IP Library Patent Application 15449278
Patent Application
App. No. 15/449,278

SUBSTRATE HOLDING APPARATUS

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Quick Facts
Patent No.
US None
App. No.
15/449,278
Abstract

A substrate holding apparatus includes a placing portion, a first depressurization unit, a second depressurization unit, a storage unit and a control unit. The placing portion includes a plurality of convex portions supporting a substrate, and includes a first region which faces a center portion of the substrate and second regions which face outer peripheral portions of the substrate. The first depressurization unit is configured to depressurize a space between the substrate and the first region. The second depressurization unit is configured to depressurize a space between the substrate and the second regions. The storage unit is configured to store shape information of the substrate. The control unit is configured to individually control each of the first depressurization unit and the second depressurization unit based on the shape information.

Claims (71)

1 . A substrate holding apparatus comprising:

a placing portion that includes a plurality of convex portions configured to support a substrate, and includes a first region which faces a center portion of the substrate and second regions which face outer peripheral portions of the substrate;

a first depressurization unit configured to depressurize a space between the substrate and the first region;

a second depressurization unit configured to depressurize a space between the substrate and the second regions;

a storage unit configured to store shape information of the substrate; and

a control unit configured to individually control each of the first depressurization unit and the second depressurization unit based on the shape information.

2 . The apparatus according to claim 1 ,

wherein the second regions are positioned at a position higher than a position of the first region in a direction which faces the substrate.

3 . The apparatus according to claim 1 ,

wherein the control unit is configured to change the order of the depressurization operations of the first depressurization unit and the second depressurization unit according to the shape information.

4 . The apparatus according to claim 2 ,

wherein the control unit is configured to change the order of the depressurization operations of the first depressurization unit and the second depressurization unit according to the shape information.

5 . The apparatus according to claim 1 ,

wherein the control unit is configured to control the first depressurization unit and the second depressurization unit so as to depressurize the first region and the second regions in the order from a region having a first distance between the substrate and the placing portion to a region having a second distance between the substrate and the placing portion such that the second distance is greater than the first distance.

6 . The apparatus according to claim 2 ,

wherein the control unit is configured to control the first depressurization unit and the second depressurization unit so as to depressurize the first region and the second regions in the order from a region having a first distance between the substrate and the placing portion to a region having a second distance between the substrate and the placing portion such that the second distance is greater than the first distance.

7 . The apparatus according to claim 3 ,

wherein the control unit is configured to control the first depressurization unit and the second depressurization unit so as to depressurize the first region and the second regions in the order from a region having a first distance between the substrate and the placing portion to a region having a second distance between the substrate and the placing portion such that the second distance is greater than the first distance.

8 . The apparatus according to claim 1 ,

wherein the first depressurization unit is configured to depressurize a space between the substrate and the first region in a first quadrant and a third quadrant of a plane coordinate system in which a center of a surface of the placing portion is set as an origin,

wherein the second depressurization unit is configured to depressurize a space between the substrate and the second regions in the first quadrant and the third quadrant of the plane coordinate system,

the apparatus further comprising:

a third depressurization unit configured to depressurize a space between the substrate and the first region in a second quadrant and a fourth quadrant of the plane coordinate system,

a fourth depressurization unit configured to depressurize a space between the substrate and the second regions in the second quadrant and the fourth quadrant of the plane coordinate system,

wherein the control unit is configured to individually control each of the first depressurization unit to the fourth depressurization unit based on the shape information.

9 . The apparatus according to claim 2 ,

wherein the first depressurization unit is configured to depressurize a space between the substrate and the first region in a first quadrant and a third quadrant of a plane coordinate system in which a center of a surface of the placing portion is set as an origin,

wherein the second depressurization unit is configured to depressurize a space between the substrate and the second regions in the first quadrant and the third quadrant of the plane coordinate system,

the apparatus further comprising:

a third depressurization unit configured to depressurize a space between the substrate and the first region in a second quadrant and a fourth quadrant of the plane coordinate system,

a fourth depressurization unit configured to depressurize a space between the substrate and the second regions in the second quadrant and the fourth quadrant of the plane coordinate system,

wherein the control unit is configured to individually control each of the first depressurization unit to the fourth depressurization unit based on the shape information.

