IP Library Granted Patent US 10,390,462
Granted Patent B2
US 10,390,462 · App. 15/435,048 · Granted Aug 20, 2019

Server chassis with independent orthogonal airflow layout

Inventors: Robert Boyd Curtis (Georgetown, TX); Robert Warren Johnson (Round Rock, TX)
Assignee: Dell Products, LP
H05K7/20727G06F1/20H05K7/20145
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Quick Facts
Patent No.
US 10,390,462
App. No.
15/435,048
Granted
Aug 20, 2019
Kind
B2
Abstract

A chassis includes a front and back portion. The front portion includes a plurality of compute devices and a first plurality of fans. The back portion includes a plurality of input/output devices and a second plurality of fans. A first airflow zone extends from the front portion to the back portion, the first airflow zone to direct a first airflow from the compute device to the second fans. A second airflow zone extends from the front portion to the back portion, the second airflow zone to provide a second airflow from the first fans to the input/output devices, and to isolate the second airflow from the first airflow zone.

Claims (41)

1. A chassis comprising:

a plurality of compute devices located within a front portion of the chassis;

a plurality of input/output devices located within a back portion of the chassis;

a first plurality of fans located within the front portion of the chassis, wherein the first fans provide a first airflow to only the input/output devices;

a second plurality of fans located within the back portion of the chassis, wherein the second fans provide a second airflow to only the compute devices, wherein the second airflow provided to the compute devices by the second fans is isolated from the second airflow provided to the input/output devices by the first fans; and

a plurality of power supply units including a third plurality of fans, wherein the third fans provide a third airflow to only the power supply units.

2. The chassis of claim 1 further comprising:

a bulkhead connected between the front portion and the back portion, the bulkhead to direct the first airflow from the first fans to the input/output devices.

3. The chassis of claim 1 further comprising:

a sealing surface connected between the front portion and the back portion, the sealing surface includes a plurality of openings to direct the first airflow from the compute devices to the second fans.

4. The chassis of claim 1 wherein the compute devices and the first fans are vertically oriented within the front portion of the chassis.

5. The chassis of claim 4 wherein the input/output devices and the second fans are horizontally oriented within the back portion of the chassis.

6. The chassis of claim 1 wherein the first fans are configured to be located between a first group of the compute devices and a second group of the compute devices.

7. The chassis of claim 1 wherein the second fans are configured to be located between a first group of the input/output devices and a second group of the input/output devices.

8. The chassis of claim 1 further comprising a front panel, wherein the first fans are configured to extend vertically down the center of the front panel.

9. The chassis of claim 7 further comprising a back panel, wherein the first fans are configured to extend horizontally across the back panel.

10. A chassis comprising:

a front portion including a plurality of compute devices and a first plurality of fans;

a back portion including a plurality of input/output devices and a second plurality of fans;

a first airflow zone extending from the front portion to the back portion, the first airflow zone to direct a first airflow from the compute device to the second fans;

a second airflow zone extending from the front portion to the back portion, the second airflow zone to direct a second airflow from the first fans to the input/output devices, wherein the first airflow zone isolates the first airflow from the input/output devices and the first fans; and

a third airflow zone extending from the front portion to the back portion, the third airflow zone to direct a third airflow from a plurality of power supply units in the front portion to a plurality of exhaust ports in the back portion, wherein the third airflow is provided only to the power supply units.

11. The chassis of claim 10 further comprising:

a bulkhead connected between the front portion and the back portion, the bulkhead to direct the second airflow from the first fans to the input/output devices.

12. The chassis of claim 10 further comprising:

a sealing surface connected between the front portion and the back portion, the sealing surface includes a plurality of openings to direct the second airflow from the compute devices to the second fans.

13. The chassis of claim 10 wherein the second airflow zone isolates the second airflow from the compute devices and the second fans.

14. The chassis of claim 10 wherein the compute devices and the first fans are vertically oriented within the front portion of the chassis.

15. The chassis of claim 14 wherein the input/output devices and the second fans are horizontally oriented within the back portion of the chassis.

16. The chassis of claim 11 wherein the bulkhead includes an airflow guide, the airflow guide configured to direct the second airflow to a first group of the input/output devices and to a second group of the input/output devices.

17. A chassis comprising:

a front portion including a plurality of compute devices and a first plurality of fans;

a back portion including a plurality of input/output devices and a second plurality of fans;

a first airflow zone extending from the front portion to the back portion, the first airflow zone to direct a first airflow from the compute device to the second fans;

a second airflow zone extending from the front portion to the back portion, the second airflow zone to direct a second airflow from the first fans to the input/output devices, wherein the first airflow zone isolates the first airflow from the input/output devices and the first fans, and the second airflow zone isolates the second airflow from the compute devices and the second fans;

a third airflow zone extending from the front portion to the back portion, the third airflow zone to direct a third airflow from a plurality of power supply units in the front portion to a plurality of exhaust ports in the back portion, wherein the third airflow is provided only to the power supply units;

a bulkhead connected between the front portion and the back portion, the bulkhead to direct the second airflow from the first fans to the input/output devices; and

a sealing surface connected between the front portion and the back portion, the sealing surface including a plurality of openings to direct the second airflow from the compute devices to the second fans.

18. The chassis of claim 17 wherein the compute devices and the first fans are vertically oriented within the front portion of the chassis.

19. The chassis of claim 18 wherein the input/output devices and the second fans are horizontally oriented within the back portion of the chassis.

20. The chassis of claim 17 wherein the openings are configured to enable the second fans to pull the first airflow from the compute devices to the back portion and to enable the first fans to push the second airflow from the front portion to the input/output devices.

Assignments (12)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (051302/0528) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.); SECUREWORKS CORP.
Reel/Frame 060438/0593 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (042769/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.)
Reel/Frame 059803/0802 →
RELEASE OF SECURITY INTEREST AT REEL 042768 FRAME 0585 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; MOZY, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058297/0536 →
RELEASE OF SECURITY INTEREST AT REEL 051449 FRAME 0728 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.; SECUREWORKS CORP.; EMC CORPORATION
Reel/Frame 058002/0010 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Dec 31, 2019
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.; SECUREWORKS CORP.; EMC CORPORATION
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
Reel/Frame 051449/0728 →
PATENT SECURITY AGREEMENT (NOTES) Recorded Dec 16, 2019
From: DELL PRODUCTS L.P.; EMC IP HOLDING COMPANY LLC; WYSE TECHNOLOGY L.L.C.; SECUREWORKS CORP.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 051302/0528 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
PATENT SECURITY INTEREST (NOTES) Recorded Jun 12, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; MOZY, INC.; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 042769/0001 →
PATENT SECURITY INTEREST (CREDIT) Recorded Jun 12, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; MOZY, INC.; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 042768/0585 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 7, 2017
From: CURTIS, ROBERT BOYD; JOHNSON, ROBERT WARREN
To: DELL PRODUCTS, LP
Reel/Frame 041929/0758 →
Continuity (1)
Related Publication 20180235105A1 · Aug 16, 2018