Apparatus and method for direct transfer of semiconductor devices
An apparatus that directly transfers a semiconductor device die from a first substrate to a second substrate. The semiconductor device die is disposed on the first side of the first substrate. The apparatus includes a first frame to hold the first substrate, and a second frame to hold the second substrate adjacent to the first side of the first substrate. A needle is disposed adjacent to the first frame and extends in a direction toward the second side of the first substrate. A needle actuator is connected to the needle to move the needle, during a direct transfer process, to a die transfer position at which the needle contacts the second side of the first substrate to press the semiconductor device die into contact with the second substrate such that the semiconductor device die is released from the first substrate and is attached to the second substrate.
1. An apparatus for performing a direct transfer of a semiconductor device die from a first substrate to a second substrate, the first substrate having a first side and a second side, and the semiconductor device die being disposed on the first side of the first substrate, the apparatus comprising:
a wafer tape frame to hold the first substrate;
a product substrate holder frame including a first portion and a second portion to clamp the second substrate adjacent to the first side of the first substrate, wherein the first portion of the product substrate holder frame has a concave shape and the second portion of the product substrate holder frame has a convex counter shape corresponding to the concave shape of the first portion of the product substrate holder frame;
a needle disposed adjacent to the wafer tape frame and extending in a direction toward the second side of the first substrate; and
a needle actuator connected to the needle to move the needle, during a direct transfer process, to a die transfer position at which the needle contacts the second side of the first substrate to press the semiconductor device die into contact with the second substrate such that the semiconductor device die is released from the first substrate and is attached to the second substrate.
2. The apparatus according to claim 1 , further comprising a controller communicatively coupled to the wafer tape frame and the product substrate holder frame, the controller being configured to:
orient the wafer tape frame such that the semiconductor device die on the first substrate is aligned with a die transfer location on the second substrate, and/or
orient the product substrate holder frame such that the die transfer location on the second substrate is aligned with the semiconductor device die to be transferred.
3. The apparatus according to claim 1 , further comprising:
a first optical sensor positioned to sense a position of the semiconductor device die with respect to a die transfer location on the second substrate; and
a second optical sensor positioned to sense a position of the die transfer location on the second substrate.
4. The apparatus according to claim 1 , wherein the wafer tape frame and the product substrate holder frame are positioned with respect to each other such that, during the direct transfer, a distance between the opposing surfaces of the first substrate and the second substrate, respectively, ranges from about 0.25 mm to about 1 mm.
5. The apparatus according to claim 1 , wherein at least one of the first substrate or the second substrate is a wafer tape.
6. The apparatus according to claim 1 , wherein the needle actuator is configured to move the needle, during the direct transfer, to cause a deflection of the first substrate localized at the semiconductor device die.
7. The apparatus according to claim 6 , wherein the second substrate has an attraction force greater than an attraction force of the first substrate.