Radiation-sensitive composition and pattern-forming method
A radiation-sensitive composition includes particles including a metal oxide as a principal component, and an organic solvent. A metal atom constituting the metal oxide includes a first metal atom that is a zinc atom, a boron atom, an aluminum atom, a gallium atom, a thallium atom, a germanium atom, an antimony atom, a bismuth atom, a tellurium atom, or a combination thereof. A percentage content of the first metal atom with respect to total metal atoms in the radiation-sensitive composition is no less than 50 atomic %. A pattern-forming method includes applying the radiation-sensitive composition to form a film on a substrate, exposing the film, and developing the film exposed.
1. A radiation-sensitive composition comprising:
particles comprising a metal oxide as a principal component;
a radiation-sensitive acid generator selected from the group consisting of a N-sulfonyloxyimide compound, a diazo ketone compound, and a combination thereof; and
an organic solvent,
wherein:
the metal oxide comprises at least one metal atom selected from the group consisting of a zinc atom, a boron atom, an aluminum atom, a gallium atom, a thallium atom, a germanium atom, an antimony atom, a bismuth atom, and a tellurium atom;
a van der Waals volume of an acid generated from the radiation-sensitive acid generator is less than 2.0×10 −28 m 3 ; and
a percentage content of the at least one metal atom with respect to total metal atoms in the radiation-sensitive composition is no less than 50 atomic %.
2. The radiation-sensitive composition according to claim 1 , wherein an average particle diameter of the particles is no greater than 20 nm.
3. The radiation-sensitive composition according to claim 1 , wherein the particles further comprise a ligand derived from an organic acid.
4. The radiation-sensitive composition according to claim 3 , wherein the organic acid is at least one selected from the group consisting of a carboxylic acid, a sulfonic acid, a sulfinic acid, an organic phosphinic acid, an organic phosphonic acid, a phenol, an enol, a thiol, an acid imide, an oxime, and a sulfonamide.
5. The radiation-sensitive composition according to claim 3 , wherein the organic acid is a carboxylic acid.
6. The radiation-sensitive composition according to claim 3 , wherein the organic acid is a monocarboxylic acid.
7. The radiation-sensitive composition according to claim 3 , wherein the organic acid is at least one selected from the group consisting of methacrylic acid, tiglic acid, benzoic acid, m-toluic acid, o-toluic acid, and 3-iodobenzoic acid.
8. The radiation-sensitive composition according to claim 3 , wherein a percentage content of the ligand derived from the organic acid is from 40 to 95% by mass.
9. The radiation-sensitive composition according to claim 3 , wherein a percentage content of the ligand derived from the organic acid is from 60 to 90% by mass.
10. The radiation-sensitive composition according to claim 1 , wherein the metal oxide comprises zinc and a ligand derived from benzoic acid.
11. The radiation-sensitive composition according to claim 1 , wherein the percentage content of the at least one metal atom with respect to the total metal atoms in the radiation-sensitive composition is no less than 80 atomic %.
12. The radiation-sensitive composition according to claim 1 , wherein the percentage content of the at least one metal atom with respect to the total metal atoms in the radiation-sensitive composition is no less than 95 atomic %.
13. The radiation-sensitive composition according to claim 1 , wherein the number of the at least one metal atom in the particles is from 2 to 6.
14. A pattern-forming method comprising:
applying the radiation-sensitive composition according to claim 1 to form a film on a substrate;
exposing the film; and
developing the film exposed.
15. The pattern-forming method according to claim 14 , wherein a developer solution used in the developing is an alkaline aqueous solution.
16. The pattern-forming method according to claim 15 , wherein a radioactive ray used in the exposing is an extreme ultraviolet ray or an electron beam.
17. The pattern-forming method according to claim 14 , wherein a developer solution used in the developing is an organic solvent-containing liquid.
18. The pattern-forming method according to claim 17 , wherein a radioactive ray used in the exposing is an extreme ultraviolet ray or an electron beam.
19. The pattern-forming method according to claim 14 , wherein a radioactive ray used in the exposing is an extreme ultraviolet ray or an electron beam.
20. The radiation-sensitive composition according to claim 3 , wherein the radiation-sensitive composition consists of:
the particles;
the radiation-sensitive acid generator;
the solvent;
optionally, a ligand other than the ligand derived from the organic acid; and
optionally, a surfactant.