Moisture-curable silylated resin derived from polycarbonate diol and coating, sealant and adhesive compositions containing same
A moisture-curable silylated resin is derived from a copolycarbonate diol prepared from diol(s) of specific types.
1. A moisture-curable silylated resin of the general formula (I):
wherein:
G is a moiety of general structure (II):
each R 1 is independently an alkyl group of from 1 to 6 carbon atoms;
each R 2 is independently an alkyl group of from 1 to 4 carbon atoms or phenyl group;
each R 3 is independently an alkylene group of from 1 to 12 carbon atoms;
each R 4 is independently an alkyl group of from 1 to 6 carbon atoms, phenyl group, hydrogen or —R 3 SiR 2 3-a (OR 1 ) a group;
each R 5 is independently a divalent organic group selected from the group consisting of an alkylene group having 1 to 16 carbon atoms, a cycloalkylene group having 5 to 16 carbon atoms and the group X 1 having the general formula (III):
wherein each R 6 is independently an alkylene group of from 1 to 12 carbon atoms or a cycloalkylene group of from 5 to 16 carbon atoms;
each R 7 is an alkylene group of from 2 to 12 carbon atoms;
each R 8 is an alkylene group of from 2 to 12 carbon atoms;
each R 9 is independently selected from the group consisting of R 7 and R 8 ;
each R 10 is independently a divalent organic group selected from the group consisting of an alkylene group of from 1 to 12 carbon atoms, a cycloalkylene group of from 5 to 16 carbon atoms, X 1 and the group X 2 having the general formula (IV):
and,
subscripts a, b, c, m and n are integers wherein a is 1 to 3; b is 0 or 1; c is 0 to 5; m is 1 to 100; and, n is 0 to 100, with the provisos that when b is 0, R 4 is hydrogen; when n is 0,R 7 is a branched alkylene group of from 3 to 12 carbon atoms; and, when n is 1 to 100, R 7 and R 8 are different straight chain alkylene groups in which R 7 is at least one straight chain alkylene group possessing an even number of carbon atoms and R 8 is at least one straight chain alkylene group possessing an odd number of carbon atoms.
2. The moisture-curable silylated resin of claim 1 wherein R 1 is methyl or ethyl; R 3 is methylene, ethylene, propylene, 2-methylethylene or 2-methylpropylene; R 4 is methyl, ethyl or butyl; R 5 is divalent alkylene group of from 1 to 6 carbon atoms or a cycloalkylene group of from 6 to 10 carbon atoms; R 7 is 1,4-butylene, 1,6-hexylene or 1,8-octylene; R 8 is 1,5-pentylene, 1,7-heptylene or 1,9-nonylene; R l0 is
wherein G is has the formula (II); a is 2 or 3, b is 1, c is 0, 1 or 2; m is 5 to 15; and n is 5 to 15.
3. The moisture-curable silylated resin of claim 1 , wherein R 1 is methyl or ethyl; R 3 is methylene, ethylene, propylene, 2-methylethylene or 2-methylpropylene; R 4 is methyl, ethyl or butyl; R 5 is divalent alkylene group of from 1 to 6 carbon atoms or a cycloalkylene group of from 6 to 10 carbon atoms; R 7 is 1,4-butylene, 1,6-hexylene or 1,8-octylene; R 8 is 1,5-pentylene, 1,7-heptylene or 1,9-nonylene; R l0 is a divalent alkylene group of from 1 to 6 carbon atoms or a cycloalkylene group of from 6 to 10 carbon atoms; a is 2 or 3, b is 1, c is 0, 1 or 2; m is 5 to 15; and n is 5 to 15.
4. The moisture-curable silylated resin of claim 1 , wherein R 1 is methyl or ethyl; R 3 is methylene, ethylene, propylene, 2-methylethylene or 2-methylpropylene; —R 4 is hydrogen; R 5 is divalent alkylene group of from 1 to 6 carbon atoms or a cycloalkylene group of from 6 to 10 carbon atoms; R 7 is 1,4-butylene, 1,6-hexylene or 1,8-octylene; R 8 is 1,5-pentylene, 1,7-heptylene or 1,9-nonylene; R 10 is a divalent alkylene group of from 1 to 6 carbon atoms or a cycloalkylene group of from 6 to 10 carbon atoms; a is 2 or 3, b is 0, c is 0, 1 or 2; m is 5 to 15; and n is 5 to 15.
5. The moisture-curable silylated resin of claim 1 , wherein R 1 is methyl or ethyl; R 3 is methylene, ethylene, propylene, 2-methylethylene or 2-methylpropylene; R 4 is hydrogen; R 5 is divalent alkylene group of from 1 to 6 carbon atoms or a cycloalkylene group of from 6 to 10 carbon atoms; R 7 is 1,4-butylene, 1,6-hexylene or 1,8-octylene; R 8 is 1,5-pentylene, 1,7-heptylene or 1,9-nonylene; R 10 is
wherein a is 2 or 3, b is 0, c is 0, 1 or 2; m is 5 to 15; n is 5 to 15.
6. A composition comprising a mixture of moisture-curable silylated resins of claim 1 , wherein the mixture is (i) at least one moisture-curable silylated resin of formula (I), wherein R 10 is a
and
(ii) at least one moisture-curable silylated resin of formula (I), wherein R 10 is a divalent alkylene group of from 1 to 6 carbon atoms or a cycloalkylene group of from 6 to 10 carbon atoms.
7. The composition of claim 6 , wherein the molar ratio of (i) to (ii) is from 0.3:1.5 to 1.5:0.3.
8. The moisture-curable silylated resin of claim 1 possessing at least one of a number average molecular weight as measured by ASTM D5296-11, Standard Test Method for Molecular Weight Averages and Molecular Weight Distribution of Polystyrene by High Performance Size-Exclusion Chromatography of from 800 to 20,000, a crystalline content as measured by ASTM F2625-0, Standard Test Method for Measurement of Enthalpy of Fusion, Percent Crystallinity, and Melting Point of Ultra-High-Molecular Weight Polyethylene by Means of Differential Scanning calorimetry of not greater than 10 weight percent crystallinity, based on the total weight of the moisture-curable silylated resin (I), or a viscosity as measured by ASTM D1084-08, Standard Test Method for Viscosity of Adhesives, of not greater than 100 Pascal·second.
9. The moisture-curable silylated resin of claim 8 possessing at least one of a number average molecular weight of from 1500 to 10,000, a crystalline content as measured by differential scanning colorimetry of not greater than 1 weight percent crystallinity, based on the total weight of the moisture-curable silylated resin (I), or a viscosity 0.05 to 50 Pascal·second.
10. A substantially water-free composition comprising the moisture-curable silylated resin of claim 1 and at least one additional component selected from the group consisting of organoalkoxysilanes, silicone hardcoats, metal particulates, metal oxide particulates, pigments, curing catalysts, leveling agents, antioxidants, UV stabilizers, dyes, fillers, adhesion promoters and solvents.
11. The substantially water-free composition of claim 10 , wherein the composition is a sealant, adhesive or coating.
12. A ceramic, polymeric or metallic substrate having thereon the moisture-cured silylated resin of claim 1 .
13. The substrate of claim 12 wherein the moisture-cured silylated resin is in direct contact with the surface of the substrate.