Composite particles, method of refining and use thereof
Composite particles with lower mean particle size and smaller size distribution are obtained through refining treatments. The refined composite particles, such as ceria coated silica particles are used in Chemical Mechanical Planarization (CMP) compositions to offer higher removal rate; very low within wafer (WWNU) for removal rate, low dishing and low defects for polishing oxide films.
1. A chemical mechanical planarization (CMP) polishing composition, comprising
0.01 wt. % to 20 wt. % of composite particles comprise single ceria coated silica particles and aggregated ceria coated silica particles; wherein >0 and ≤7 wt. % of the composite particles are aggregated ceria coated silica particles comprising at least 3 single ceria coated silica particles;
water;
pH of the CMP composition ranges from about 2 to about 12; and
optionally
0.0001 wt % to about 5 wt % of a pH adjusting agent selected from the group consisting of sodium hydroxide, cesium hydroxide, potassium hydroxide, cesium hydroxide, ammonium hydroxide, quaternary organic ammonium hydroxide, and combinations thereof;
0.000001 wt % to 0.5 wt % of a chemical additive elected from the group consisting of a compound having a functional group selected from the group consisting of organic carboxylic acids, amino acids, amidocarboxylic acids, N-acylamino acids, and their salts thereof; organic sulfonic acids and salts thereof; organic phosphonic acids and salts thereof; polymeric carboxylic acids and salts thereof; polymeric sulfonic acids and salts thereof; polymeric phosphonic acids and salts thereof; arylamines, aminoalcohols, aliphatic amines, heterocyclic amines, hydroxamic acids, substituted phenols, sulfonamides, thiols, polyols having hydroxyl groups, and combinations thereof;
0.0001 wt % to about 10 wt % of a surfactant selected from the group consisting of a). Non-ionic surface wetting agents; b). Anionic surface wetting agents; c). Cationic surface wetting agents; d). ampholytic surface wetting agents; and combinations thereof;
0.001 wt % to 5 wt % of water soluble polymer selected from the group consisting of anionic polymer, cationic polymer, non-ionic polymer, and combinations thereof;
0.01 wt % to 3.0 wt % of chelators;
corrosion inhibitor;
oxidizer; and
biological growth inhibitor.
2. The chemical mechanical planarization (CMP) polishing composition of claim 1 , wherein the CMP polishing composition having pH from 3.5 to 10.
3. The chemical mechanical planarization (CMP) polishing composition of claim 1 ,
wherein the composite particles have a feature selected from the group consisting of
(a) 99 wt % of the composite particles have particle size less than 250 nm;
(b) the composite particles have mean particle size less than 150 nm; and the mean particle size is the weighted average of particle diameters; and
(c) combination thereof.
4. The chemical mechanical planarization (CMP) polishing composition of claim 1 , wherein the composite particles have a feature selected from the group consisting of
(a) >0 and ≤2 wt. % of the composite particles are aggregated ceria coated silica particles comprising at least 3 single ceria coated silica particles;
(b) 99 wt % of the composite particles have particle size less than 200 nm;
(c) the composite particles have mean particle size less than 125 nm or 110 nm; and
(d) combinations thereof.
5. The chemical mechanical planarization (CMP) polishing composition of claim 1 ,
wherein the CMP polishing composition comprising ceria coated silica particles, ammonium polyacrylate (molecular weight 15000-18000); the pH between 4 and 7;
and >0 and ≤7 wt. % of the composite particles are aggregated ceria coated silica particles comprising at least 3 single ceria coated silica particles.
6. A polishing method for chemical mechanical planarization (CMP) of a semiconductor substrate comprising at least one surface having at least one oxide layer, comprising the steps of:
a) contacting the at least one oxide layer with a polishing pad;
b) delivering a CMP polishing composition to the at least one surface, and
c) polishing the at least one oxide layer with the CMP polishing composition;
wherein the CMP polishing composition comprises
0.01 wt. % to 20 wt. % of composite particles comprise single ceria coated silica particles and aggregated ceria coated silica particles; wherein >0 and ≤7 wt. % of the composite particles are aggregated ceria coated silica particles comprising at least 3 single ceria coated silica particles;
water;
pH of the CMP composition ranges from about 2 to about 12; and
optionally
0.0001 wt % to about 5 wt % of a pH adjusting agent selected from the group consisting of sodium hydroxide, cesium hydroxide, potassium hydroxide, cesium hydroxide, ammonium hydroxide, quaternary organic ammonium hydroxide, and combinations thereof;
0.000001 wt % to 0.5 wt % of a chemical additive elected from the group consisting of a compound having a functional group selected from the group consisting of organic carboxylic acids, amino acids, amidocarboxylic acids, N-acylamino acids, and their salts thereof; organic sulfonic acids and salts thereof; organic phosphonic acids and salts thereof; polymeric carboxylic acids and salts thereof; polymeric sulfonic acids and salts thereof; polymeric phosphonic acids and salts thereof; arylamines, aminoalcohols, aliphatic amines, heterocyclic amines, hydroxamic acids, substituted phenols, sulfonamides, thiols, polyols having hydroxyl groups, and combinations thereof;
0.0001 wt % to about 10 wt % of a surfactant selected from the group consisting of a Non-ionic surface wetting agents; b). Anionic surface wetting agents; c). Cationic surface wetting agents; d). ampholytic surface wetting agents; and mixtures thereof;
0.001 wt % to 5 wt % of water soluble polymer comprising anionic polymer, cationic polymer, non-ionic polymer, and combinations thereof;
0.01 wt % to 3.0 wt % of chelators;
corrosion inhibitor;
oxidizer; and
biological growth inhibitor.
7. The polishing method of claim 6 , wherein the composite particles have a feature selected from the group consisting of
(a) 99 wt % of the composite particles have particle size less than 250 nm;
(b) the composite particles have mean particle size less than 150 nm; and the mean particle size is the weighted average of particle diameters; and
(c) combination thereof.
8. The polishing method of claim 6 , wherein the composite particles have a feature selected from the group consisting of
(a) >0 and ≤2 wt. % of the composite particles are aggregated ceria coated silica particles comprising at least 3 single ceria coated silica particles;
(b) 99 wt % of the composite particles have particle size less than 200 nm;
(c) the composite particles have mean particle size less than 125 nm or 110 nm; and
(d) combinations thereof.
9. The polishing method of claim 6 , wherein the CMP polishing composition comprising ceria coated silica particles, ammonium polyacrylate (molecular weight 15000-18000); and the pH between 4 and 7; >0 and ≤7 wt. % of the composite particles are aggregated ceria coated silica particles comprising at least 3 single ceria coated silica particles; 99 wt % of the composite particles have particle size less than 200 nm; and the composite particles have mean particle size less than 125 nm.
10. The polishing method of claim 6 , wherein the semiconductor substrate further comprising a nitride layer and removal selectivity of the at least one oxide layer over the nitride layer is more than 10.
11. The polishing method of claim 10 , wherein the at least one oxide layer is TEOS and the semiconductor substrate further comprising a silicon nitride layer and removal selectivity of TEOS over silicon nitride layer is more than 20.