IP Library Granted Patent US 10,683,706
Granted Patent B2
US 10,683,706 · App. 15/460,419 · Granted Jun 16, 2020

Polycrystalline diamond bodies having annular regions with differing characteristics

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Quick Facts
Patent No.
US 10,683,706
App. No.
15/460,419
Granted
Jun 16, 2020
Kind
B2
Abstract

Polycrystalline diamond bodies having an annular region of diamond grains and a core region of diamond grains and methods of making the same are disclosed. In one embodiment, a polycrystalline diamond body includes an annular region of inter-bonded diamond grains having a first characteristic property and a core region of inter-bonded diamond grains bonded to the annular region and having a second characteristic property that differs from the first characteristic property. The annular region decreases in thickness from a perimeter surface of the polycrystalline diamond body towards a centerline axis.

Claims (37)

1. A polycrystalline diamond body, comprising:

a working surface;

an interface surface;

a perimeter surface;

an annular region comprising inter-bonded diamond grains having a first particle size distribution and separated from one another by interstitial regions, at least a portion of the interstitial regions comprising non-catalytic material in a first concentration, the annular region extending away from at least a portion of the working surface and at least a portion of the perimeter surface; and

a core region of inter-bonded diamond grains having a second particle size distribution different from the first particle size distribution and separated from one another by interstitial regions, at least a portion of the interstitial regions comprising non-catalytic material in a second concentration different from the first concentration, the core region being bonded to the annular region and extending away from the interface surface, at least a portion of the core region being positioned radially inwardly from the annular region,

wherein the non-catalytic material does not comprise a hard-phase material introduced to the polycrystalline diamond body from a support substrate or a reaction product formed in the polycrystalline diamond body during a high pressure high temperature process,

wherein the non-catalytic material includes copper, silver, gold, aluminum, silicon, gallium, lead, tin, bismuth, indium, thallium, tellurium, antimony, polonium, and alloys thereof, and

wherein the first concentration of non-catalytic material is from 0.066 to 0.5 wt. % of the polycrystalline diamond body.

2. The polycrystalline diamond body of claim 1 , wherein a median of the first particle size distribution is smaller than a median of the second particle size distribution.

3. The polycrystalline diamond body of claim 1 , wherein the concentration of the non-catalytic material in the core region is greater than the concentration of the non-catalytic material in the annular region.

4. The polycrystalline diamond body of claim 1 , wherein a portion of accessible interstitial regions between the inter-bonded diamond grains positioned proximate to the working surface are free of non-catalytic material and catalyst material.

5. The polycrystalline diamond body of claim 4 , wherein the polycrystalline diamond body is subjected to a leaching process to remove non-catalytic material and catalyst material from the accessible interstitial regions of the polycrystalline diamond body.

6. The polycrystalline diamond body of claim 1 , wherein the annular region decreases in thickness from the perimeter surface towards a centerline axis of the polycrystalline diamond body.

7. The polycrystalline diamond body of claim 6 , wherein the annular region terminates at a position along the working surface that is spaced apart from the centerline axis.

8. The polycrystalline diamond body of claim 7 , wherein an intersection between the annular region and the core region comprises a frustoconical shape.

9. The polycrystalline diamond body of claim 7 , wherein an intersection between the annular region and the core region comprises a concave truncated conical shape.

10. The polycrystalline diamond body of claim 7 , wherein an intersection between the annular region and the core region comprises a convex truncated conical shape.

11. The polycrystalline diamond body of claim 1 , further comprising a substrate that is coupled to the interface surface of the polycrystalline diamond body.

12. The polycrystalline diamond body of claim 11 , wherein the substrate comprises a hard metal carbide comprising a catalyst material.

13. The polycrystalline diamond body of claim 1 , wherein the non-catalytic material includes bismuth and alloys thereof.

14. The polycrystalline diamond body of claim 1 , wherein the first concentration of non-catalytic material is from 0.165 to 0.2 wt. % of the polycrystalline diamond body.

15. The polycrystalline diamond body of claim 1 , wherein the second concentration of non-catalytic material is from 0.066 to 0.5 wt. % of the polycrystalline diamond body.

16. The polycrystalline diamond body of claim 15 , wherein the first concentration of non-catalytic material is from 0.165 to 0.2 wt. % of the polycrystalline diamond body.

17. The polycrystalline diamond body of claim 1 , wherein the first concentration is higher at positions distally from the support substrate as compared to positions proximally to the support substrate.

18. The polycrystalline diamond body of claim 1 , wherein an intersection surface between the core region and the annular region extends a distance evaluated along a centerline axis of the polycrystalline diamond body that is at least 25% of a thickness of the polycrystalline diamond body, as evaluated from the working surface to the interface surface.

19. An earth-boring tool, comprising:

a bit body; and

a polycrystalline diamond compact secured to the bit body, the polycrystalline diamond compact comprising

a working surface,

an interface surface,

a perimeter surface,

an annular region comprising inter-bonded diamond grains having a first particle size distribution and separated from one another by interstitial regions, at least a portion of the interstitial regions comprising non-catalytic material in a first concentration, the annular region extending away from at least a portion of the working surface and at least a portion of the perimeter surface,

a core region of inter-bonded diamond grains having a second particle size distribution different from the first particle size distribution and separated from one another by interstitial regions, at least a portion of the interstitial regions comprising non-catalytic material in a second concentration different from the first concentration, the core region being bonded to the annular region and extending away from the interface surface, at least a portion of the core region being positioned radially inward from the annular region,

wherein the non-catalytic material does not comprise a hard-phase material introduced to the polycrystalline diamond compact from a support substrate or a reaction product formed in the polycrystalline diamond compact during a high pressure high temperature process,

wherein the non-catalytic material in the polycrystalline diamond compact includes copper, silver, gold, aluminum, silicon, gallium, lead, tin, bismuth, indium, thallium, tellurium, antimony, polonium, and alloys thereof, and

wherein the first concentration of non-catalytic material is from 0.066 to 0.5 wt. % of the polycrystalline diamond body.

Assignments (5)
SECURITY INTEREST Recorded Aug 31, 2021
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 057388/0971 →
2L PATENT SECURITY RELEASE AGREEMENT Recorded Aug 31, 2021
From: UBS AG, STAMFORD BRANCH
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 057650/0602 →
1L PATENT SECURITY RELEASE AGREEMENT Recorded Aug 31, 2021
From: UBS AG, STAMFORD BRANCH
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 057651/0040 →
FIRST LIEN PATENT SECURITY AGREEMENT Recorded Sep 4, 2019
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 050272/0415 →
SECOND LIEN PATENT SECURITY AGREEMENT Recorded Sep 4, 2019
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 050272/0472 →