IP Library Patent Application 15448275
Patent Application
App. No. 15/448,275

SEAM TAPES INCLUDING FIBER BASED CIRCUITRY

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Quick Facts
Patent No.
US None
App. No.
15/448,275
Abstract

Systems and methods which make use of metalized fabrics and threads as wiring by attaching them to clothing as a part of a seam tape. The attachment may occur at the seam through a seam tape which is already being used with the garment, or it may occur by attaching the seam tape to a seam, or simply a surface of the garment, to position the wiring in the desired location.

Claims (35)

1 . A seam tape comprising:

a top layer;

an underlayment layer;

an adhesive layer arranged between said top layer and said underlayment layer; and

an electrically conductive wire, said wire being positioned within said adhesive layer and between said underlayment layer and said top layer;

wherein, said seam tape is configured to bond to a fabric placed proximate said underlayment layer via adhesive in said adhesive layer.

2 . The seam tape of claim 1 wherein said wire comprises a metallic thread.

3 . The seam tape of claim 1 wherein said wire comprises a metallized fiber.

4 . The seam tape of claim 1 wherein said wire comprises an elongated strip of metalized fabric.

5 . The seam tape of claim 4 wherein said elongated strip includes ends with a larger per unit area than a connection between said ends.

6 . The seam tape of claim 5 wherein said top layer includes a hole therethrough so a portion of at least one of said ends is electrically accessible through said hole.

7 . The seam tape of claim 4 wherein said top layer includes a hole therethrough so a portion of said metalized fabric is electrically accessible through said hole.

8 . The seam tape of claim 1 wherein said adhesive is a thermosetting adhesive.

9 . The seam tape of claim 1 wherein said adhesive is a sonic bonding adhesive.

10 . The seam tape of claim 1 wherein said top layer is water resistant.

11 . A seam tape comprising:

a top layer;

an adhesive layer arranged on said top layer; and

an electrically conductive wire, said wire being positioned within said adhesive layer;

wherein, said seam tape is configured to bond to a fabric placed proximate said adhesive layer via an adhesive in said adhesive layer.

12 . An article of clothing comprising:

fabric forming said clothing; and

a seam tape including:

a top layer;

an adhesive layer arranged on said top layer; and

an electrically conductive wire, said wire being positioned within said adhesive layer;

wherein, said seam tape is bonded to said fabric via an adhesive in said adhesive layer.

13 . The article of clothing of claim 12 , wherein said seam tape is positioned on an interior of said article of clothing.

14 . The article of clothing of claim 12 , wherein said seam tape is positioned on a sewn seam of said article of clothing.

15 . The article of clothing of claim 12 , wherein said seam tape further comprises an underlayment layer with said adhesive layer positioned between said top layer and said underlayment layer, and said underlayment layer is in contact with said fabric forming said clothing.

16 . The article of clothing of claim 12 wherein said wire comprises a metallic thread.

17 . The article of clothing of claim 12 wherein said wire comprises a metallized fiber.

18 . The article of clothing of claim 12 wherein said wire comprises an elongated strip of metalized fabric.

19 . The article of clothing of claim 18 wherein said elongated strip includes ends with a larger per unit area than a connection between said ends.

20 . The article of clothing of claim 18 wherein said top layer includes a hole therethrough so a portion of said metalized fabric is electrically accessible through said hole.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Oct 15, 2021
From: JPMORGAN CHASE BANK, N.A.
To: NOBLE BIOMATERIALS, INC.; SAUQUOIT INDUSTRIES, LLC; NOBEL FIBER TECHNOLOGIES, LLC
Reel/Frame 057810/0044 →
SECURITY INTEREST Recorded Oct 18, 2018
From: NOBLE BIOMATERIALS, INC.; SAUQUOIT INDUSTRIES, LLC; NOBEL FIBER TECHNOLOGIES, LLC
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 047211/0762 →