Electronic package having a supporting board and package carrier thereof
View Patent ↗A package carrier is provided. The package carrier includes a wiring layer and an insulating pattern. The wiring layer includes at least one connecting pad and at least one mounting pad. The mounting pad is used for mounting an electronic component, and the connecting pad is used for electrically connecting the electronic component. The insulating pattern is stacked on and connected to the wiring layer. A boundary surface is formed between the wiring layer and the insulating pattern. Both of the wiring layer and the insulating pattern do not extend over the boundary surface. In addition, an electronic package including the package carrier is also provided.
1. A package carrier, comprising:
a wiring layer including at least one connecting pad and at least one mounting pad, wherein the mounting pad is used for disposing an electronic component, and the connecting pad is used for electrically connecting the electronic component;
an insulating pattern stacked on and connected to the wiring layer, wherein a boundary surface is formed between the wiring layer and the insulating pattern, and both of the wiring layer and the insulating pattern do not extend over the boundary surface; and
a supporting board having a depression pattern aligned to the insulating pattern, wherein the insulating pattern is detachably fixed and fitted in the depression pattern, thereby generating a fiction force for preventing the insulating pattern and the depression pattern from being separated from each other.
2. The package carrier according to claim 1 , wherein the insulating pattern includes at least one opening aligned to the at least one connecting pad.
3. The package carrier according to claim 1 , wherein the insulating pattern is a solder mask layer.
4. An electronic package, comprising:
a package carrier comprising:
a wiring layer including at least one connecting pad and at least one mounting pad; and
an insulating pattern stacked on and connected to the wiring layer, wherein a boundary surface is formed between the wiring layer and the insulating pattern, and both of the wiring layer and the insulating pattern do not extend over the boundary surface;
a supporting board having a depression pattern aligned to the insulating pattern, wherein the insulating pattern is detachably fixed and fitted in the depression pattern, thereby generating a friction force for preventing the insulating pattern and the depression pattern from being separated from each other;
an electronic component disposed on the mounting pad and electrically connected to the at least one connecting pad, wherein the wiring layer is interposed between the electronic component and the insulating pattern; and
a molding layer covering the wiring layer and the electronic component.
5. The electronic package according to claim 4 , wherein the insulating pattern includes an opening aligned to the at least one connecting pad.
6. The electronic package according to claim 4 , wherein the insulating pattern is a solder mask layer.