SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Provided is a semiconductor device including a second conductivity type low-concentration diffusion layer ( 101 ) for an electric field relaxation reaching a lower portion of a gate oxide film so as to cover a drain diffusion layer ( 107 ), in which a second conductivity type medium-concentration diffusion layer ( 102 ) is formed within the second conductivity type low-concentration diffusion layer ( 101 ) for the electric field relaxation, and a second conductivity type high-concentration diffusion layer ( 103 ), which has a high concentration and small variation in structure due to suppression of heat treatment as much as possible, is formed within the second conductivity type medium-concentration diffusion layer ( 102 ).
1 . A semiconductor device, comprising:
a first conductivity type semiconductor substrate;
a gate electrode formed on the semiconductor substrate through intermediation of a gate oxide film;
a second conductivity type source diffusion layer and a second conductivity type drain diffusion layer formed on respective sides of the gate electrode on the semiconductor substrate;
a second conductivity type low-concentration diffusion layer for an electric field relaxation formed to reach a lower portion of the gate oxide film so as to cover the second conductivity type drain diffusion layer;
a second conductivity type medium-concentration diffusion layer formed within the second conductivity type low-concentration diffusion layer for the electric field relaxation; and
a second conductivity type high-concentration diffusion layer formed within the second conductivity type medium-concentration diffusion layer.
2 . A semiconductor device according to claim 1 , wherein the second conductivity type high-concentration diffusion region comprises a diffusion region having a high concentration and small variation as compared to the second conductivity type low-concentration diffusion region and the second conductivity type medium-concentration diffusion region.
3 . A semiconductor device according to claim 1 , further comprising:
a second second-conductivity-type low-concentration diffusion layer for the electric field relaxation formed to reach the lower portion of the gate oxide film so as to cover the second conductivity type source diffusion layer;
a second second-conductivity-type medium-concentration diffusion layer formed within the second second-conductivity-type low-concentration diffusion layer for the electric field relaxation; and
a second second-conductivity-type high-concentration diffusion layer formed within the second second-conductivity-type medium-concentration diffusion layer.
4 . A semiconductor device, comprising:
a first conductivity type semiconductor substrate;
a gate electrode formed on the semiconductor substrate through intermediation of a gate oxide film;
a second conductivity type source diffusion layer and a second conductivity type drain diffusion layer formed on respective sides of the gate electrode on the semiconductor substrate, the second conductivity type drain diffusion layer being formed through intermediation of a LOCOS oxide film;
a second conductivity type low-concentration diffusion layer for an electric field relaxation so as to be held in contact with the second conductivity type drain diffusion layer and reach a lower portion of the gate oxide film;
a second conductivity type medium-concentration diffusion layer formed so as to cover the second conductivity type drain diffusion layer from a portion between the second conductivity type drain diffusion layer and a channel; and
a second conductivity type high-concentration diffusion layer formed within the second conductivity type medium-concentration diffusion layer.
5 . A semiconductor device according to claim 4 , wherein the second conductivity type low-concentration diffusion layer for the electric field relaxation is formed only under the LOCOS oxide film.
6 . A method of manufacturing a semiconductor device,
the semiconductor device comprising:
a first conductivity type semiconductor substrate;
a gate electrode formed on the semiconductor substrate through intermediation of a gate oxide film;
a second conductivity type source diffusion layer and a second conductivity type drain diffusion layer formed on respective sides of the gate electrode on the semiconductor substrate;
a second conductivity type low-concentration diffusion layer for an electric field relaxation formed to reach a lower portion of the gate oxide film so as to cover the second conductivity type drain diffusion layer;
a second conductivity type medium-concentration diffusion layer formed within the second conductivity type low-concentration diffusion layer for the electric field relaxation; and
a second conductivity type high-concentration diffusion layer formed within the second conductivity type medium-concentration diffusion layer,
the method comprising:
forming the second conductivity type low-concentration diffusion layer and the second conductivity type medium-concentration diffusion layer; and
forming the second conductivity type high-concentration diffusion layer,
the step of forming the second conductivity type high-concentration diffusion layer being performed after the step of forming the second conductivity type low-concentration diffusion layer and the second conductivity type medium-concentration diffusion layer.