Imaging systems with through-oxide via connections
View Patent ↗An imaging system may include an image sensor package with through-oxide via connections between the image sensor die and the digital signal processing die in the image sensor package. The image sensor die and the digital signal processing die may be attached to each other. The through-oxide via may connect a bond pad on the image sensor die with metal routing paths in the image sensor and digital signal processing dies. The through-oxide via may simultaneously couple the image sensor die to the digital signal processing die. The through-oxide via may be formed through a shallow trench isolation structure in the image sensor die. The through-oxide via may be formed through selective etching of the image sensor and digital signal processing dies.
1. An image sensor package comprising:
an image sensor die having first and second opposing surfaces;
a metal structure on the first surface of the image sensor die;
a signal processing die bonded to the second surface of the image sensor die; and
a through-oxide via that extends through the image sensor die and into the signal processing die, wherein the through-oxide via electrically connects the signal processing die to the metal structure.
2. The image sensor package defined in claim 1 , wherein the metal structure is a bond pad, and wherein the image sensor die comprises pixel circuitry electrically connected to the bond pad.
3. The image sensor package defined in claim 2 , wherein the signal processing die comprises metal interconnects that are electrically connected to the bond pad by the through-oxide via.
4. The image sensor package defined in claim 1 , wherein the image sensor die comprises a silicon substrate, and wherein the through-oxide via extends through the silicon substrate.
5. The image sensor package defined in claim 4 , wherein the silicon substrate includes a hole that is at least partially filled with oxide material, and wherein the through-oxide via extends through the oxide material.
6. The image sensor package defined in claim 1 , wherein the image sensor die comprises a shallow trench isolation structure, and wherein the through-oxide via extends through the shallow trench isolation structure.
7. A system, comprising:
a central processing unit;
memory;
input-output circuitry; and
an imaging device, wherein the imaging device comprises:
a first integrated circuit die, wherein the first integrated circuit die comprises an image sensor integrated circuit die and wherein the image sensor integrated circuit die comprises:
a silicon substrate having an opening; and
an oxide layer that overlaps the silicon substrate and at least partially fills the opening;
a second integrated circuit die bonded to the first integrated circuit die, wherein the second integrated circuit die comprises a signal processing integrated circuit die; and
a through-oxide via that extends through the first integrated circuit die and into the second integrated circuit die to electrically connect the first integrated circuit die to the second integrated circuit die.
8. The system defined in claim 7 , wherein the through-oxide via extends through the opening in the silicon substrate and through the oxide layer that at least partially fills the opening.
9. The system defined in claim 8 , wherein the image sensor integrated circuit die comprises a first metal interconnect and the signal processing integrated circuit die comprises a second metal interconnect, the imaging device further comprising:
a bond pad on the image sensor integrated circuit die, wherein the through-oxide via electrically connects the bond pad, the first metal interconnect, and the second metal interconnect.
10. A system, comprising:
a first integrated circuit die that includes a first interconnect layer;
a second integrated circuit die that is attached to the first integrated circuit die and that includes a second interconnect layer;
a metal structure on the first integrated circuit die; and
a through-oxide via that extends into the first integrated circuit die and into the second integrated circuit die, that connects to the metal structure, and that connects the first interconnect layer of the first integrated circuit die to the second interconnect layer of the second integrated circuit die.
11. The system defined in claim 10 , wherein the metal structure comprises a bond pad and wherein the through-oxide via has a first end that is connected to the bond pad and a second end that is connected to the second interconnect layer of the second integrated circuit die.
12. The system defined in claim 10 , wherein the first integrated circuit die includes a shallow trench isolation structure, and wherein the through-oxide via is formed through the shallow trench isolation structure.
13. The system defined in claim 10 , wherein the first integrated circuit die comprises an image sensor integrated circuit, and wherein the second integrated circuit die comprises a digital signal processing integrated circuit.
14. The system defined in claim 10 , wherein the first interconnect layer of the first integrated circuit die is interposed between a substrate of the first integrated circuit die and the second interconnect layer of the second integrated circuit die.