Receiver
Receiver ( 1 ), in particular an implantable receiver ( 1 ) for transmitting energy to an implant, with a multi-layer circuit board comprising a plurality of electrically conductive layers ( 11 - 16 ), wherein the circuit board comprises an outer coil area and a multi-layer inner area enclosed by the coil area, a coil which is integrally incorporated at least partially in the layers ( 11 - 16 ) of the circuit board in the coil area, wherein the number of the layers ( 11 - 16 ) of the circuit board is smaller within this inner area than in the coil area.
1. An implantable receiver for transmitting energy to an implant, with
a multi-layer circuit board comprising a plurality of electrically conductive layers,
wherein the circuit board comprises an outer coil area and a multi-layer inner area enclosed by the coil area, wherein the plurality of electrically conductive layers in the multi-layer inner area define the multi-layer circuit board in the inner area,
a coil which is integrally incorporated at least partially in the layers of the circuit board in the coil area,
wherein the number of the layers of the circuit board is smaller within this inner area than in the coil area, wherein the coil area, on an upper side of the circuit board, forms an upper rim around the inner area, and wherein electronic components are arranged on the upper side of the circuit board in the inner area, and wherein the coil area forms a lower rim on an underside of the circuit board, which lower rim on the underside encircles a lower cavity in the inner area.
2. The receiver according to claim 1 , wherein the inner area comprises at most half as many layers as the coil area.
3. The receiver according to claim 1 , wherein the circuit board is formed in one piece.
4. The receiver according to claim 1 , with a feedback device which works without radio waves and which is designed to generate feedback concerning an operating state of an implant attached to the receiver.
5. The receiver according to claim 1 , wherein the cavity or the cavities are filled and/or the receiver is encapsulated with a biocompatible material.
6. The receiver according to claim 1 , wherein the circuit board comprises a multi-layer base membrane which extends across both the inner area and the coil area, wherein layers of the base membrane define the plurality of electrically conductive layers in the inner area and a portion of the plurality of electrically conductive layers in the coil area.
7. An implantable system with an electromechanical implant and an implantable receiver for transmitting energy to the implant, with
a multi-layer circuit board comprising a plurality of electrically conductive layers,
wherein the circuit board comprises an outer coil area and a multi-layer inner area enclosed by the coil area, wherein the plurality of electrically conductive layers in the multi-layer inner area define the multi-layer circuit board in the inner area,
a coil which is integrally integrated at least partially in the layers of the circuit board in the coil area,
wherein the number of the layers of the circuit board is smaller within this inner area than in the coil area, wherein the coil area, on an upper side of the circuit board, forms an upper rim around the inner area, and wherein electronic components are arranged on the upper side of the circuit board in the inner area, and wherein the coil area forms a lower rim on an underside of the circuit board, which lower rim on the underside encircles a lower cavity in the inner area.
8. A method for producing an implantable receiver for transmitting energy to an implant and comprising a circuit board, by:
producing a multi-layer base membrane of the circuit board with a plurality of layers;
building up further layers on an upper side and an underside of the base membrane;
wherein turns of a coil are integrated at least in some of the further layers in a coil area;
creating an upper cavity and a lower cavity in the inner area to the inside of the coil area, by removing the further layers in the inner area; and
populating the inner area with electronic components.
9. The method according to claim 8 , wherein the inner area of the base membrane is covered, on at least one of upper side and underside, by a protective layer during the building up of the further layers.
10. The method according to claim 8 , further comprising:
the populating step comprises populating the inner area with electronic components on the upper side, and
filling the upper cavity with a resin-catalyst mix.
11. The method according to claim 8 , further comprising:
encapsulating the receiver with a biocompatible material.