Semiconductor storage device
According to one embodiment, a semiconductor storage device includes: a NAND string with a first set of memory cells including a first memory cell; and a second set of memory cells including a second memory cell disposed above the first memory cell. The number of memory cells included in the first set is different from that of memory cells included in the second set. During a program verify operation when a data item of a level is written to a memory cell of the first set and a memory cell of the second set, a first verify voltage is applied to the gate of the memory cell of the first set and a second verify voltage different from the first verify voltage is applied to the gate of the memory cell of the second set.
1. A semiconductor storage device comprising:
a NAND string including
a first set of memory cell transistors including a first memory cell transistor, and
a second set of memory cell transistors including a second memory cell transistor disposed above the first memory cell transistor,
wherein a number of memory cell transistors included in the first set is different from a number of memory cell transistors included in the second set, and
during a program verify operation when a data item of a level is written to a memory cell transistor of the first set and a memory cell transistor of the second set, a first verify voltage is applied to a gate of the memory cell transistor of the first set, and a second verify voltage different from the first verify voltage is applied to a gate of the memory cell transistor of the second set.
2. The device of claim 1 , wherein
the NAND string further includes a third set of memory cell transistors including a third memory cell transistor disposed above the second memory cell transistor,
a number of memory cell transistors included in the third set is different from the number of memory cell transistors included in the second set, and
during another program verify operation when the data item of the level is written to the memory cell transistor of the second set and a memory cell transistor of the third set, a third verify voltage different from the second verify voltage is applied to a gate of the memory cell transistor of the third set.
3. The device of claim 1 , wherein
the NAND string further includes a backgate transistor disposed below the first memory cell transistor,
the first set further includes a fourth memory cell transistor disposed in a same layer as that of the first memory cell transistor above the backgate transistor, and
the second set further includes a fifth memory cell transistor disposed in a same layer as that of the second memory cell transistor above the fourth memory cell transistor.
4. The device of claim 3 , wherein
the NAND string further includes a third set including a third memory cell transistor disposed above the second memory cell transistor, and a sixth memory cell transistor disposed in a same layer as that of the third memory cell transistor above the fifth memory cell transistor,
a number of memory cell transistors included in the third set is different from the number of memory cell transistors included in the second set, and
during another program verify operation when the data item of the level is written to the memory cell transistor of the second set and a memory cell transistor of the third set, a third verify voltage different from the second verify voltage is applied to a gate of the memory cell transistor of the third set.
5. The device of claim 1 , wherein the NAND string includes a bow shape.
6. The device of claim 1 , wherein the NAND string includes a tapered shape.
7. The device of claim 1 , wherein a memory hole diameter of the memory cell transistor included in the first set is smaller than a memory hole diameter of the memory cell transistor included in the second set.
8. The device of claim 7 , wherein the first verify voltage is higher than the second verify voltage.
9. The device of claim 7 , wherein the first verify voltage is lower than the second verify voltage.
10. The device of claim 1 , wherein a memory hole diameter of the memory cell transistor included in the first set is larger than a memory hole diameter of the memory cell transistor included in the second set.
11. The device of claim 10 , wherein the first verify voltage is higher than the second verify voltage.
12. The device of claim 10 , wherein the first verify voltage is lower than the second verify voltage.