Analysis device
An analysis device includes a vapor phase decomposition unit, a heating unit, an evacuation unit, a recovery unit and an analysis unit. The vapor phase decomposition unit performs vapor phase decomposition of a first film on a substrate. The heating unit heats the substrate. The evacuation unit evacuates gas in the heating unit to an outside of the heating unit. The recovery unit supplies liquid on a front surface of the substrate, moves the liquid on the front surface of the substrate, and recovers the liquid. The analysis unit analyzes contents of the liquid.
1. An analysis device comprising:
a vapor phase decomposition chamber configured to perform vapor phase decomposition of a first film on a front surface of a substrate;
a first evacuation pump configured to evacuate gas in the vapor phase decomposition chamber to an outside of the vapor phase decomposition chamber;
a heating chamber configured to heat the substrate;
a second evacuation pump configured to evacuate gas in the heating chamber to an outside of the heating chamber;
a recovery chamber configured to supply liquid on the front surface of the substrate, move the liquid on the front surface of the substrate, and recover the liquid; and
an analyzer configured to analyze a containing metal material in the liquid,
wherein the heating chamber comprising a hot plate being able to heat the substrate performed vapor phase decomposition by the vapor phase decomposition chamber in a state where the substrate is mounted.
2. The device according to claim 1 , further comprising:
a suction pipe configured to adsorb a rear surface of the substrate in an inside of the vapor phase decomposition chamber.
3. The device according to claim 1 , further comprising:
a weight sensor configured to measure a weight of the substrate in the vapor phase decomposition chamber; and
a processor configured to determine an end point of vapor phase decomposition of the first film on the basis of a weight of the substrate.
4. The device according to claim 1 , further comprising:
a reflectance ratio measuring device configured to measure a reflectance ratio of the substrate or the first film by irradiating the substrate or the first film with light from the vapor phase decomposition chamber; and
a processor configured to determine an end point of vapor phase decomposition of the first film on the basis of the reflectance ratio of the substrate or the first film.
5. The device according to claim 1 , further comprising:
a supplier and configured to supply an inert gas to the heating chamber.
6. The device according to claim 5 , wherein the second evacuation pump is further configured to evacuate gas which is thermally decomposed in the substrate together with the inert gas.
7. The device according to claim 5 , wherein a temperature of the inert gas is approximately equal to a temperature of the substrate heated in the heating chamber.
8. The device according to claim 1 , wherein the vapor phase decomposition chamber and the heating chamber are provided in a common chamber.
9. The device according to claim 1 , wherein the vapor phase decomposition unit chamber comprising a first carry-in port from which the substrate is carried in.
10. The device according to claim 1 , wherein the heating chamber comprising a second carry-in port from which the substrate is carried in after the vapor phase decomposition.
11. The device according to claim 1 , wherein the analyzer is a total reflection X-ray fluorescence (TXRF) device.
12. The device according to claim 1 , wherein the analyzer is an inductively coupled plasma-mass spectrometry (ICP-MS) device.
13. The device according to claim 1 , wherein the analyzer is an atomic absorption spectrometry (AAS) device.
14. The device according to claim 1 , wherein the recovery chamber is configured to supply liquid on the front surface of the substrate heated by the heating chamber, move the liquid on the front surface of the substrate, and recover the liquid.
15. The device according to claim 1 , wherein the second evacuation pump is configured to evacuate the gas after the vapor phase decomposition of the first film.