IP Library Granted Patent US 10,194,554
Granted Patent B2
US 10,194,554 · App. 15/464,317 · Granted Jan 29, 2019

Drive assembly, chassis assembly, and server device

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Quick Facts
Patent No.
US 10,194,554
App. No.
15/464,317
Granted
Jan 29, 2019
Kind
B2
Abstract

Embodiments of the present disclosure relate to a drive assembly, a chassis assembly, and a server device. The drive assembly comprises: a drive having a first end extending in a direction perpendicular to a length direction of the drive and a first side extending in a direction perpendicular to a width direction of the drive, wherein the drive interface is provided at the first end of the drive; and an adapter having first and second interfaces that are electrically connected with each other, wherein the first interface is plugged into the drive interface, and the second interface is adjacent to the first side of the drive so as to be electrically coupled to other components.

Claims (21)

1. A drive assembly, comprising:

a drive having a first end extending in a direction perpendicular to a length direction of the drive and a first side extending in a direction perpendicular to a width direction of the drive, wherein a drive interface is disposed at the first end of the drive; and

an adapter having first and second interfaces that are electrically connected with each other, wherein the first interface is plugged into the drive interface, and the second interface is adjacent to the first side of the drive so as to be electrically coupled to other components, wherein the second interface is perpendicular to the first interface protruding from the adapter such that the second interface is a single plane with the adapter.

2. The drive assembly according to claim 1 , wherein the adapter includes a printed circuit board, the first interface being disposed on a surface of the printed circuit board, and the second interface being disposed at an end of the printed circuit board.

3. The drive assembly according to claim 2 , wherein the other end of the printed circuit board opposite to the end of the printed circuit board is aligned with a second side of the drive, the second side of the drive being opposite to the first side of the drive.

4. The drive assembly according to claim 2 , wherein a width of the printed circuit board is equal to or less than a thickness of the drive.

5. The drive assembly according to claim 2 , wherein the second interface is a connecting finger.

6. The drive assembly according to claim 1 , further comprising a holder configured to hold the drive and the adapter.

7. The drive assembly according to claim 1 , wherein the holder is a rectangular frame.

8. The drive assembly according to claim 7 , wherein the rectangular frame is configured to switch between an open state and a closed state so as to mount the drive and the adapter.

9. The drive assembly according to claim 8 , wherein the rectangular frame includes a locking element that switches the rectangular frame from the open state to the closed state.

10. The drive assembly according to claim 7 , wherein an opening is provided at a position on the rectangular frame that corresponds to the second interface and an end of the second interface is disposed in the opening.

11. The drive assembly according to claim 7 , wherein a positioning hole is disposed on the drive and a corresponding positioning protrusion is disposed on the rectangular frame.

12. The drive assembly according to claim 1 , wherein the second interface is configured to be plugged into a bottom plane at a bottom of a chassis.

13. A chassis assembly, comprising:

a chassis;

a bottom plane disposed at a bottom of the chassis, wherein a plurality of slots are arranged on the bottom plane; and

at least one drive assembly comprising:

a drive having a first end extending in a direction perpendicular to a length direction of the drive and a first side extending in a direction perpendicular to a width direction of the drive, wherein a drive interface is disposed at the first end of the drive; and

an adapter having first and second interfaces that are electrically connected with each other, wherein the first interface is plugged into the drive interface, and the second interface is adjacent to the first side of the drive so as to be electrically coupled to other components, wherein the second interface is perpendicular to the first interface protruding from the adapter such that the second interface is a single plane with the adapter;

wherein the second interface of each of the at least one drive assembly is plugged into a corresponding slot.

Assignments (8)
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (053546/0001) Recorded Jun 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL MARKETING L.P. (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO CREDANT TECHNOLOGIES, INC.); DELL INTERNATIONAL L.L.C.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO FORCE10 NETWORKS, INC. AND WYSE TECHNOLOGY L.L.C.); EMC IP HOLDING COMPANY LLC
Reel/Frame 071642/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS PREVIOUSLY RECORDED AT REEL/FRAME (042769/0001) Recorded Apr 26, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS NOTES COLLATERAL AGENT
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC (ON BEHALF OF ITSELF AND AS SUCCESSOR-IN-INTEREST TO MOZY, INC.); DELL MARKETING CORPORATION (SUCCESSOR-IN-INTEREST TO WYSE TECHNOLOGY L.L.C.)
Reel/Frame 059803/0802 →
RELEASE OF SECURITY INTEREST AT REEL 042768 FRAME 0585 Recorded Nov 2, 2021
From: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH
To: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; MOZY, INC.; WYSE TECHNOLOGY L.L.C.
Reel/Frame 058297/0536 →
SECURITY AGREEMENT Recorded Apr 22, 2020
From: CREDANT TECHNOLOGIES INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053546/0001 →
SECURITY AGREEMENT Recorded Mar 21, 2019
From: CREDANT TECHNOLOGIES, INC.; DELL INTERNATIONAL L.L.C.; DELL MARKETING L.P.; DELL PRODUCTS L.P.; DELL USA L.P.; EMC CORPORATION; FORCE10 NETWORKS, INC.; WYSE TECHNOLOGY L.L.C.; EMC IP HOLDING COMPANY LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 049452/0223 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 16, 2018
From: ZHOU, YUJIE; WU, HENDRY XIAOPING; ZHAI, HAIFANG; DONG, DAVID WEI; LIU, AIQIN
To: EMC IP HOLDING COMPANY LLC
Reel/Frame 044624/0783 →
PATENT SECURITY INTEREST (CREDIT) Recorded Jun 12, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; MOZY, INC.; WYSE TECHNOLOGY L.L.C.
To: CREDIT SUISSE AG, CAYMAN ISLANDS BRANCH, AS COLLATERAL AGENT
Reel/Frame 042768/0585 →
PATENT SECURITY INTEREST (NOTES) Recorded Jun 12, 2017
From: DELL PRODUCTS L.P.; EMC CORPORATION; EMC IP HOLDING COMPANY LLC; MOZY, INC.; WYSE TECHNOLOGY L.L.C.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 042769/0001 →