Apparatus and method for direct transfer of semiconductor devices from a substrate and stacking semiconductor devices on each other
An apparatus includes a first frame to hold a wafer tape, and a second frame to hold a substrate adjacent to the first side of the wafer tape. A needle is disposed adjacent to the second side of the wafer tape and extends in a direction toward the wafer tape. A needle actuator is connected to the needle to move the needle, during a direct transfer process, to a die transfer position at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with a second semiconductor device die. An energy-emitting device is disposed adjacent to the substrate to induce a bond between the first semiconductor device die and the second semiconductor device die such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die.
1. An apparatus to directly transfer a first semiconductor device die to a substrate from a wafer tape having a first side and a second side, the first semiconductor device die being disposed on the first side of the wafer tape, the substrate including a second semiconductor device die onto which the first semiconductor device die is to be transferred, the apparatus comprising:
a first frame to hold the wafer tape;
a second frame to hold the substrate adjacent to the first side of the wafer tape;
a needle disposed adjacent to the second side of the wafer tape and extending in a direction toward the wafer tape;
a needle actuator connected to the needle to move the needle, during a direct transfer process, to a die transfer position where the first semiconductor device die is placed on the second semiconductor device die and at which the needle contacts the second side of the wafer tape to press the first semiconductor device die into contact with the second semiconductor device die; and
an energy-emitting device disposed adjacent to the substrate to induce a bond between the first semiconductor device die and the second semiconductor device die such that the first semiconductor device die is released from the wafer tape and is attached to the second semiconductor device die.
2. The apparatus according to claim 1 , further comprising a controller communicatively coupled to the first frame and the second frame, the controller being configured to:
orient the first frame such that the first semiconductor device die on the wafer tape is aligned with a die transfer location on the substrate, and/or
orient the second frame such that the die transfer location on the substrate is aligned with the first semiconductor device die.
3. The apparatus according to claim 1 , further comprising:
a first optical sensor positioned to sense a position of the first semiconductor device die with respect to a die transfer location on the substrate; and
a second optical sensor positioned to sense a position of the die transfer location on the substrate.
4. The apparatus according to claim 1 , wherein the needle actuator is configured to apply the needle to cause pressure between the first semiconductor device die and the second semiconductor device die on the substrate, and
wherein the energy-emitting device is configured to emit heat energy at a die transfer location aligned with the first semiconductor device die and the second semiconductor device die.
5. The apparatus according to claim 1 , wherein electrical contact terminals of the first semiconductor device die include gold.
6. The apparatus according to claim 1 , wherein the needle actuator is configured to move the needle, during the direct transfer process, to cause a deflection of the wafer tape at a localized position of the first semiconductor device die.
7. The apparatus according to claim 1 , wherein the energy-emitting device includes a laser.