Semiconductor device manufacturing method
A semiconductor device manufacturing method includes forming a first hole in a first processed layer. A first sacrificial film is formed in the first hole. A hole portion is formed in the first sacrificial film. A second sacrificial film is formed in the hole portion. A second processed layer is formed above the first sacrificial film and the second sacrificial film, and a second hole is formed in the second processed layer to expose the second sacrificial film. A third sacrificial film is formed on an inner side surface of the second hole, and a fourth sacrificial film is formed on the third sacrificial film. The second sacrificial film is etched using the fourth sacrificial film as a mask. The third sacrificial film exposed by etching the second sacrificial film is etched. The second processed layer is etched using the third sacrificial film as a mask.
1. A semiconductor device manufacturing method comprising:
forming a first hole in a first processed layer;
forming a first sacrificial film in the first hole;
forming a hole portion in the first sacrificial film;
forming a second sacrificial film in the hole portion;
forming a second processed layer above the first sacrificial film and the second sacrificial film;
forming a second hole in the second processed layer to expose the second sacrificial film;
forming a third sacrificial film on an inner side surface of the second hole;
forming a fourth sacrificial film on the third sacrificial film;
etching the second sacrificial film using the fourth sacrificial film as a mask, and etching the third sacrificial film exposed by etching the second sacrificial film; and
etching the second processed layer using the third sacrificial film as a mask.
2. The semiconductor device manufacturing method according to claim 1 , further comprising:
forming the first processed layer as a stacked body by alternately stacking first films and second films,
wherein forming the first hole includes forming the first hole in a third film formed on the first processed layer when the first hole is formed in the first processed layer.
3. The semiconductor device manufacturing method according to claim 2 , wherein
the first films are formed using silicon oxide, and the second films are formed using silicon nitride.
4. The semiconductor device manufacturing method according to claim 1 ,
wherein a diameter of the hole portion is equal to or smaller than a diameter of a bottom portion of the first hole.
5. The semiconductor device manufacturing method according to claim 1 ,
wherein the second sacrificial film and the third sacrificial film are formed of a same material.
6. The semiconductor device manufacturing method according to claim 5 ,
wherein an organic film is used for each of the second sacrificial film and the third sacrificial film.
7. The semiconductor device manufacturing method according to claim 1 , further comprising:
alternatively repeating the etching of the second sacrificial film and the third sacrificial film and the etching of the second processed layer.
8. The semiconductor device manufacturing method according to claim 1 , wherein
the first sacrificial film is formed using amorphous silicon.
9. The semiconductor device manufacturing method according to claim 1 ,
wherein forming the second processed layer includes forming the second processed layer as a stacked body by alternately stacking first films and second films.
10. The semiconductor device manufacturing method according to claim 9 , wherein the first films are formed using silicon oxide, and the second films are formed using silicon nitride.