Semiconductor integrated circuit device
Prior known static random access memory (SRAM) cells are required that a diffusion layer be bent into a key-like shape in order to make electrical contact with a substrate with a P-type well region formed therein, which would result in a decrease in asymmetry leading to occurrence of a problem as to the difficulty in micro-patterning. To avoid this problem, the P-type well region in which an inverter making up an SRAM cell is formed is subdivided into two portions, which are disposed on the opposite sides of an N-type well region NW 1 and are formed so that a diffusion layer forming a transistor has no curvature while causing the layout direction to run in a direction parallel to well boundary lines and bit lines. At intermediate locations of an array, regions for use in supplying power to the substrate are formed in parallel to word lines in such a manner that one regions is provided per group of thirty two memory cell rows or sixty four cell rows.
1. A semiconductor integrated circuit device comprising:
a first N-well region provided on a main surface of a semiconductor substrate and extending in a first direction;
a first P-well region and a second P-well region which are formed on the main surface of the semiconductor substrate at first and second sides respectively of the first N-well region in a plan view, the first and second P-well regions extending longitudinally in the first direction, the first N-well region and the first and second P-well regions being continuously extended on a first region and a second region of the semiconductor substrate in the plan view, the first region and the second region being at different positions along the first direction, with the entirety of the second region being disposed to one side of the first region in the first direction such that, in the plan view, the second region has no overlap with the first region and no portion of the second region is adjacent to the first region in a second direction substantially perpendicular to the first direction;
an SRAM cell formed on the main surface of the semiconductor substrate in the first region, the SRAM cell including:
a first inverter comprising a first N-channel transistor and a first P-channel transistor which are series connected to each other,
a second inverter comprising a second N-channel transistor and a second P-channel transistor which are series connected to each other, the first and second inverters being cross-coupled to each other;
a third N-channel transistor as a first transfer transistor coupled to an output of the first inverter; and
a fourth N-channel transistor as a second transfer transistor coupled to an output of the second inverter;
a word line formed over the main surface of the semiconductor substrate and extending longitudinally in the second direction in the plan view, the word line being coupled to gate electrodes of the third and fourth N-channel transistors; and
a first bit line and a second bit line formed over the main surface of the semiconductor substrate and extending longitudinally in the first direction, each of the first and second bit lines being coupled to a respective one of source and drain regions of the third and fourth N-channel transistors;
wherein the first and third N-channel transistors have a first diffusion layer which is formed in the first P-well region and forms source and drain regions and channel regions,
wherein the first diffusion layer extends longitudinally along the first direction across gate electrodes of the first and third N-channel transistors in the plan view,
wherein a first contact for supplying a source potential to the first N-channel transistor is disposed on the first diffusion layer at one side of the gate electrode of the first N-channel transistor,
wherein a second contact for providing an electrical connection between the first bit line and the third N-channel transistor is disposed on the first diffusion layer at one side of the gate electrode of the third N-channel transistor, and
wherein the first and second contacts are arranged in a substantially straight line along the first direction in the plan view,
wherein, in the plan view, no memory cell is formed in the second region,
wherein a first well contact for supplying a first well voltage to the first P-well region is disposed on the first P-well region at the second region in the plan view, and no well contact for supplying the first well voltage to the first P-well region is disposed on the first P-well region at the first region in the plan view, and
wherein the first diffusion layer has no bent portion with another contact disposed thereon in the plan view.
2. A semiconductor integrated circuit device according to claim 1 , further comprising a second well contact for supplying the first well voltage to the second P-well region and a third contact for supplying a second well voltage to the first N-well region,
wherein the second well contact is disposed on the second P-well region at the second region in the plan view, and no well contact for supplying the first well voltage to the second P-well region is disposed on the second P-well region at the first region in the plan view, and
wherein the third well contact is disposed on the first N-well region at the second region in the plan view, and no well contact for supplying the second well voltage to the first N-well region is disposed on the first N-well region at the first region in the plan view.
3. A semiconductor integrated circuit device according to claim 2 , wherein each of the gate electrodes of the first and third N-channel transistors is extended in the second direction without bending along the first direction in the plan view.
4. A semiconductor integrated circuit device according to claim 3 , wherein a channel width of the first N-channel transistor is wider than a channel width of the third N-channel transistor, and wherein the channel widths of the first and third N-channel transistors are defined by a width of the first diffusion layer in the second direction.
5. A semiconductor integrated circuit device according to claim 1 , wherein a configuration of the first diffusion layer in the plan view is defined by a field region formed on the main surface of the semiconductor substrate.
6. A semiconductor integrated circuit device according to claim 5 , wherein the field region comprises a field oxide film.
