Thermoforming with precision in-lay
View Patent ↗A thermoforming in-lay technique is discussed that uses retractable pins to hold an in-lay piece securely in place in a primary mold. The in-lay piece is fabricated prior to the primary molding process and creates multiple pin receivers in the in-lay that are retractably engaged by the retractable pins when placed into the primary mold. When the primary substrate is formed into the primary mold, the retractable pins prevent the in-lay piece from moving out of position. Once the primary substrate has cooled sufficiently, the pins are retracted allowing the finished primary carrier art to be removed from the primary mold.
1. A primary mold for thermoforming, the primary mold comprising:
an in-lay pattern negative-image configured to receive an in-lay piece; and
a plurality of retractable pins configured to retractably engage a plurality of pin receivers formed in a positioning portion of the in-lay piece placed in the primary mold during formation of a heated substrate, wherein the primary mold is configured to form the heated substrate around at least all exposed edges not in the positioning portion of the in-lay piece not in contact with the primary mold.
2. The primary mold of claim 1 further comprising:
a primary pattern negative-image configured to receive heated substrate to thermoform a primary carrier piece, the primary pattern negative-image positioning the heated substrate over the in-lay piece.
3. A non-transitory computer-readable medium having program code recorded thereon, the program code comprising:
program code executable by a computer for causing the computer to place an in-lay piece into a primary mold, the in-lay piece having a plurality of pin receivers retractably engaged by a plurality of retractable pins in the primary mold;
program code executable by the computer for causing the computer to form a heated substrate into the primary mold, wherein the heated substrate forms around at least all exposed edges not in a positioning portion of the in-lay piece not in contact with the primary mold, wherein the plurality of retractable pins are being received into the plurality of pin receivers on the in-lay piece placed within the primary mold cavity during formation of the heated substrate into the primary mold;
program code executable by the computer for causing the computer to cool the heated substrate;
program code executable by the computer for causing the computer to retract the plurality of retractable pins; and
program code executable by the computer for causing the computer to remove a primary carrier part from the primary mold, the primary carrier part comprising the in-lay piece molded into the heated substrate.
4. The non-transitory computer-readable medium of claim 3 further comprising:
program code executable by the computer for causing the computer to trim the plurality of pin receivers and excess flashing from the primary carrier part.
5. The non-transitory computer-readable medium of claim 3 further comprising:
program code executable by the computer for causing the computer to form the in-lay piece, wherein the program code executable by the computer for causing the computer to form the in-lay piece comprises:
program code executable by the computer for causing the computer to heat a sheet of substrate;
program code executable by the computer for causing the computer to form the heated sheet of substrate into an in-lay mold, the in-lay mold including a plurality of pin-extrusions for forming the plurality of pin receivers in the heated sheet of substrate;
program code executable by the computer for causing the computer to cool the heated sheet of substrate; and
program code executable by the computer for causing the computer to remove the in-lay piece from the in-lay mold.
6. An apparatus configured for in-lay forming, said apparatus comprising:
at least one processor; and
a memory coupled to said at least one processor,
wherein said at least one processor is configured:
to cause placement of an in-lay piece into a primary mold, the in-lay piece having a plurality of pin receivers retractably engaged by a plurality of retractable pins in the primary mold;
to cause formation of a heated substrate into the primary mold, wherein the heated substrate forms around at least all exposed edges not in a positioning portion of the in-lay piece not in contact with the primary mold, wherein the plurality of retractable pins are being received into the plurality of pin receivers on the in-lay piece placed within the primary mold cavity during the formation;
to cause cooling of the heated substrate;
to cause the plurality of retractable pins to retract; and
to cause removal of a primary carrier part from the primary mold, the primary carrier part comprising the in-lay piece molded into the heated substrate.
7. The apparatus of claim 6 wherein the at least one processor is further configured to cause trimming of the plurality of pin receivers and excess flashing from the primary carrier part.
8. The apparatus of claim 6 wherein the at least one processor is further configured:
to cause formation of the in-lay piece, wherein the configuration of the at least one processor to cause formation of the in-lay piece comprises configuration:
to cause heating of a sheet of substrate;
to cause formation of the heated sheet of substrate into an in-lay mold, the in-lay mold including a plurality of pin-extrusions for forming the plurality of pin receivers in the heated sheet of substrate;
to cause cooling of the heated sheet of substrate; and
to cause removal the in-lay piece from the in-lay mold.