IP Library Granted Patent US 10,337,899
Granted Patent B2
US 10,337,899 · App. 15/451,572 · Granted Jul 2, 2019

Thermal flow meter with thin resin portion sealing temperature detection element

Inventors: Noboru Tokuyasu (Hitachinaka, JP); Shinobu Tashiro (Hitachinaka, JP); Keiji Hanzawa (Hitachinaka, JP); Tsutomu Kono (Tokyo, JP)
Assignee: Hitachi Automotive Systems, Ltd.
G01F1/696F02D41/18F02M35/1038F02M35/10386G01F1/684G01F1/6842G01F1/6845G01F1/698G01F1/699G01F1/6965G01F5/00G01F15/006G01F15/02G01F15/04G01F15/043G01F15/14G01F15/185
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,337,899
App. No.
15/451,572
Granted
Jul 2, 2019
Kind
B2
Abstract

To obtain a thermal flow meter capable of providing thermal insulation without degrading responsiveness of a temperature detection element. A thermal flow meter 300 of the present invention includes an air flow sensing portion 602 that detects a flow rate by performing heat transfer with a measurement target gas passing through the main passage 124 using a heat transfer surface, a temperature detection element 518 that detects a temperature of the measurement target gas, a circuit package 400 obtained by connecting a processing unit 604 that processes signals of the air flow sensing portion 602 and the temperature detection element 518 to a lead and sealing the processing unit 604 using a first molding resin through a first molding process, and a housing 302 where the circuit package 400 is fixed using a second molding resin through a second molding process, wherein, in the circuit package 400 , a thickness of a temperature detecting portion 452 for sealing the temperature detection element 518 is thinner than that of a package body portion 426 for sealing the processing unit 604.

Claims (32)

1. A thermal flow meter comprising:

a circuit package including a temperature detection element that detects a temperature of a measurement target gas and a processing unit that processes a signal of the temperature detection element, wherein the temperature detection element and the processing unit are entirely sealed with a single molding resin, and

wherein a thickness of a portion of the single molding resin sealing the temperature detection element is thinner than that of a portion of the single molding resin sealing the processing unit.

2. The thermal flow meter according to claim 1 ,

wherein the circuit package has a package body portion sealing the processing unit and a protrusion sealing the temperature detection element.

3. The thermal flow meter according to claim 2 ,

wherein the protrusion comprises a first lead, a second lead and a connection line connects the first lead and the second lead electrically, the first lead on which mounts the temperature detection element,

wherein the diameter of the connection line is smaller than the first lead and the second lead.

4. The thermal flow meter according to claim 1 ,

wherein the circuit package further comprising an air flow sensing portion that detects a flow rate of the measurement target gas, and

wherein the processing unit processes the signal from the air flow sensing portion.

5. The thermal flow meter according to claim 4 ,

wherein the molding resin seals the air flow sensing portion so that a part of the air flow sensing portion is exposed.

6. A thermal flow meter comprising:

a circuit package including a temperature detection element and a processing unit that processes a signal of the temperature detection element, wherein the temperature detection element and the processing unit are entirely sealed with a single molding resin, and

wherein the single molding portion sealing the circuit package comprises a stepped portion between a portion for sealing the temperature detection element and a portion for sealing the processing unit.

7. The thermal flow meter according to claim 6 ,

wherein the circuit package has a package body portion sealing the processing unit and a protrusion sealing the temperature detection element.

8. The thermal flow meter according to claim 7 ,

wherein the protrusion comprises a first lead, a second lead and a connection line connects the first lead and the second lead electrically, the first lead on which mounts the temperature detection element,

wherein the diameter of the connection line is smaller than the first lead and the second lead.

9. The thermal flow meter according to claim 6 ,

wherein the circuit package has a package body portion sealing the processing unit and a protrusion sealing the temperature detection element,

wherein the stepped portion is formed on the protrusion.

10. The thermal flow meter according to claim 9 ,

wherein the protrusion comprises a first lead, a second lead and a connection line connects the first lead and the second lead electrically, the first lead on which mounts the temperature detection element,

wherein the stepped portion is formed closer to the temperature detection element than the connection line.

11. The thermal flow meter according to claim 6 ,

wherein the circuit package further comprising an air flow sensing portion that detects a flow rate of the measurement target gas, and

wherein the processing unit processes the signal from the air flow sensing portion.

12. The thermal flow meter according to claim 11 ,

wherein the molding resin seals the air flow sensing portion so that a part of the air flow sensing portion is exposed.

Assignments (1)
CHANGE OF NAME Recorded Mar 25, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 056299/0447 →
Priority Claims (1)
JP 2012-136394 · Jun 15, 2012 · national
Continuity (2)
Continuation 14406596
Related Publication 20170176230A1 · Jun 22, 2017