IP Library Granted Patent US 10,021,806
Granted Patent B2
US 10,021,806 · App. 15/430,959 · Granted Jul 10, 2018

System and method for flexible storage and networking provisioning in large scalable processor installations

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Quick Facts
Patent No.
US 10,021,806
App. No.
15/430,959
Granted
Jul 10, 2018
Kind
B2
Abstract

A system and method for provisioning within a system design to allow the storage and IO resources to scale with compute resources are provided.

Claims (28)

1. A system comprising:

a chassis having a predetermined physical form factor, wherein the chassis has a plurality of slots into which modules are placed;

compute modules, storage modules, and input/output (I/O) modules, all of which are housed within the plurality of slots; and

a processor configured to identify one or more of the compute modules, one or more of the storage modules, and one or more of the I/O modules to form a scalable system based on a desired computing power, a desired storage power, and a desired input/output power for the scalable system, wherein a quantity of the one or more I/O modules is determined based, at least in part, on a bandwidth requirement for data traversing from and to the scalable system.

2. The system of claim 1 , further comprising one or more support devices within the chassis that support the one or more compute modules, the one or more storage modules, and the one or more I/O modules housed within the chassis.

3. The system of claim 2 , wherein the one or more support devices comprise a fan or a power supply.

4. The system of claim 1 , wherein the plurality of slots each comprise a set of physical connectors and a volume of space.

5. The system of claim 4 , wherein the set of physical connectors comprises one or more peripheral component interconnect express (PCIe) connectors.

6. The system of claim 1 , wherein each I/O module comprises a set of connectors and a translation circuit that translates between I/O protocols.

7. The system of claim 1 , further comprising hybrid modules configured to be housed within the plurality of slots, wherein each hybrid module includes compute, storage, and I/O functions therein.

8. The system of claim 1 , further comprising one or more system boards within the chassis.

9. The method of claim 8 , wherein the one or more system boards are interconnected by board-to-board connectors.

10. A server comprising:

a chassis with a plurality of slots into which modules are placed;

compute modules, storage modules, and input/output (I/O) modules, all of which are housed within the plurality of slots; and

a processor configured to identify one or more of the compute modules, one or more of the storage modules, and one or more of the I/O modules to form a scalable system based on a desired computing power, a desired storage power, and a desired input/output power for the scalable system.

11. The server of claim 10 , wherein a quantity of the one or more I/O modules is determined based, at least in part, on a bandwidth requirement for data traversing from and to the scalable system.

12. The server of claim 10 , further comprising hybrid modules configured to be housed within the plurality of slots, wherein each hybrid module includes compute, storage, and I/O functions therein.

13. A system comprising:

a chassis having slots into which modules are placed; and

a processor configured to identify modules to form a scalable system based on a desired computing power, a desired storage power, and a desired input/output power for the scalable system, wherein a quantity of the modules is determined based, at least in part, on a bandwidth requirement for data traversing from and to the scalable system.

14. The system of claim 13 , further comprising support devices within the chassis that support the modules housed within the chassis.

15. The system of claim 14 , wherein the support devices comprise a fan or a power supply.

16. The system of claim 13 , wherein the slots comprise a set of physical connectors and a volume of space.

17. The system of claim 16 , wherein the set of physical connectors comprises peripheral component interconnect express (PCIe) connectors.

18. The system of claim 13 , wherein the modules comprise connectors and a translation circuit that translates between I/O protocols.

19. The system of claim 13 , further comprising hybrid modules that include compute, storage, and I/O functions therein.

20. The system of claim 13 , further comprising system boards within the chassis.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 2, 2017
From: SILICON VALLEY BANK
To: III HOLDINGS 2, LLC
Reel/Frame 043759/0175 →