MULTILAYER THIN FILM DEVICE ENCAPSULATION USING SOFT AND PLIABLE LAYER FIRST
A thin film device may include an active device region, where the active device region comprises a selective expansion region. The thin film device may further include a polymer layer disposed adjacent to the active device region and encapsulating the active device region, the polymer layer comprising a plurality of polymer sub-layers. A first polymer sub-layer of the plurality of polymer sub-layers may have a first hardness, while a second polymer sub-layer of the plurality of polymer sub-layers has a second hardness, the second hardness being different from the first hardness.
1 . A thin film device, comprising:
an active device region, the active device region comprising a selective expansion region; and
a polymer layer disposed adjacent to the active device region and encapsulating the active device region, the polymer layer comprising a plurality of polymer sub-layers, wherein a first polymer sub-layer of the plurality of polymer sub-layers has a first hardness, and wherein a second polymer sub-layer of the plurality of polymer sub-layers has a second hardness, the second hardness being different from the first hardness.
2 . The thin film device of claim 1 , wherein the polymer layer comprises a two-layer structure, comprising:
the first polymer sub-layer, the first polymer sub-layer being disposed on the selective expansion region; and
the second polymer sub-layer, the second polymer sub-layer being disposed on the first polymer sub-layer, wherein the first polymer sub-layer is disposed between the second polymer sub-layer and the selective expansion region,
wherein the first hardness is less than the second hardness.
3 . The thin film device of claim 2 , wherein the first polymer sub-layer comprises parylene or silicone.
4 . The thin film device of claim 2 , wherein the second polymer sub-layer comprises KMPR.
5 . The thin film device of claim 1 , wherein the polymer layer comprises a three-layer structure, comprising:
the first polymer sub-layer, the first polymer sub-layer being disposed on the selective expansion region;
the second polymer sub-layer, the second polymer sub-layer being disposed on the first polymer sub-layer, wherein the first polymer sub-layer is disposed between the second polymer sub-layer and the selective expansion region; and
a third polymer sub-layer, the third polymer sub-layer being disposed on the second polymer sub-layer and further comprising a third hardness, wherein the second polymer sub-layer is disposed between the first polymer sub-layer and the third polymer sub-layer,
wherein the second hardness is less than the first hardness and the third hardness.
6 . The thin film device of claim 5 , wherein the first polymer sub-layer and the third polymer sub-layer comprise Kayaku Microchem Photo-Resist (KMPR), and wherein the second polymer sub-layer comprises silicone or parylene.
7 . The thin film device of claim 5 , wherein the first polymer sub-layer and the third polymer sub-layer comprise KMPR, and wherein the second polymer sub-layer comprises silicone or parylene.
8 . The thin film device of claim 1 , wherein the selective expansion region comprises an anode of a thin film battery, the active device region further comprising:
a lithium-containing cathode; and
a solid state electrolyte, the solid state electrolyte being disposed between the lithium-containing cathode and the anode.
9 . The thin film device of claim 1 , wherein the polymer layer is a first polymer layer, the thin film device further comprising:
a first rigid layer, disposed on the first polymer layer;
a second polymer layer, disposed on the first rigid layer; and
a second rigid layer, disposed on the second polymer layer.
10 . The thin film device of claim 9 , wherein the second polymer layer is a uniform polymer layer.
11 . The thin film device of claim 9 , wherein the second polymer layer comprises a second plurality of polymer sub-layers, wherein a first polymer sub-layer of the second plurality of polymer sub-layers has a fourth hardness, and wherein a second polymer sub-layer of the second plurality of polymer sub-layers comprises a fifth hardness, wherein the fourth hardness is different from the fifth hardness.
12 . The thin film device of claim 11 , wherein the second polymer layer comprises a two-layer structure,
the first polymer sub-layer being disposed on first rigid layer; and
the second polymer sub-layer being disposed on the first polymer sub-layer,
wherein the fourth hardness is less than the fifth hardness.
13 . The thin film device of claim 11 , wherein the second polymer layer comprises a three-layer structure, comprising:
the first polymer sub-layer, the first polymer sub-layer being disposed on the first rigid layer;
the second polymer sub-layer, the second polymer sub-layer being disposed on the first polymer sub-layer; and
a third polymer sub-layer, the third polymer sub-layer being disposed on the second polymer sub-layer and further comprising a sixth hardness, wherein the second polymer sub-layer is disposed between the first polymer sub-layer and the third polymer sub-layer,
wherein the fifth hardness is less than the fourth hardness and the sixth hardness.
14 . The thin film device of claim 9 , wherein the first rigid layer comprises a rigid metal layer or a rigid dielectric layer, and wherein the second rigid layer comprises a rigid metal layer or a rigid dielectric layer.
15 . The thin film device of claim 1 , wherein the polymer layer comprises a thickness of 10 μm to 100 μm.
16 . The thin film device of claim 1 , wherein a thickness of at least one of the first polymer sub-layer and the second polymer sub-layer is between 5 μm and 50 μm.
17 . The thin film device of claim 9 , further comprising:
at least one dyad, the at least one dyad disposed on the second rigid layer and comprising:
another polymer layer, disposed on the second rigid layer; and
another rigid layer, disposed on the another polymer layer.
18 . A thin film battery, comprising:
an active device region, the active device region comprising:
a lithium-containing cathode;
a solid state electrolyte, disposed on the lithium-containing cathode; and
an anode disposed on the solid state electrolyte; and
a thin film encapsulant disposed adjacent to the anode and encapsulating at least a portion of the active device region, the thin film encapsulant comprising:
a first polymer layer, the first polymer layer comprising a plurality of polymer sub-layers, wherein a first polymer sub-layer of the plurality of polymer sub-layers has a first hardness, and wherein a second polymer sub-layer of the plurality of polymer sub-layers has a second hardness, the second hardness being different from the first hardness; and
a rigid layer, disposed on the first polymer layer.
19 . A thin film battery, comprising:
a lithium-containing cathode;
a solid state electrolyte, disposed on the lithium-containing cathode;
an anode disposed on the solid state electrolyte, the anode comprising a selective expansion region; and
a thin film encapsulant disposed adjacent to the anode, the thin film encapsulant comprising:
a first polymer layer, the first polymer layer further comprising:
a first polymer sub-layer, disposed on the selective expansion region, the first polymer sub-layer having a first hardness;
a second polymer sub-layer, disposed on the first polymer sub-layer, the second polymer sub-layer having a second hardness, the second hardness being different from the first hardness;
a first rigid layer, disposed on the first polymer layer;
a second polymer layer disposed on the first rigid layer; and
a second rigid layer disposed on the second polymer layer.