IP Library Granted Patent US 10,522,298
Granted Patent B2
US 10,522,298 · App. 15/462,268 · Granted Dec 31, 2019

Methods of manufacturing a hermetically sealed wet electrolytic capacitor and a hermetically sealed wet electrolytic capacitor

Inventors: Alex Eidelman (Beer-Sheva, IL); John Evans (Pownal, VT); Stephen Breithaupt (N. Bennington, VT); Sarah Lastella (Troy, NY); Edward Fairfield (Hopkinton, NH); Ilia Skatkov (Beer-Sheva, IL); Vicki Segel (Beer-Sheva, IL); Pavel Vaisman (Beer-Sheva, IL); Hila Eshel (Beer-Sheva, IL)
Assignee: Vishay Sprague, Inc.
H01G9/10A61N1/3975H01G9/008H01G9/0029H01G9/012H01G9/035H01G9/145
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Quick Facts
Patent No.
US 10,522,298
App. No.
15/462,268
Granted
Dec 31, 2019
Kind
B2
Abstract

Methods of manufacturing a hermetically sealed wet electrolytic capacitor and a hermetically sealed wet electrolytic capacitor are described. A method of manufacturing a wet electrolytic capacitor includes forming a cathode of the capacitor by forming a case comprising a metal substrate, the metal substrate having an alloyed surface, depositing a smooth film comprising palladium and copper as a tacking layer on the alloyed surface of the metal substrate, and depositing a rough, high surface area layer on the tacking layer to achieve a high capacitance cathode. A first terminal is electrically connected to the cathode. An anode is formed. A second terminal is electrically connected to the anode. An electrolytic solution is disposed within the case, and the case is hermetically sealed.

Claims (43)

1. A method of manufacturing a hermetically sealed wet electrolytic capacitor, the method comprising:

forming a cathode of the capacitor by:

forming a case comprising a metal substrate, the metal substrate being formed from a valve metal and having a titanium and palladium alloyed surface,

depositing a smooth film comprising palladium and copper as a tacking layer on the alloyed surface of the metal substrate,

depositing a rough layer on the tacking layer to achieve a high capacitance cathode;

electrically connecting a first terminal to the cathode;

forming an anode;

electrically connecting a second terminal to the anode;

disposing an electrolytic solution within the case; and

hermetically sealing the case.

2. The method of claim 1 , further comprising: positioning an insulator between the cathode and the anode.

3. The method of claim 1 , wherein the metal substrate comprises a titanium alloy.

4. The method of claim 1 , further comprising forming the anode from sodium reduced capacitor grade tantalum powder pressed to a green density of between 5.0 and 7.0 grams/cc and then vacuum sintered between 1450 degrees Celsius and 1650 degrees Celsius.

5. The method of claim 1 , wherein the electrolytic solution has conductivity between 10 and 60 mS/cm.

6. The method of claim 1 , wherein the electrolytic solution comprises water, inorganic acids, an organic acid and an organic solvent.

7. A hermetically sealed wet electrolytic capacitor comprising:

a hermetically sealed capacitor case comprising a multi-layer cathode, the multi-layer cathode comprising:

a metal substrate formed from a valve metal and having a titanium and palladium alloyed surface layer,

a smooth film comprising palladium and copper deposited on the alloyed surface layer as a tacking layer, and

a rough layer deposited on the tacking layer and configured to achieve high capacitance;

an anode disposed in the hermetically sealed capacitor case; and

an electrolytic solution disposed in the hermetically sealed capacitor case.

8. The hermetically sealed wet electrolytic capacitor of claim 7 , further comprising:

an insulator disposed between the cathode and the anode.

9. The hermetically sealed wet electrolytic capacitor of claim 7 , wherein the metal substrate comprises a titanium alloy.

10. The hermetically sealed wet electrolytic capacitor of claim 7 , wherein the anode comprises sodium reduced capacitor grade tantalum powder pressed to a green density of between 5.0 and 7.0 grams/cc and then vacuum sintered between 1450 degrees Celsius and 1650 degrees Celsius.

11. The hermetically sealed wet electrolytic capacitor of claim 7 , wherein the electrolytic solution has conductivity between 10 and 60 mS/cm.

12. The hermetically sealed wet electrolytic capacitor of claim 7 , wherein the electrolytic solution comprises water, inorganic acids, an organic acid and an organic solvent.

13. A method of manufacturing a hermetically sealed wet electrolytic capacitor, the method comprising:

providing a case formed from a valve metal having a titanium and palladium alloyed inner surface;

forming a cathode on the alloyed inner surface of the case, the cathode comprising multiple layers, at least one of the cathode layers comprising a smooth film comprising palladium and copper as a tacking layer deposited on the alloyed inner surface of the case;

disposing an anode within the case,

electrically connecting a first terminal to an anode, the anode being insulated from the cathode;

electrically connecting a second terminal to the cathode;

disposing an electrolytic solution within the case; and

hermetically sealing the case;

wherein the amount of energy delivered by the capacitor is greater than 87 percent of the stored energy of the capacitor.

14. The method of claim 13 , further comprising preparing the electrolytic solution by admixing DI water, phosphoric acid, ethylene glycol and boric acid.

15. The method of claim 13 , wherein the step of forming the cathode comprises depositing a layer on the tacking layer, wherein the layer has a rough surface.

16. The method of claim 13 , further comprising: positioning an insulator between the cathode and the anode.

17. The method of claim 13 , wherein the alloyed inner surface comprises a titanium alloy.

18. The method of claim 13 , further comprising forming the anode from sodium reduced capacitor grade tantalum powder pressed to a green density of between 5.0 and 7.0 grams/cc and then vacuum sintered between 1450 degrees Celsius and 1650 degrees Celsius.

19. The method of claim 13 , wherein the electrolytic solution has conductivity between 10 and 60 mS/cm.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 8, 2017
From: EIDELMAN, ALEX; EVANS, JOHN; BREITHAUPT, STEPHEN; LASTELLA, SARAH; FAIRFIELD, EDWARD; SKATKOV, ILIA; SEGEL, VICKI; VAISMAN, PAVEL; ESHEL, HILA
To: VISHAY SPRAGUE, INC.
Reel/Frame 044072/0282 →
Cited By (1)
US 1,120,880