Method for carrying out a sound test of atleast one component and endoscope device used for the same
A method is provided for carrying out a sound test for detecting and/or analyzing material faults and/or mounting faults of at least one component, in which the component is excited, by striking, to experience vibrations which generate soundwaves, after which the generated soundwaves are detected and conclusions are drawn about material faults and/or mounting faults on the basis of the detected soundwaves, wherein the striking of the component and the detection of the vibrations are carried out using an endoscope device. In addition, embodiments of the present invention relates to an endoscope device which is configured to carry out the method.
1. A method for carrying out a sound test for detecting and analyzing material faults and mounting faults of at least one component, in which the component is excited, by striking, to experience vibrations which generate soundwaves, after which the generated soundwaves are detected and conclusions are drawn about at least one of material faults and at least one of mounting faults on the basis of the detected soundwaves, wherein the striking of the component and the detection of the vibrations are carried out using an endoscope device, wherein the striking of the component is activated by means of a handling unit of the endoscope device.
2. The method as claimed in claim 1 , wherein the at least one component is a component which is arranged inside a housing, in particular a guide blade or rotor blade arranged inside a turbine housing or compressor housing, and in that the method is carried out with a closed housing.
3. The method as claimed in claim 1 , wherein the at least one component is a guide blade or rotor blade arranged inside a housing lower part of a turbine housing or compressor housing which is divided into a housing upper part and a housing lower part, and in that the method is carried out in a state in which the housing upper part is taken off and a rotor is arranged in the housing lower part.
4. The method as claimed in claim 1 , wherein the detected vibrations are output via a loudspeaker and subsequently analyzed manually by trained personnel for at least one of the detection and analysis of at least one of material faults and mounting faults of the component, without further technical aids.
5. The method as claimed in claim 1 , wherein the detected vibrations are transmitted to an evaluation device and compared therein automatically for the at least one of the detection and analysis of at least one of material faults and at least one of mounting faults of the component with reference values stored in the evaluation device.
6. The endoscope device, in which the endoscope device has at least one handling unit and a shaft which is connected thereto and is of rigid or flexible design and in which an image transmission device and a light transmission device are integrated in such a way that the image signals and light signals can be transmitted from the free end of the shaft to the handling unit, wherein a pulse generator which can be activated by the handling unit is formed in the shaft in such a way that when it is activated a component which is present in the region of the free end of the shaft can be struck.
7. The endoscope device as claimed in claim 6 , wherein a sensor device is provided in the region of the free end of the shaft and is formed in such a way that it generates signals representing received soundwaves and transmits them to the handling unit.
8. The endoscope device as claimed in claim 6 , wherein the image transmission device, the light transmission device and the sensor device are arranged in channels which are separate from one another and extend through the shaft as far as the free end of the shaft.
9. The endoscope device as claimed in claim 6 , wherein the image transmission device is provided in the form of a camera system.
10. The endoscope device as claimed in claim 6 , wherein the pulse generator has a firing pin which can be activated mechanically, pneumatically or electromechanically, by the handling unit.
11. The endoscope device as claimed in claim 6 , wherein the sensor device has a microphone, a laser vibrometer or an acceleration pickup.
12. The endoscope device as claimed in claim 6 , wherein an evaluation device is provided which is configured in such a way that it evaluates signals representing soundwaves transmitted by the sensor device, and compares a signal spectrum and impulse response of said signals with reference values stored in the evaluation device.
13. The endoscope device as claimed in claim 12 , wherein the evaluation device is arranged on the handling device or integrated therein.