Electrically functional structure integration in ultrathin foldable device
Systems and methods are disclosed for integration of an electrically functional structure in an information handling system. An information handling system may include may include a housing including a first housing portion coupled to a second housing portion. The first housing portion may include an electrically functional structure integrated within the first housing portion. The first housing portion may also include a first layer and a structural adhesive applied to the first layer. The first housing portion may further include a second layer and a thermally conductive adhesive applied to the second layer to bond the second layer to the first layer. The first housing portion may also include a PCB layer coupled between a first PCB and a second PCB, the PCB layer bonded to the second layer, and the electrically functional structure includes the first PCB and the second PCB.
1. An information handling system, comprising:
a housing portion comprising:
an electrically functional structure including an antenna;
a cover portion;
a plurality of housing layers including a plurality of openings, each of the plurality of housing layers including an opening of the plurality openings; and
a patterned hole in the cover portion and the plurality housing layers, the patterned hole comprised of the plurality of openings and configured to match a three-dimensional size and shape of the antenna, each of the plurality of openings having a height and a width equal to a portion of the three dimensional pattern of the antenna at the respective opening, the patterned hole filled by the antenna to integrate the antenna in the housing portion,
the cover portion, the one or more housing layers, and the electrically functional structure including the antenna bonded to each other using a lamination process to create a composite material.
2. The information handling system of claim 1 , wherein the patterned hole is filled by the antenna using three dimensional printing to print the antenna in the patterned hole.
3. The information handling system of claim 1 , wherein the patterned hole is filled by the antenna using an injection process to inject the antenna in the patterned hole.
4. The information handling system of claim 1 , wherein the patterned hole is laser cut into the cover portion and the plurality of housing layers using the three dimensional pattern of the antenna.
5. The information handling system of claim 1 , wherein the cover portion is laminated with one or more of a polymer fiber, a glass fiber, a basalt fiber, an ultra-high-molecular-weight polyethylene (UHMWPE) fiber, a high-modulus polyethylene (HMPE) fiber, a high-performance polyethylene (HPPE) fiber, a polybenzoxazole (PBO) fiber, a para-aramid fiber, and a polyhydroquinone diimidazopyridine (M5) fiber.
6. The information handling system of claim 1 , wherein the antenna includes a ceramic antenna base.