Cooling a heat-generating electronic device

1. A system comprising:

a primary Printed Circuit Board (PCB) including at least one heat generating device and at least one thermal conductive inlay, the at least one thermal conductive inlay being attached to the at least one heat generating device; and

a heat transfer device attached to the primary PCB, the heat transfer device comprising:

a secondary PCB thermally coupled to the primary PCB, wherein the secondary PCB comprises a heat transfer material layer, at least one side of the heat transfer material layer being at least partially covered by an electrical insulation material layer;

at least one heat dissipation component, the at least one heat dissipation component having a first side attached to the at least one thermal conductive inlay of the primary PCB and a second side attached to the secondary PCB, wherein the second side of the at least one heat dissipation component is thermally coupled to a metal layer positioned on the electrical insulation material layer of the secondary PCB; and

at least one heat sink thermally coupled to the secondary PCB and electrically isolated, by an electrical insulation material, from the at least one heat dissipation component,

wherein the electrical insulation material is disposed between the at least one heat dissipation component and the at least one heat sink, and

wherein the heat transfer device is configured to dissipate heat generated by the at least one heat generating device to the at least one heat sink.

2. The system of claim 1 , wherein the heat transfer material layer includes an aluminum base or aluminum core.

3. The system of claim 1 , wherein the first side of the at least one heat dissipation component is soldered to the at least one thermal conductive inlay of the primary PCB.

4. The system of claim 1 , wherein the secondary PCB is attached to the at least one heat sink.

5. The system of claim 1 , wherein the at least one heat generating device comprises at least one of a bipolar transistor, Field-Effect Transistor (FET) (e.g. MOSFET, GaN, and SiC), insulated-gate bipolar transistor (IGBT), integrated chip, resistor, diode, or other electronic component.

6. The system of claim 1 , wherein the thermal conductive inlay comprises a metal inlay that is soldered to the at least one heat generating device.

7. The system of claim 1 , wherein the at least one heat dissipation component comprises a metal block.

8. A system comprising:

a first Printed Circuit Board (PCB) including at least one heat generating device; and

a heat transfer device attached to the first PCB, the heat transfer device comprising:

a second PCB that is thermally coupled to the first PCB and exclusive of heat generating devices, wherein the second PCB comprises a heat transfer material layer, at least one side of the heat transfer material layer being at least partially covered by an electrical insulation material layer;

at least one coupling member comprising a heat transfer material, the at least one coupling member having a first side attached to the first PCB and a second side attached to the second PCB, wherein the second side of the at least one coupling member is thermally coupled to a metal layer positioned on the electrical insulation material layer of the second PCB; and

at least one heat sink thermally coupled to the second PCB and electrically isolated, by an electrical insulation material, from the at least one heat generating device,

wherein the electrical insulation material is disposed between the at least one heat generating device and the at least one heat sink, and

wherein the heat transfer device is configured to dissipate heat generated by the at least one heat generating device to the at least one heat sink.

9. The system of claim 8 , wherein the second PCB is screwed into the at least one heat sink.

10. The system of claim 8 , wherein:

the first PCB comprises at least one thermal conductive inlay that is attached to the at least one heat generating device; and

the first side of the at least one coupling member is attached to the at least one thermal conductive inlay.

11. A robotic system comprising:

a motor driver board that comprises a plurality of heat generating devices and a plurality of metal inlays, each of the plurality of metal inlays being attached to one of the plurality of heat generating devices; and

a heat transfer device positioned between the motor driver board and a robot frame, the heat transfer device comprising:

a Printed Circuit Board (PCB) thermally coupled to the motor driver board, wherein the PCB comprises a heat transfer material layer, at least one side of the heat transfer material layer being at least partially covered by an electrical insulation material layer; and

a plurality of heat dissipation blocks, each of the plurality of heat dissipation blocks having a first side attached to one of the metal inlays and a second side attached to the PCB,

wherein the second side of each of the plurality of heat dissipation blocks is thermally coupled to a metal layer positioned on the electrical insulation material layer of the PCB, and

wherein the plurality of heat dissipation blocks are electrically isolated from the robot frame by an electrical insulation material disposed between the plurality of heat dissipation blocks and the robot frame.

12. The robotic system of claim 11 , wherein the plurality of metal inlays comprises copper inlays.

13. The robotic system of claim 11 , wherein the plurality of heat dissipation blocks comprises copper blocks.

14. The robotic system of claim 11 , wherein the robot frame comprises aluminum alloy.

15. The robotic system of claim 14 , wherein the PCB comprises an aluminum-based PCB.

16. The robotic system of claim 11 , wherein the robot frame comprises copper alloy.

17. The robotic system of claim 16 , wherein the PCB comprises a copper-based PCB.

18. A method comprising:

receiving heat generated by at least one heat generating device to a thermal conductive inlay of a first Printed Circuit Board (PCB) that supports the heat generating device;

transferring the received heat from the thermal conductive inlay of the first PCB through at least one heat dissipation block that is attached to the first PCB and a second PCB, wherein the second PCB comprises a heat transfer material layer, at least one side of the heat transfer material layer being at least partially covered by an electrical insulation material layer, and wherein the at least one heat dissipation block has a first side attached to the thermal conductive inlay of the first PCB and a second side attached to the second PCB, the second side of the at least one heat dissipation block being thermally coupled to a metal layer positioned on the electrical insulation material layer of the second PCB;

transferring the received heat from the at least one heat dissipation block to the second PCB;

transferring the received heat from the second PCB to a heat sink, the heat sink thermally coupled to the second PCB and electrically isolated from the at least one heat dissipation block by the electrical insulation material,

wherein the electrical insulation material is disposed between the at least one heat dissipation block and the heat sink; and

dissipating the received heat at the heat sink.