IP Library Granted Patent US 10,939,587
Granted Patent B2
US 10,939,587 · App. 15/434,946 · Granted Mar 2, 2021

System and method for injecting cooling air into servers in a server rack

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Quick Facts
Patent No.
US 10,939,587
App. No.
15/434,946
Granted
Mar 2, 2021
Kind
B2
Abstract

A cooling system for a server rack may cool one or more servers and one or more components thereof. The cooling system may comprise an air mover, an air delivery manifold, and one or more injection ducts for the one or more servers. The air mover may be located in an air mover module positioned in the server rack and may generate a pressurized airflow. The air delivery manifold receives the pressurized airflow generated by the air mover, and may have delivery ports and provide a fluid path for airflow out of the delivery ports to the injection ducts. The injection ducts may be used to inject the airflow of cooling air into the servers to cool the servers and one or more components thereof.

Claims (30)

1. A cooling system for a server in a server rack, comprising:

an air mover module to generate a pressurized airflow, the air mover module located in dead space of the server rack and external to the server, the air mover module including a centrifugal fan receiving air from a bottom of the server rack;

an air delivery manifold with a first delivery port and configured to receive the pressurized airflow from the air mover module, wherein the air delivery manifold provides a fluid path for the pressurized airflow, wherein the fluid path is enclosed between the air mover module and the first delivery port; and

a first injection duct for a first server, the first injection duct encapsulated by a chassis of the server and configured to be fluidly coupled to the first delivery port to receive the pressurized airflow, the first injection duct having a distal end to direct the pressurized airflow to cool a component within the server.

2. The cooling system of claim 1 , wherein the first delivery port is coupled to an input of the first injection duct through an opening in the server chassis.

3. The cooling system of claim 1 , wherein the air mover module includes an air mover and a control circuit, wherein the control circuit is configured to control the air mover.

4. The cooling system of claim 3 , wherein the air mover module includes a primary intake and an exhaust configured to couple to the air delivery manifold, wherein the air mover pulls air from the primary intake and compresses the air to provide the pressurized airflow out of the exhaust to the air delivery manifold.

5. The cooling system of claim 3 , wherein the air mover is a compressor and includes a fan for generating the pressurized airflow.

6. The cooling system of claim 1 , wherein the dead space is located at the bottom of the server rack storing the server.

7. The cooling system of claim 4 , wherein the air delivery manifold includes a secondary intake and a set of delivery ports, the set of delivery ports including the first delivery port, wherein the air delivery manifold is hollow to provide the fluid path between the secondary intake and the set of delivery ports.

8. The cooling system of claim 4 , wherein the air delivery manifold includes a secondary intake configured to couple to the exhaust to receive the airflow.

9. The cooling system of claim 1 , wherein the air delivery manifold is appended to a body of the server rack storing the server.

10. The cooling system of claim 9 , wherein the air delivery manifold is positioned in dead space of the server rack such that the air delivery manifold is encapsulated in the body.

11. The cooling system of claim 1 , wherein the first injection duct includes an input and a first output and provides a path for airflow between the input and the first output and the input is configured to be coupled to the first delivery port.

12. The cooling system of claim 11 , wherein the first output terminates in a vicinity of a thermally challenged area of the server to provide an airflow to the thermally challenged area.

13. The cooling system of claim 11 , wherein the first output terminates in a vicinity of a component of the server to provide an airflow to the component.

14. A server rack comprising:

an air mover module to generate a pressurized airflow, the air mover module including a centrifugal fan receiving air from a bottom of the server rack, wherein the air mover module is located within the server rack and external to first and second servers of the server rack;

an air delivery manifold having a first delivery port and fluidly coupled to the air mover module to receive the pressurized airflow from the air mover module, wherein the air delivery manifold provides a fluid path for the pressurized airflow, wherein the fluid path is enclosed between the air mover module and the first delivery port; and

a first injection duct encapsulated by a server chassis of the first server and configured to be fluidly coupled to the first delivery port to receive the pressurized airflow from the fluid path, wherein the first injection duct directs the pressurized airflow to a component location within the first server.

15. The server rack of claim 14 , wherein the first delivery port is coupled to an input of the first injection duct through an opening in the server chassis.

16. The server rack of claim 14 , wherein the air mover module is located in a bottom dead space of the server rack, the bottom dead space located in a bottom area of the server rack proximate a floor supporting the server rack.

17. The server rack of claim 16 , wherein the air mover module includes an air mover, a primary intake and an exhaust configured to couple to the air delivery manifold, wherein the air mover pulls air from the primary intake and compresses the air to provide the pressurized airflow out of the exhaust to the air delivery manifold.

18. The server rack of claim 17 , wherein the air delivery manifold includes a secondary intake and a set of delivery ports, the set of delivery ports comprising the first delivery port, wherein the air delivery manifold is hollow to provide the fluid path between the secondary intake and the set of delivery ports and the secondary intake is coupled to the exhaust to receive the pressurized airflow.

19. The server rack of claim 18 , wherein the air delivery manifold is positioned in dead space of the server rack such that the air delivery manifold is encapsulated in a body of the server rack.

20. A method of cooling a server stored in a rack, the method comprising:

compressing air from a primary intake at an air mover module to provide an airflow of compressed air out of an exhaust, the air mover module located within the server rack and external to the server, the air mover module including a centrifugal fan receiving air from a bottom of the server rack;

receiving the airflow from the exhaust at a secondary intake of an air delivery manifold that provides a fluid path to a delivery port;

receiving the airflow of compressed air at an input of an injection duct for the server from the first delivery port; and

outputting the airflow from an output of the injection duct, the output proximate a thermally challenged area of the server.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (042769/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.)
Reel/Frame 059803/0802 →
RELEASE OF SECURITY INTEREST AT REEL 042768 FRAME 0585 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; MOZY, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058297/0536 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY INTEREST (CREDIT) Recorded Jun 12, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; MOZY, INC.; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 042768/0585 →
PATENT SECURITY INTEREST (NOTES) Recorded Jun 12, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; MOZY, INC.; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 042769/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 7, 2017
From: CURTIS, ROBERT BOYD; SHELNUTT, AUSTIN M.
To: DELL PRODUCTS, LP
Reel/Frame 041929/0761 →