Docking controlled adaptive heatsink
Systems and methods are provided for cooling an IHS (Information Handling System) that may be docked in docking station. The IHS includes a docking plate exposed on the outer surface. When docked, the docking plate interfaces with a corresponding conductive element provided by the docking station in order to transfer heat from the IHS to the docking station. Within the IHS, an adaptive heatsink provides passive cooling to a processor of the IHS. When the IHS is docked, a portion of the adaptive heatsink contacts the docking plate and, via the conductive element of the docking station, completes a thermal pathway to auxiliary cooling systems provided by the docking station, thus allowing the IHS to supporting higher operating temperatures. When the IHS is undocked, the adaptive heatsink is separated from the docking plate by an air gap, thus limiting the transfer of heat to the docking plate and maintaining safe surface temperatures.
1. An Information Handling System (IHS), comprising:
a cover enclosing a heatsink disposed over a planar surface of a processor; and
a docking plate fixed to the cover, wherein:
(a) the docking plate is positioned over the heatsink and forms an air gap between the docking plate and the heatsink;
(b) the docking plate approaches the heatsink in a direction perpendicular to the planar surface of the processor, separately from a static portion of the cover surrounding the docking plate, and reduces the air gap, using one or more springs, in response to the IHS being docked into a docking station; and
(c) the docking plate distances itself from the heatsink, independently from the static portion of the cover surrounding the docking plate, and increases the air gap, using the one or more springs, in response to the IHS being undocked from the docking station.
2. The IHS of claim 1 , wherein the docking plate is thermally coupled to a heat conductive surface of the docking station integral to the docking station and inseparable therefrom in response to the IHS being docked into the docking station.
3. The IHS of claim 1 , wherein the heatsink comprises one or more fins disposed in a direction perpendicular to the planar surface of the processor.
4. The IHS of claim 3 , and wherein the air gap surrounds the fins.
5. The IHS of claim 1 , wherein the docking plate includes one or more channels configured to accommodate the one or more fins when in response to the IHS being docked into the docking station.
6. The IHS of claim 1 , wherein movement of the docking plate is spring-loaded with respect to the case, and restricts movement of the docking plate towards the heatsink during a docking operation.
7. The IHS of claim 1 , wherein the docking station comprises a button that, in response to being pressed, allows the IHS to be undocked only after a time period greater than zero.
8. The IHS of claim 7 , wherein the time period is determined, in part, based upon a temperature of the processor at the time of the pressing of the button.