Electronic device provided with a thermal dissipation member

1. A device, comprising:

a support;

an integrated circuit chip having a rear face mounted above a front face of the support and a front face opposite its rear face;

a block for at least partial encapsulation of the integrated circuit chip above the front face of the support; and

at least one thermal dissipation member comprising a flexible sheet having a plurality of successive portions, in which two successive portions are joined by a fold and at least partly face one another;

wherein a first portion of the flexible sheet is fixed to the front face of the integrated circuit chip and a second portion of the flexible sheet is adhesively bonded onto the front face of the support.

2. The device according to claim 1 , wherein successive portions are spaced apart from each other.

3. The device according to claim 1 , wherein more than the two successive portions are joined by respective folds.

4. The device according to claim 1 , wherein the first portion extends at least partly above the front face of the integrated circuit chip.

5. The device according to claim 4 , wherein the fold and a second fold are disposed at a periphery of the integrated circuit chip.

6. The device according to claim 1 , wherein the flexible sheet is at least partly embedded in the block.

7. The device according to claim 1 , wherein the flexible sheet has perforations defined therein.

8. The device according to claim 1 , wherein the flexible sheet is constructed at least partially from copper.

9. The device according to claim 1 , wherein the flexible sheet is constructed at least partially from graphite.

10. The device according to claim 1 , wherein the support is mounted on a printed circuit board by electrical connection elements.

11. An electronic device, comprising:

a heat producing component;

a thermal dissipation structure associated with the heat producing component to radiate heat away therefrom, the thermal dissipation structure comprising:

a main portion in direct physical contact with the heat producing component;

first and second secondary portions not in direct physical contact with the heat producing component, each first and second secondary portions forming a loop;

wherein a distal end of the first secondary portion is in direct physical contact with the main portion and a distal end of the second secondary portion is in direct physical contact with the main portion; and

wherein the first secondary portion extends from the loop of the first secondary portion downwardly toward the main portion at a first non-perpendicular angle and the second secondary portion extends from the loop of the second secondary portion downwardly to the main portion at a second non-perpendicular angle.

12. The electronic device of claim 11 , wherein first and second gaps are defined between the first and second secondary portions and the main portion.

13. The electronic device of claim 11 , wherein the second non-perpendicular angle is equal to the first non-perpendicular angle.

14. The electronic device of claim 11 , wherein the first and second secondary portions are equal in length.

15. The electronic device of claim 11 , wherein a length of the main portion is at most equal to a length of an encapsulation block that encapsulates the heat producing component.

16. The electronic device of claim 11 , wherein perforations are defined in the first and second secondary portions.

17. The electronic device of claim 11 , wherein the main portion is generally rectangular in shape.

18. The electronic device of claim 11 , wherein the first and second secondary portions are generally rectangular in shape.

19. The electronic device of claim 11 , wherein the main portion covers substantially an entire top surface of the heat producing component.

20. An electronic device, comprising:

a support wafer;

a heat producing component supported by the support wafer;

a thermal dissipation structure associated with the heat producing component to radiate heat away therefrom, the thermal dissipation structure comprising:

a main portion in direct physical contact with the heat producing component;

first and second secondary portions not in direct physical contact with the heat producing component; and

wherein the first and second secondary portions extend downwardly from the main portion to the support wafer and are accordion pleated in shape.

21. The electronic device of claim 20 , wherein the first and second secondary portions are equal in length.

22. The electronic device of claim 20 , wherein perforations are defined in the first and second secondary portions.

23. The electronic device of claim 20 , wherein the main portion is generally rectangular in shape.

24. The electronic device of claim 20 , wherein the main portion covers substantially an entire top surface of the heat producing component.

25. A device, comprising:

a support;

an integrated circuit chip having a rear face mounted above a front face of the support and a front face opposite its rear face;

a block for at least partial encapsulation of the integrated circuit chip above the front face of the support; and

at least one thermal dissipation member comprising a flexible sheet having a plurality of successive portions, in which two successive portions are joined by a fold and at least partly face one another, wherein the flexible sheet is constructed at least partially from graphite; and

wherein a first portion of the flexible sheet is fixed to the front face of the integrated circuit chip and a second portion of the flexible sheet is fixed onto either the first portion or the front face of the support.

26. The electronic device of claim 11 , wherein the heat producing component is an integrated circuit chip and the loop of the first secondary portion and the loop of the second secondary portion are disposed at a periphery of the integrated circuit chip.