Sensor device having inductors, analog and logic circuits for detecting power flowing through a powerline
A sensor device includes a power line and a semiconductor device. The semiconductor device includes an inductor. The inductor is formed using an interconnect layer (to be described later using FIG. 3 ). The power line and the semiconductor device overlap each other when viewed from a direction perpendicular to the semiconductor device. The semiconductor device includes two inductors. The power line extends between the two inductors when viewed from a direction perpendicular to the semiconductor device.
1. A sensor device comprising:
a first inductor;
a second inductor;
a first logic circuit;
a second logic circuit;
a first analog circuit; and
a second analog circuit,
wherein, in a plan view, the first inductor and the second inductor are arranged side by side in a first direction,
wherein, in the plan view, the first logic circuit and the second logic circuit are respectively inside a region surrounded by the first inductor and inside a region surrounded by the second inductor,
wherein, in the plan view, the first analog circuit and the second analog circuit are arranged side by side in a second direction perpendicular to the first direction, and face one another across a region between the first inductor and the second inductor.
2. The sensor device according to claim 1 , comprising:
a semiconductor chip comprising a main surface, a first side, a second side opposite to the first side, a third side between the first side and the second side, and a fourth side opposite to the third side,
wherein the first inductor, the second inductor, the first logic circuit, the second logic circuit, the first analog circuit, and the second analog circuit are over the main surface of the semiconductor chip,
wherein the first inductor and the first analog circuit are aligned along the first side,
wherein the second inductor and the second analog circuit are aligned along the second side,
wherein the first inductor and the second analog circuit are aligned along the third side, and
wherein the second inductor and the first analog circuit are aligned along the fourth side.
3. A sensor device comprising:
a first inductor;
a second inductor;
a first logic circuit;
a second logic circuit; and
an analog circuit,
wherein, in a plan view, the first inductor and the second inductor are arranged side by side,
wherein, in the plan view, the first logic circuit and the second logic circuit are respectively inside a region surrounded by the first inductor and inside a region surrounded by the second inductor, and
wherein, in the plan view, the analog circuit is between the first inductor and the second inductor.
4. The sensor device according to claim 3 , comprising:
a semiconductor chip comprising a main surface, a first side, a second side opposite to the first side, a third side between the first side and the second side, and a fourth side opposite to the third side,
wherein the first inductor, the second inductor, the first logic circuit, the second logic circuit and the analog circuit are over the main surface of the semiconductor chip,
wherein the first inductor is closer to the first side than the second inductor,
wherein the second inductor is closer to the second side than the first inductor, and
wherein the first inductor, the analog circuit, and the second inductor are aligned along the third side and the fourth side.
5. A sensor device comprising:
a first inductor;
a second inductor;
a first logic circuit;
a second logic circuit;
a first analog circuit; and
a second analog circuit,
wherein, in a plan view, the first inductor and the second inductor are arranged side by side,
wherein, in the plan view, the first logic circuit and the second logic circuit are respectively inside a region surrounded by the first inductor and inside a region surrounded by the second inductor,
wherein, in the plan view, the first analog circuit and the second analog circuit are respectively inside a region surrounded by the first inductor and inside a region surrounded by the second inductor,
wherein, in the plan view, the first logic circuit is closer to the second inductor than the first analog circuit, and
wherein, in the plan view, the second logic circuit is closer to the first inductor than the second analog circuit.
6. The sensor device according to claim 5 , comprising:
a first semiconductor chip comprising a first main surface, a first side, a second side opposite to the first side, a third side between the first side and the second side, and a fourth side opposite to the third side; and
a second semiconductor chip comprising a second main surface, a fifth side, a sixth side opposite to the fifth side, a seventh side between the fifth side and the sixth side, and an eighth side opposite to the seventh side,
wherein the first inductor, the first logic circuit, and the first analog circuit are over the first main surface of the first semiconductor chip,
wherein the second inductor, the second logic circuit, and the second analog circuit are over the second main surface of the second semiconductor chip,
wherein, in the plan view, the first semiconductor chip and the second semiconductor chip are arranged side by side such that the first side and the fifth side face one another,
wherein, in the plan view, the first logic circuit is closer to the first side than the first analog circuit, and
wherein, in the plan view, the second logic circuit is closer to the fifth side than the second analog circuit.