10 . The apparatus according to claim 3 ,

wherein the first depressurization unit is configured to depressurize a space between the substrate and the first region in a first quadrant and a third quadrant of a plane coordinate system in which a center of a surface of the placing portion is set as an origin,

wherein the second depressurization unit is configured to depressurize a space between the substrate and the second regions in the first quadrant and the third quadrant of the plane coordinate system,

the apparatus further comprising:

a third depressurization unit configured to depressurize a space between the substrate and the first region in a second quadrant and a fourth quadrant of the plane coordinate system,

a fourth depressurization unit configured to depressurize a space between the substrate and the second regions in the second quadrant and the fourth quadrant of the plane coordinate system,

wherein the control unit is configured to individually control each of the first depressurization unit to the fourth depressurization unit based on the shape information.

11 . The apparatus according to claim 5 ,

wherein the first depressurization unit is configured to depressurize a space between the substrate and the first region in a first quadrant and a third quadrant of a plane coordinate system in which a center of a surface of the placing portion is set as an origin,

wherein the second depressurization unit is configured to depressurize a space between the substrate and the second regions in the first quadrant and the third quadrant of the plane coordinate system,

the apparatus further comprising:

a third depressurization unit configured to depressurize a space between the substrate and the first region in a second quadrant and a fourth quadrant of the plane coordinate system,

a fourth depressurization unit configured to depressurize a space between the substrate and the second regions in the second quadrant and the fourth quadrant of the plane coordinate system,

wherein the control unit is configured to individually control each of the first depressurization unit to the fourth depressurization unit based on the shape information.

12 . The apparatus according to claim 1 ,

wherein the placing portion further includes third to n-th regions (n is an integer of three or more) that are concentrically divided between the first region and the second regions,

the apparatus further comprising:

third to n-th depressurization units configured to respectively depressurize the space between the substrate and the third to n-th regions,

wherein the control unit is further configured to individually control each of the first to the n-th depressurization units based on the shape information.

13 . The apparatus according to claim 2 ,

wherein the placing portion further includes third to n-th regions (n is an integer of three or more) that are concentrically divided between the first region and the second regions,

the apparatus further comprising:

third to n-th depressurization units configured to respectively depressurize the space between the substrate and the third to n-th regions,

wherein the control unit is further configured to individually control each of the first to the n-th depressurization units based on the shape information.

14 . The apparatus according to claim 3 ,

wherein the placing portion further includes third to n-th regions (n is an integer of three or more) that are concentrically divided between the first region and the second regions,

the apparatus further comprising:

third to n-th depressurization units configured to respectively depressurize the space between the substrate and the third to n-th regions,

wherein the control unit is further configured to individually control each of the first to the n-th depressurization units based on the shape information.

15 . The apparatus according to claim 5 ,

wherein the placing portion further includes third to n-th regions (n is an integer of three or more) that are concentrically divided between the first region and the second regions,

the apparatus further comprising:

third to n-th depressurization units configured to respectively depressurize the space between the substrate and the third to n-th regions,

wherein the control unit is further configured to individually control each of the first to the n-th depressurization units based on the shape information.

16 . The apparatus according to claim 8 ,

wherein the placing portion further includes third to n-th regions (n is an integer of three or more) that are concentrically divided between the first region and the second regions,

the apparatus further comprising:

third to n-th depressurization units configured to respectively depressurize the space between the substrate and the third to n-th regions,

wherein the control unit is further configured to individually control each of the first to the n-th depressurization units based on the shape information.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043063/0178 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2017
From: KOMINE, NOBUHIRO
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 041769/0434 →