High temperature stable thermally conductive materials
View Patent ↗Disclosed herein are compositions, preparation methods, and use of thermally conductive materials comprising silicone composition curable by hydrosilylation, thermally conductive fillers, and phthalocyanine. The novel composition retains its desirable pliability after cure even when kept at an elevated temperature for an extended period.
1. A composition comprising
(A) an organoalkylpolysiloxane having in one molecule on average at least 0.1 silicon-bonded alkenyl groups;
(B) a polyorganosiloxane having in one molecule on average at least 2 silicon- bonded hydrogen atoms, the molar ratio of SiH groups in the component (B) to aliphatically unsaturated organic group in the component (A) is 3:1 to 0.1:1;
(C) a hydrosilylation reaction catalyst in an amount sufficient to initiate curing of the composition (A) and (B);
(D) a thermally conductive filler, wherein the thermally conductive filler is selected from aluminum nitride, aluminum oxide, aluminum trihydrate, barium titanate, beryllium oxide, boron nitride, carbon fibers, diamond, graphite, magnesium hydroxide, magnesium oxide, metal particulate, onyx, silicon carbide, tungsten carbide, zinc oxide, and a combination thereof, and wherein the thermally conductive filler is in an amount ranging from 50% to 97% by volume of the composition; and
(E) an additive selected from the group consisting of metal-free and metal-containing phthalocyanine compounds, wherein the amount of the additive is from 0.01 to 5.0 weight % of the composition.
2. The composition according to claim 1 wherein the additive is a metal-containing phthalocyanine compound in 0.05 to 0.2 weight % of the composition.
3. The composition according to claim 2 wherein the metal is copper.
4. The composition according to claim 3 wherein the copper-containing phthalocyanine compound is 29H, 31H-phthalocyaninato (2-)-N29, N30, N31, N32 Copper.
5. The composition according to claim 1 wherein the thermally conductive filler is selected from aluminum nitride and boron nitride.
6. A cured silicone prepared by curing the composition of claim 1 .
7. A thermal interface material comprising the cured silicone according to claim 6 .
8. The thermal interface material according to claim 7 wherein the material comprises a support coated with the cured silicone.
9. A method of increasing the stability of a thermally conductive organopolysiloxane composition comprising the step of adding a phthalocyanine compound ranging from 0.01 to 5.0 weight % of the whole composition and thermally conductive filler ranging from 50% to 97% by volume of the whole composition to the curable organopolysiloxane composition, wherein molar ratio of SiH:Vi of the curable organopolysiloxane composition is from 3:1 to 0.1:1.
10. A method of conducting heat from a first component to a second component wherein the first component has a higher temperature than the second component and the thermal interface material according to claim 7 is in contact with the first component and with the second component.
11. A method of dissipating heat from a first component wherein the thermal interface material according to claim 8 is in contact with the first component.
12. The composition according to claim 1 wherein the thermally conductive filler is selected from aluminum oxide, beryllium oxide, magnesium oxide, boron nitride and zinc oxide.
13. The composition according to claim 1 wherein the thermally conductive filler is aluminum trihydrate.
14. The composition according to claim 1 wherein the thermally conductive filler is selected from barium titanate, carbon fibers, diamond, graphite, magnesium hydroxide, and a combination thereof.
15. The composition according to claim 1 wherein the thermally conductive filler is metal particulate and the metal particulate is selected from the group consisting of aluminum, copper, gold, nickel, tin, silver, and combinations thereof.
16. The composition according to claim 1 wherein the thermally conductive filler is onyx.
17. The composition according to claim 1 wherein the thermally conductive filler is selected from silicon carbide and tungsten carbide.