Coefficient of thermal expansion (CTE) matched transistor outline (TO) header
View Patent ↗A transistor outline (TO) package may include a TO cap. The TO package may include a TO header. The TO header may include a header stem of a first material and a first coefficient of thermal expansion (CTE) value. The TO header may include a header base of a second material and a second CTE value. The first material and the second material may be different. The first CTE value and the second CTE value may be different. The first CTE value and the second CTE value may be within a threshold percentage of each other.
1. A transistor outline (TO) header for coupling to a TO cap, comprising:
a copper-tungsten header stem with a first coefficient of thermal expansion (CTE) value; and
a header base with a second CTE value that is different than the first CTE value,
the header base being a different material from the copper-tungsten header stem.
2. The TO header of claim 1 , where the TO header and the TO cap form a TO package.
3. The TO header of claim 1 , where the first CTE value is within a threshold percentage of the second CTE value.
4. The TO header of claim 1 , where the header base is a steel header base.
5. The TO header of claim 1 , where the copper-tungsten header stem is aligned with an output optical axis of the TO header at an operating temperature of the TO header.
6. The TO header of claim 5 , where the copper-tungsten header stem is aligned with the output optical axis within a threshold amount.
7. The TO header of claim 5 , where the copper-tungsten header stem is to receive a chip on sub-mount assembly such that a laser diode is aligned to the output optical axis of the TO header.
8. An optical module, comprising:
a laser diode;
a transistor outline (TO) cap; and
a TO header,
the TO header comprising:
a header base to attach to the TO cap, and
a copper-tungsten header stem to attach to the header base and to mount the laser diode.
9. The optical module of claim 8 , where the copper-tungsten header stem is offset from a centerline of the optical module at a reference temperature such that, at an operating temperature of the optical module, the copper-tungsten header stem is aligned to the centerline of the optical module.
10. The optical module of claim 9 , where the operating temperature is between approximately 0 degrees Celsius and approximately 75 degrees Celsius.
11. The optical module of claim 9 , where the reference temperature is approximately 25 degrees Celsius.
12. The optical module of claim 8 , where the TO cap is welded to the header base.
13. The optical module of claim 8 , where the header base is steel.
14. The optical module of claim 8 , where the copper-tungsten header stem includes at least one of:
a CuW50 material,
a CuW60 material, or
a CuW70 material.
15. A transistor outline (TO) package, comprising:
a TO cap; and
a TO header comprising:
a header stem of a first material and a first coefficient of thermal expansion (CTE) value, and
a header base of a second material and a second CTE value,
the first material and the second material being different,
the first CTE value and the second CTE value being different,
the first CTE value and the second CTE value being within a threshold percentage of each other.
16. The TO package of claim 15 , where the threshold percentage is approximately 20%.
17. The TO package of claim 15 , where the first material includes at least one of:
a copper-tungsten based material, or
a copper-molybdenum based material.
18. The TO package of claim 15 , where the header stem is to receive an optical component.
19. The TO package of claim 18 , where the optical component is a laser diode.
20. The TO package of claim 18 , where the TO cap includes a lens to optically couple the optical component to an optical fiber.