Ceramic-wound-capacitor with lead lanthanum zirconium titanate dielectric
A ceramic-wound-capacitor includes a first-electrically-conductive-layer, a dielectric-layer, a second-electrically-conductive-layer, and a protective-coating. The dielectric-layer is formed of lead-lanthanum-zirconium-titanate (PLZT). The protective-coating has a thickness of less than ten micrometers (10 μm) and provides electrical isolation between the first-electrically-conductive-layer and the second-electrically-conductive-layer of the ceramic-wound-capacitor. A method for fabricating the ceramic-wound-capacitor includes the steps of feeding a carrier-strip, depositing a sacrificial layer, depositing a first-electrically-conductive-layer, depositing a dielectric-layer, and depositing a second-electrically-conductive-layer to form an arrangement coupled to the carrier-strip by the sacrificial-layer, separating the arrangement from the carrier-strip and sacrificial-layer, creating an exposed-surface of the first-electrically-conductive-layer, applying a protective-coating to the exposed-surface of the first-electrically-conductive-layer, winding the arrangement with the protective-coating to form a ceramic-wound-capacitor, where the protective-coating is in direct contact with the first-electrically-conductive-layer and the second-electrically-conductive-layer of the ceramic-wound-capacitor.
1. A method for fabricating a ceramic-wound-capacitor, said method comprising:
providing an apparatus configured to feed a carrier-strip through a deposition-process, wherein the deposition-process includes;
depositing a sacrificial-layer on top of the carrier-strip;
depositing a first-electrically-conductive-layer on top of the sacrificial-layer;
depositing a dielectric-layer of lead-lanthanum-zirconium-titanate (PLZT) on top of the first-electrically-conductive-layer;
depositing a second-electrically-conductive-layer on top of the dielectric-layer, thereby forming an arrangement formed of the first-electrically-conductive-layer, the dielectric-layer, and the second-electrically-conductive-layer, said arrangement coupled to the carrier-strip by the sacrificial-layer; then
separating the arrangement from the carrier-strip and the sacrificial-layer to define an exposed-surface of the first-electrically-conductive-layer opposite the dielectric-layer;
applying a protective-coating to the exposed-surface; and
winding the arrangement with the protective-coating to form a ceramic-wound-capacitor.
2. The method of claim 1 , wherein depositing the PLZT is performed at a temperature between 10 degrees Celsius and 38 degrees Celsius.
3. The method of claim 1 , wherein the carrier-strip is a polymeric compound.
4. The method of claim 2 , wherein the polymeric compound is one of polyimide and polyester.
5. The method of claim 1 , wherein the carrier-strip is collected by the apparatus after separating the carrier-strip from the arrangement.
6. The method of claim 1 , wherein winding the arrangement places the protective-coating in direct contact with the second-electrically-conductive-layer.
7. The method of claim 1 , wherein depositing the dielectric-layer includes spraying the PLZT.