) optically transparent protective frontside cover and frontside encapsulation sheets attached to said electrically insulating continuous backplane support layer covering said sunlight-receiving frontsides of said plurality of monolithically-isled (or monolithically-tiled) solar cells;
(h) protective backside cover and backside encapsulation sheets attached to said electrically insulating continuous backplane support layer opposite said sunlight-receiving frontsides;
(i) at least a pair of electrical connector leads.
2 . The monolithic photovoltaic module structure of claim 1 , wherein said monolithic photovoltaic module is a flexible, lightweight module.
3 . The monolithic photovoltaic module structure of claim 1 , wherein said monolithic photovoltaic module is a rigid glass-covered module.
4 . The monolithic photovoltaic module structure of claim 1 , wherein said monolithic photovoltaic module is a building-integrated photovoltaic (BIPV) rooftop shingle module.
5 . The monolithic photovoltaic module structure of claim 1 , wherein said monolithic photovoltaic module is a building-integrated photovoltaic (BIPV) rooftop tile module.
6 . The monolithic photovoltaic module structure of claim 1 , wherein said monolithic photovoltaic module is an automotive sunroof module.
7 . The monolithic photovoltaic module structure of claim 1 , further comprising a plurality of bypass switches associated with said plurality of monolithically-isled (or monolithically-tiled) solar cells for distributed shade management.
8 . The monolithic photovoltaic module structure of claim 1 , further comprising a plurality of bypass Schottky diodes associated with said plurality of monolithically-isled (or monolithically-tiled) solar cells for distributed shade management.
9 . The monolithic photovoltaic module structure of claim 1 , further comprising a plurality of bypass pn junction diodes associated with said plurality of monolithically-isled (or monolithically-tiled) solar cells for distributed shade management.
10 . The monolithic photovoltaic module structure of claim 1 , further comprising a plurality of maximum-power-point-tracking (MPPT) power optimizers associated with said plurality of monolithically-isled (or monolithically-tiled) solar cells for enhanced power harvest.
11 . A method of producing photovoltaic module laminate comprising a plurality of monolithically-integrated solar cell and bypass switch semiconductor structures, comprising:
(a) producing each of said monolithically-integrated solar cell and bypass switch semiconductor structures using a plurality of fabrication processes, comprising:
(i) performing at least a portion of said plurality of fabrication processes on a semiconductor layer, comprising a frontside surface and a backside surface;
(ii) attaching an electrically insulating continuous backplane to said backside surface of said semiconductor layer;
(iii) producing an isolation pattern through said semiconductor layer to form a plurality of isles, and to partition said solar cell and said bypass switch into separate semiconductor layer regions on said electrically insulating continuous backplane;
(iv) performing the remaining portion of said plurality of fabrication processes;
(b) electrically interconnecting and laminating said plurality of monolithically-integrated solar cell and bypass switch semiconductor structures to produce said photovoltaic module laminate.
12 . The method of claim 11 , wherein said photovoltaic module laminate is formed of a flexible photovoltaic material.
13 . The method of claim 11 , wherein said photovoltaic module laminate is formed of a rigid glass-covered photovoltaic material.
14 . A method of producing photovoltaic module laminate comprising a plurality of integrated solar cell and bypass switch structures, comprising:
(a) producing each of said integrated solar cell and bypass switch structures using a plurality of processes, comprising:
(i) performing at least a portion of said plurality of processes on a semiconductor layer;
(ii) attaching a continuous backplane to a surface of said semiconductor layer;
(iii) producing an isolation pattern through said semiconductor layer to form a plurality of isles, and to partition said solar cell and said bypass switch on said continuous backplane;
(iv) performing the remaining portion of said plurality of processes;
(b) electrically interconnecting and laminating said plurality of integrated solar cell and bypass switch structures to produce said photovoltaic module laminate.
15 . The method of claim 14 , wherein said photovoltaic module laminate is formed of a flexible photovoltaic material.
16 . The photovoltaic module laminate of claim 14 , wherein said photovoltaic module laminate is formed of a rigid glass-covered photovoltaic material.
17 . A monolithically isled semiconductor solar cell, comprising:
a master cell semiconductor substrate attached to a backside backplane, said master cell comprising a plurality of electrically isolated isles, each of said isles electrically isolated by isolation trenches formed through said master cell semiconductor substrate to said backside backplane, each of said isles comprising a light capturing frontside surface and a backside surface for forming emitter and base contacts; and
emitter regions and base regions positioned on said backside surface of said isles; said backside backplane comprising an electrically conductive metallization layer having a pattern of emitter electrodes and base electrodes corresponding to said emitter regions and said base regions.
67 .- 76 . (canceled)
101 .- 107 . (canceled)