Heat exchanger for an information handling system
View Patent ↗A heat exchanger includes first, second, and third heat sinks, multiple heat pipes located within the heat sinks, and a first aluminum bar located within the heat sinks. The first aluminum bar extends from an outside edge of the first heat sink, through the first, second, and third heat sinks, and to an outside edge of the third heat sink.
1. A heat exchanger comprising:
first, second, and third heat sinks;
a plurality of heat pipes located within the heat sinks;
a first aluminum bar located within a first hole through the heat sinks, wherein the first aluminum bar extends from an outside edge of the first heat sink, through the first, second, and third heat sinks, and to an outside edge of the third heat sink, wherein the first aluminum bar supports the weight of the first and third heat sinks; and
a cold plate connected to the second heat sink, wherein a first portion of the heat pipes extends from a first side of the cold plate to a second side of the cold plate, extends upward from the second side of the cold plate and extends to an outside edge of the first heat sink at an opposite side of the heat exchanger as the second side of the cold plate;
wherein a second portion of the heat pipes extends from the second side of the cold plate to the first side of the cold plate, extends upward from first side of the cold plate and extends to an outside edge of the third heat sink at an opposite side of the heat exchanger as the first side of the cold plate.
2. The heat exchanger of claim 1 further comprising:
a second aluminum bar located within a second hole through the heat sinks, wherein the second aluminum bar extends from the outside edge of the first heat sink, through the first, second, and third heat sinks, and to the outside edge of the third heat sink, the second aluminum bar being soldered to the first and third heat sinks.
3. The heat exchanger of claim 1 wherein the first and third heat sinks extend from opposite edges of the second heat sink.
4. The heat exchanger of claim 3 the first, second, and third heat sinks to remove heat from a processing device, and multiple compute devices.
5. An information handling system comprising:
a circuit board;
a processing device mounted on the circuit board;
a plurality of compute devices mounted on the circuit board;
a heat exchanger including:
first, second, and third heat sinks;
a plurality of heat pipes located within the beat sinks;
a first aluminum bar located within a first hole through the heat sinks, wherein the first aluminum bar extends from an outside edge of the first heat sink, through the first, second, and third heat sinks, and to an outside edge of the third heat sink, wherein the first aluminum bar supports the weight of the first and third heat sinks; and
a cold plate connected to the second heat sink, wherein a first portion of the heat pipes extends from a first side of the cold plate to a second side of the cold plate, extends upward from the second side of the cold plate and extends to an outside edge of the first heat sink at an opposite side of the heat exchanger as the second side of the cold plate;
wherein a second portion of the heat pipes extends from the second side of the cold plate to the first side of the cold plate, extends upward from first side of the cold plate and extends to an outside edge of the third heat sink at an opposite side of the heat exchanger as the first side of the cold plate.
6. The information handling system of claim 5 the heat exchanger further comprises:
a second aluminum bar located within a second hole through the heat sinks, wherein the second aluminum bar extends from the outside edge of the first heat sink, through the first, second, and third heat sinks, and to the outside edge of the third heat sink, the second aluminum bar being soldered to the first and third heat sinks.
7. The information handling system of claim 5 further comprising:
a plurality of mounting screws, the mounting screws to securely attached the heat exchanger above the processing device and to the circuit board.
8. The information handling system of claim 5 wherein the first and third heat sinks extend from opposite edges of the second heat sink.
9. The information handling system of claim 5 wherein the first and third heat sinks extend over the compute devices.