7. A semiconductor integrated circuit device according to claim 2 , wherein the first P-channel transistor has a second diffusion layer which is formed in the first N-well region and forms source and drain regions and a channel region,
wherein the second diffusion layer extends along the first direction across a gate electrode of the first P-channel transistor in the plan view,
wherein the gate electrodes of the first P-channel transistor and the first N-channel transistor are formed of a first common conductive layer continuously extending over portions of the first N-well region and the first P-well region.
8. A semiconductor integrated circuit device according to claim 7 , wherein the gate electrodes of the first P-channel transistor and the first N-channel transistor are formed of a polycrystalline silicon layer.
9. A semiconductor integrated circuit device according to claim 2 , wherein a voltage level of the first well voltage is lower than that of the second well voltage, and wherein the voltage level of the first well voltage is substantially the same as that of a source potential.
10. A semiconductor integrated circuit device comprising:
a first N-well region provided on a main surface of a semiconductor substrate and extending longitudinally in a first direction;
a first P-well region and a second P-well region which are formed on the main surface of the semiconductor substrate at first and second sides respectively of the first N-well region in a plan view, the first and second P-well regions extending longitudinally in the first direction, the first N-well region and the first and second P-well regions being continuously extended on a first region and a second region of the semiconductor substrate in the plan view, the first region and the second region being at different positions along the first direction, with the entirety of the second region being disposed to one side of the first region in the first direction such that, in the plan view, the second region has no overlap with the first region and no portion of the second region is adjacent to the first region in a second direction substantially perpendicular to the first direction;
an SRAM cell formed on the main surface of the semiconductor substrate in the first region, the SRAM cell including:
a first inverter comprising a first N-channel transistor and a first P-channel transistor which are series connected to each other,
a second inverter comprising a second N-channel transistor and a second P-channel transistor which are series connected to each other, the first and second inverters being cross-coupled to each other;
a third N-channel transistor as a first transfer transistor coupled to an output of the first inverter; and
a fourth N-channel transistor as a second transfer transistor coupled to an output of the second inverter;
a word line formed over the main surface of the semiconductor substrate and extending longitudinally in the second direction in the plan view, the word line being coupled to gate electrodes of the third and fourth N-channel transistors; and
a first bit line and a second bit line formed over the main surface of the semiconductor substrate and extending longitudinally in the first direction, each of the first and second bit lines being coupled to a respective one of source and drain regions of the third and fourth N-channel transistors;
wherein the first and third N-channel transistors have a first diffusion layer which is formed in the first P-well region and forms source and drain regions and channel regions,
wherein the first diffusion layer extends longitudinally along the first direction across gate electrodes of the first and third N-channel transistors in the plan view,
wherein a first contact for supplying a source potential to the first N-channel transistor is disposed on the first diffusion layer at one side of the gate electrode of the first N-channel transistor,
wherein a second contact for providing an electrical connection between the first bit line and the third N-channel transistor is disposed on the first diffusion layer at one side of the gate electrode of the third N-channel transistor, and
wherein the first and second contacts are arranged in a substantially straight line along the first direction in the plan view,
wherein the second and fourth N-channel transistors have a second diffusion layer which is formed in the second P-well region and forms source and drain regions and channel regions,
wherein the second diffusion layer extends longitudinally along the first direction across gate electrodes of the second and fourth N-channel transistors in the plan view,
wherein a third contact for providing a source potential to the second N-channel transistor is disposed on the second diffusion layer at one side of the gate electrode of the second N-channel transistor,
wherein a fourth contact for providing an electrical connection between the second bit line and the fourth N-channel transistor is disposed on the second diffusion layer at one side of the gate electrode of the fourth N-channel transistor, and
wherein the third and fourth contacts are arranged in a substantially straight line along the first direction in the plan view,
wherein, in the plan view, no memory cell is formed in the second region,
wherein a first well contact and a second well contact for supplying a first well voltage to the first and second P-well regions are disposed on the first and second P-well regions respectively at the second region in the plan view, no well contact for supplying the first well voltage to the first P-well region is disposed on the first P-well region at the first region in the plan view, and no well contact for supplying the first well voltage to the second P-well region is disposed on the second P-well region at the first region in the plan view,
wherein a third well contact for supplying a second well voltage to the first N-well region is disposed on the first N-well region at the second region in the plan view, and no well contact for supplying the second well voltage to the first N-well region is disposed on the first N-well region at the first region in the plan view,
wherein each of the first and second diffusion layers has no bent portion with another contact disposed thereon in the plan view, and
wherein a voltage level of the first well voltage is lower than that of the second well voltage, and wherein the voltage level of the first well voltage is substantially the same as that of a source potential.