Thermal interface

1. An optoelectronic module comprising:

a shell including a seat;

an optical subassembly including a header having a plurality of leads;

a thermal interface comprising:

a thermally conductive cap including:

a base defining a plurality of cap openings, the base having a substantially circular shape;

a plurality of fingers extending from the base; and

an extension extending from an edge of the base, the extension including a curved shape substantially corresponding to a circumferential portion of the base, the extension having a length greater than a length of the plurality of fingers;

a gasket defining a plurality of gasket openings smaller than the cap openings, the gasket located on the base of the cap such that the gasket openings are positioned over the cap openings, wherein the cap is positioned on the header of the optical subassembly such that the leads are located within the cap openings and the gasket openings, and the extension of the cap is positioned within the seat of the shell;

an adhesive located between the gasket and the base of the cap; and

a pad located between the seat of the shell and the extension of the cap, the pad including a pliant thermal interface material.

2. The optoelectronic module of claim 1 , wherein the optical subassembly includes a transmitter optical subassembly.

3. The optoelectronic module of claim 1 , wherein the cap includes copper.

4. The optoelectronic module of claim 1 , wherein the cap is positioned at an end face of the header of the optical subassembly.

5. The optoelectronic module of claim 1 , wherein the plurality of fingers are located at a side of the header of the optical subassembly.

6. The optoelectronic module of claim 1 , wherein the extension is located at a side of the header of the optical subassembly.

7. The optoelectronic module of claim 1 , wherein the cap is positioned at an end face of the header of the optical subassembly and the plurality of fingers are located at a side of the header of the optical subassembly.

8. The optoelectronic module of claim 1 , wherein the cap is positioned at an end face of the header of the optical subassembly and the extension is located at a side of the header of the optical subassembly.

9. The optoelectronic module of claim 1 , wherein the plurality of fingers and the extension are located at a side of the header of the optical subassembly.

10. The optoelectronic module of claim 1 , wherein the cap is positioned at an end face of the header of the optical subassembly and the plurality of fingers and the extension are located at a side of the header of the optical subassembly.

11. The optoelectronic module of claim 1 , wherein the gasket openings are approximately centered relative to the cap openings.

12. The optoelectronic module of claim 1 , wherein the pad is at least partially compressed between the seat of the shell and the extension of the cap.

13. The optoelectronic module of claim 1 , wherein the pad comprises multiple portions.

14. The optoelectronic module of claim 1 , wherein the plurality of fingers has a length approximately equal to a length of the header of the optical subassembly.

15. The optoelectronic module of claim 1 , wherein the optical subassembly includes a high power transistor outline-can based optical subassembly.

16. The optoelectronic module of claim 1 , wherein the adhesive includes an adhesive tape.

17. The optoelectronic module of claim 1 , wherein the adhesive includes an epoxy.

18. The optoelectronic module of claim 1 , wherein the plurality of fingers is soldered to the header of the optical subassembly.

19. The optoelectronic module of claim 1 , wherein the extension is soldered to the header of the optical subassembly.